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HMC980

Analog Devices

HMC980 by Analog Devices

Analog Devices' HMC980 is a telecom IC with 38 terminals, operating b/w -55 °C to 85°C. It has a rectangular shape, surface mountable, and uncased chip package style. With a nominal voltage of 12V, it's ideal for telecom circuit applications requiring precise temperature control in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,160 parts In-Stock

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Digiode

USA . 67 parts In-Stock

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67

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Distributors (Availability)

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AZTECH Wire

Italy . 752 parts In-Stock

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$8.133

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752

$8.133

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Parana Technologies

USA . 585 parts In-Stock

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$9.895

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$9.203

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585

$9.895

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$9.203

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IDEA Electronic Components Group

UK . 2,320 parts In-Stock

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$10.640

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$10.108

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$10.640

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$10.108

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

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$12.496

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$12.371

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$11.871

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$12.496

$12.371

$11.871

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DigiPath Technology Company

USA . 531 parts In-Stock

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$16.598

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$15.934

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$15.934

531

$16.598

$15.934

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$15.934

Vigor

Singapore . 438 parts In-Stock

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$49.590

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438

$49.590

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Component Stockers USA

USA . 304 parts In-Stock

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$99.990

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304

$99.990

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Ampacity Inc.

Singapore . 422 parts In-Stock

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$389.000

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One Stop Electronics

USA . 1,127 parts In-Stock

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$540.000

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1,127

$540.000

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Semicontronic

India . 317 parts In-Stock

1+ parts

$641.000

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$624.975

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$621.770

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317

$641.000

$624.975

$621.770

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Microchip USA

USA . 1,866 parts In-Stock

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Corphita

USA . 875 parts In-Stock

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875

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Overview

Elevate your telecom interface systems with the HMC980 from Analog Devices. This high-quality IC offers unparalleled performance and reliability, thanks to its leading manufacturer. Designed for a wide range of applications, this versatile chip is a game-changer in the industry. Unlock seamless connectivity and enhanced functionality with the HMC980, delivering exceptional value and benefits to customers seeking top-tier telecom solutions. Elevate your projects with Analog Devices' cutting-edge technology today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient manufacturing processes, making this product suitable for mass production.

Package Shape: RECTANGULAR

Rectangular shape can help optimize space utilization on a PCB, ensuring efficient layout design.

No. of Terminals: 38

Having 38 terminals provides flexibility for connecting various components, enhancing functionality and compatibility.

Package Style (Meter): UNCASED CHIP

Uncased chip design offers a compact and lightweight solution, ideal for applications where space and weight are critical factors.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding operating conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures reliable performance in both extreme cold and hot environments.

Terminal Position: UPPER

Upper terminal position can facilitate easier PCB layout and routing, simplifying assembly and installation processes.

Width: 1.4 mm

Narrow width allows for compact PCB design and space-saving integration, making it suitable for applications with limited space constraints.

Length: 2.26 mm

Compact length helps in optimizing PCB real estate, contributing to overall system miniaturization and efficiency.

Terminal Form: NO LEAD

No lead terminals reduce the risk of solder joint failures and can improve signal integrity, enhancing product reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product offers optimized performance and reliability in telecommunications applications.

Nominal Supply Voltage: 12 V

Operating at a 12V nominal supply voltage provides compatibility with standard power sources commonly used in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs HMC980 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N38

Length:

2.26 mm

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.4 mm

Trade Compliance

HMC980 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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