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ADSP-21591KBPZ8

Analog Devices

ADSP-21591KBPZ8 by Analog Devices

Analog Devices' ADSP-21591KBPZ8 is a DSP with 30MHz clock, 655360 RAM words, and 1.05V max supply voltage. Ideal for applications requiring high-speed signal processing in compact spaces due to its small form factor and integrated cache.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,357 parts In-Stock

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Digiode

USA . 734 parts In-Stock

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734

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AZTECH Wire

Italy . 638 parts In-Stock

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$16.329

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$16.329

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Ampacity Inc.

Singapore . 873 parts In-Stock

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$22.000

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One Stop Electronics

USA . 1,587 parts In-Stock

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Semicontronic

India . 1,367 parts In-Stock

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$35.000

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$34.125

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$33.950

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Parana Technologies

USA . 1,511 parts In-Stock

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$70.622

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$65.679

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IDEA Electronic Components Group

UK . 1,709 parts In-Stock

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$75.938

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$72.141

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DigiPath Technology Company

USA . 2,393 parts In-Stock

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$118.463

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$113.725

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Corphita

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Northwest PG Solutions

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Microchip USA

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Native Components

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Overview

Analog Devices presents the ADSP-21591KBPZ8, a high-quality Digital Signal Processor (DSP) that offers unparalleled performance and versatility. With cutting-edge technology and a reputation for excellence, Analog Devices delivers a product that meets the demands of various applications. From consumer electronics to industrial automation, this DSP provides value by enhancing efficiency and boosting overall system performance. Experience the benefits of integrated cache, low power mode, and advanced features that set this product apart from the rest. Upgrade your projects with the ADSP-21591KBPZ8 and unlock endless possibilities in signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, making it suitable for various applications.

Integrated Cache: YES

The integrated cache helps in faster data access and processing, enhancing the overall performance of the DSP.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into different electronic devices.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05V ensures efficient power consumption and operation of the DSP.

On Chip Data RAM Width: 8

A wider data RAM width of 8 helps in handling and processing larger amounts of data efficiently.

Package Shape: SQUARE

The square package shape enables easy mounting and placement within electronic systems.

No. of Terminals: 400

With 400 terminals, this DSP can easily interface with multiple external devices and components.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact form factor and efficient layout for the DSP.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95V ensures compatibility with various power sources and energy-efficient operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the DSP to function reliably in harsh environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures the DSP’s performance is maintained even in cold conditions.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections with other components.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm allows for compact designs and space-saving layouts.

RAM Words: 655360

The large RAM capacity of 655360 words enables the DSP to store and process extensive data sets efficiently.

Width: 17 mm

With a width of 17mm, this DSP can fit into various electronic systems and devices with ease.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during manufacturing and operation.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency of 30MHz enables fast data processing and real-time operation of the DSP.

Internal Bus Architecture: MULTIPLE

Multiple internal buses enable parallel data processing, enhancing the overall performance and efficiency of the DSP.

Length: 17 mm

The length of 17mm contributes to the compact size and versatile placement options for this DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

A versatile peripheral IC type allows for enhanced connectivity and functionality with various digital signal processing applications.

No. of Timers: 16

With 16 timers, this DSP can manage and coordinate time-sensitive operations and tasks effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this DSP an energy-efficient and reliable choice.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, essential for stable operation and data transfer.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V ensures stable and consistent power delivery for optimal DSP performance.

No. of Serial I/Os: 6

With 6 serial I/Os, this DSP can communicate and exchange data with multiple external devices simultaneously.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the DSP’s firmware, enhancing its flexibility and functionality.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this DSP offers precise and compact terminal connections for efficient signal transmission.

Format: FLOATING POINT

The floating-point format enables high-precision mathematical calculations and processing, crucial for advanced signal processing applications.

Low Power Mode: YES

The low power mode feature allows the DSP to reduce power consumption during idle or low-load scenarios, improving overall energy efficiency.

Barrel Shifter: YES

The barrel shifter functionality enhances data manipulation and processing capabilities, enabling faster and more efficient operations.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 enables the storage and execution of complex programs and algorithms, enhancing the DSP’s versatility and performance.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21591KBPZ8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

1MB Large on-chip Level 2 (L2) SRAM Available

Address Bus Width:

0

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B400

Length:

17 mm

Low Power Mode:

YES

No. of Serial I/Os:

6

No. of Terminals:

400

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

655360

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Trade Compliance

ADSP-21591KBPZ8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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