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HMC917LP3ETR

Analog Devices

HMC917LP3ETR by Analog Devices

HMC917LP3ETR by Analog Devices is a telecom interface IC with 16 terminals in a square chip carrier package. It operates b/w -40 °C to 85°C, suitable for industrial use. With a nominal voltage of 5V, it is designed for telecom circuit applications.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 4,306 parts In-Stock

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Digiode

USA . 592 parts In-Stock

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AZTECH Wire

Italy . 626 parts In-Stock

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$8.157

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Parana Technologies

USA . 4,076 parts In-Stock

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$16.534

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$15.377

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IDEA Electronic Components Group

UK . 714 parts In-Stock

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$17.779

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$16.890

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714

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DigiPath Technology Company

USA . 4,076 parts In-Stock

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$27.735

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$26.626

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$26.626

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One Stop Electronics

USA . 1,583 parts In-Stock

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$200.000

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Semicontronic

India . 390 parts In-Stock

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$659.000

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$642.525

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$639.230

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QUARKTWIN TECHNOLOGY LTD

USA . 12,645 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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Corphita

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Overview

Elevate your telecom interface solutions with the HMC917LP3ETR by Analog Devices. As a trusted manufacturer in the industry, Analog Devices delivers exceptional quality and reliability in every product they create. The HMC917LP3ETR is a versatile chip carrier with a very thin profile, making it ideal for various telecom applications. With a wide temperature range and no lead terminal form, this IC offers unmatched performance and durability. Experience seamless integration, superior functionality, and unparalleled value with the HMC917LP3ETR. Elevate your telecom projects to new heights today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during production.

Package Shape: SQUARE

The square package shape allows for easier handling and placement during assembly, improving overall manufacturing efficiency.

No. of Terminals: 16

Having 16 terminals provides versatility and flexibility in connecting the IC to other components, making it suitable for a variety of telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures effective heat dissipation and space-saving design for optimal performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this IC suitable for use in extreme cold environments.

Terminal Position: QUAD

The quad terminal position provides efficient connectivity and compatibility with other quad-compatible devices, enhancing system integration.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this IC can be easily accommodated in compact telecom equipment without sacrificing performance.

Width: 3 mm

The narrow width of 3 mm enables space-saving design and allows for high-density integration in telecom systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable soldering connections during the manufacturing process.

Length: 3 mm

The compact length of 3 mm further enhances the space-saving design of this IC, making it ideal for densely packed telecom applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this IC can operate reliably in harsh industrial environments with varying temperature conditions.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking and provides better mechanical stability for the IC.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this IC offers optimized performance and functionality for telecom applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources used in telecom equipment, simplifying system integration.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5 mm allows for high-density packaging and efficient signal routing, enabling compact telecom system designs.

Technical Specifications

Other Function Telecom Interface ICs HMC917LP3ETR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC917LP3ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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