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HMC914LP4E

Analog Devices

HMC914LP4E by Analog Devices

HMC914LP4E by Analog Devices is a 24-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style and matte tin terminal finish, suitable for industrial telecom circuit applications requiring a compact form factor and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,543 parts In-Stock

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6,543

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Chip Stock

USA . 2,600 parts In-Stock

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2,600

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Digiode

USA . 380 parts In-Stock

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380

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Distributors (Availability)

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AZTECH Wire

Italy . 858 parts In-Stock

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$9.559

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858

$9.559

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Parana Technologies

USA . 1,213 parts In-Stock

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$13.751

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$12.788

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1,213

$13.751

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$12.788

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IDEA Electronic Components Group

UK . 193 parts In-Stock

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$14.786

100+ parts

$14.047

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$14.047

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193

$14.786

$14.047

$14.047

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Vigor

Singapore . 283 parts In-Stock

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$19.970

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283

$19.970

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DigiPath Technology Company

USA . 1,309 parts In-Stock

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$23.066

100+ parts

$22.144

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$22.144

1,309

$23.066

$22.144

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$22.144

Component Stockers USA

USA . 500 parts In-Stock

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$99.990

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500

$99.990

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Semicontronic

India . 558 parts In-Stock

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$167.000

100+ parts

$162.825

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$161.990

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558

$167.000

$162.825

$161.990

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One Stop Electronics

USA . 1,020 parts In-Stock

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$281.000

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$281.000

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QUARKTWIN TECHNOLOGY LTD

USA . 8,563 parts In-Stock

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Microchip USA

USA . 4,418 parts In-Stock

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Corphita

USA . 532 parts In-Stock

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532

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Authorized Procurement Solutions

USA . 150 parts In-Stock

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150

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Overview

Unlock the potential of your telecom applications with the HMC914LP4E by Analog Devices. Manufactured with precision and expertise, this IC offers unmatched quality and reliability. From its compact square package to its industrial-grade temperature range, this product is designed to exceed expectations. Ideal for a wide range of telecom functions, this versatile chip carrier delivers superior performance and efficiency. Trust Analog Devices to provide you with the cutting-edge technology you need to stay ahead in today's competitive market. Elevate your projects with the HMC914LP4E and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and labor costs.

Power Supplies (V): 3.3

Operating at 3.3V, this product is optimized for low power consumption and efficient performance.

No. of Terminals: 24

With 24 terminals, this product offers a wide range of connection options for versatility in telecom applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, ensuring reliable performance even in challenging environments.

Terminal Finish: MATTE TIN

Matte Tin finish provides corrosion resistance and ensures good electrical conductivity for stable connections.

Width: 4 mm

Compact width allows for space-saving installation in telecom devices and equipment.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly processes, ensuring product integrity.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes this product suitable for rugged and demanding telecom environments.

Terminal Form: NO LEAD

No lead terminals are environmentally friendly and comply with RoHS regulations for safer electronic products.

Technical Specifications

Other Function Telecom Interface ICs HMC914LP4E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

HMC914LP4E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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