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ADSP-21261SKBCZ150

Analog Devices

ADSP-21261SKBCZ150 by Analog Devices

Analog Devices' ADSP-21261SKBCZ150 is a 32-bit DSP with 16-bit address and data bus width, operating at up to 50 MHz. Ideal for digital signal processing applications, it features a low-profile grid array package with 136 terminals and operates b/w 0 °C to 70°C temperature range.

Median Price

$17.745

Lifecycle Status

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1k+

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Arrow

USA . 19 parts In-Stock

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$17.230

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$14.020

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Verical

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Analog Devices Inc

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DigiKey

USA . 20 parts In-Stock

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$20.740

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$14.878

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$13.841

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Freelance Electronics

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Vyrian

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Digiode

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Chip Stock

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Sensible Micro Corp

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Semicontronic

India . 44 parts In-Stock

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$10.570

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$10.306

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$10.253

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Vigor

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Corohmni

South Africa . 420 parts In-Stock

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Parana Technologies

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IDEA Electronic Components Group

UK . 609 parts In-Stock

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DigiPath Technology Company

USA . 2,492 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Native Components

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Corphita

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Northwest PG Solutions

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Overview

Unlock the power of cutting-edge technology with the Analog Devices ADSP-21261SKBCZ150 Digital Signal Processor! Manufactured by industry leader Analog Devices, this DSP offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides exceptional value and benefits to customers looking for top-of-the-line processing capabilities. Upgrade your projects with the ADSP-21261SKBCZ150 and experience the advantage of high-quality signal processing that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material provides durability and insulation, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation and prevents damage to the DSP.

Address Bus Width: 16

A wider address bus width allows for efficient data transfer and processing within the DSP.

Package Shape: SQUARE

Square package shape enables easy integration and placement within electronic systems.

Bit Size: 32

A larger bit size of 32 enhances the processing capabilities and accuracy of the DSP.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with different power sources.

No. of Terminals: 136

A higher number of terminals allows for more connections and functionality within the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch offers space-saving and high-density integration capabilities.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the DSP can function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures the DSP's functionality in cold environments.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position enables easier PCB mounting and integration.

Maximum Seated Height: 1.7 mm

Low maximum seated height allows for slim and compact device design.

RAM Words: 49152

Large RAM capacity of 49152 words enables storage and processing of extensive data.

Width: 12 mm

Compact width of 12 mm facilitates space-efficient placement and mounting of the DSP.

Boundary Scan: YES

Boundary scan support allows for efficient testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 16

A wider external data bus width of 16 enhances data transfer speeds and processing efficiency.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency of 50 MHz enables fast data processing and real-time signal handling.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures proper soldering and assembly of the DSP onto PCBs.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing capabilities within the DSP.

Length: 12 mm

Compact length of 12 mm allows for space-efficient design and integration within electronic systems.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges for commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances the DSP's compatibility and functionality with different devices.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for efficient processing and performance.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy integration onto PCBs.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2 V ensures consistent and reliable operation of the DSP.

Terminal Pitch: 0.8 mm

Small terminal pitch of 0.8 mm enables high-density mounting and space-saving design.

Format: FLOATING POINT

Floating-point format enhances the DSP's ability to perform complex mathematical operations with high precision.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures proper handling and storage of the DSP to prevent moisture-related damage.

Barrel Shifter: YES

Presence of a barrel shifter allows for efficient and speedy bit manipulation operations within the DSP.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21261SKBCZ150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B136

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

136

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA136,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

49152

Maximum Seated Height:

1.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-21261SKBCZ150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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