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AS7C31026B-12JIN

Alliance Memory

AS7C31026B-12JIN by Alliance Memory

Alliance Memory's AS7C31026B-12JIN is a 64Kx16 SRAM with 12ns access time, operating at 3.3V. Ideal for industrial applications, it offers parallel interface and small outline package for compact designs. With a temperature range of -40 to 85°C, this CMOS technology memory chip suits various embedded systems.

Median Price

$2.790

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.790

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10

$2.790

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VNN

France . 1,866 parts In-Stock

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Vyrian

USA . 1,583 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$2.629

100+ parts

$2.392

1k+ parts

$2.156

10k+ parts

-

100

$2.629

$2.392

$2.156

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.790

100+ parts

$2.734

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100

$2.790

$2.734

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AZTECH Wire

Italy . 269 parts In-Stock

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$16.160

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269

$16.160

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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100+ parts

$4.869

1k+ parts

$4.509

10k+ parts

$4.509

900

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$4.869

$4.509

$4.509

Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of reliable memory solutions with the AS7C31026B-12JIN from Alliance Memory. As a leading manufacturer in the industry, Alliance Memory ensures top-notch quality and performance in their SRAM products. Perfect for a wide range of applications, this memory module offers seamless integration and optimal efficiency. Experience peace of mind knowing that your data is secure and easily accessible with the AS7C31026B-12JIN. Upgrade your systems today and elevate your business to new heights with Alliance Memory.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment within electronic devices, optimizing space utilization.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode ensures fast and efficient data transfer, making this product suitable for high-speed applications.

Nominal Supply Voltage: 3.3V

The 3.3V nominal supply voltage offers efficient power consumption while providing reliable performance in a variety of operating conditions.

No. of Terminals: 44

With 44 terminals, this product allows for versatile connectivity options, accommodating different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact design integration, making this product suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand harsh environmental conditions, ensuring long-term reliability.

Organization: 64KX16

The 64KX16 organization provides ample memory capacity and efficient data storage capabilities for optimal performance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments, making this product versatile and durable.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connectivity, allowing for easy integration into various electronic systems.

Technical Specifications

SRAM AS7C31026B-12JIN attributes and parameters. Explore more SRAM devices from Alliance Memory

Specs

Maximum Access Time:

12 ns

JESD-30 Code:

R-PDSO-J44

JESD-609 Code:

e3/e6

Length:

28.575 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Maximum Seated Height:

3.7592 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

AS7C31026B-12JIN Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Alliance Memory

Alliance Memory is a worldwide fabless manufacturer of legacy and new technology memory products that are pin for pin drop-in replacements for SRAM, DRAM, and NOR FLASH ICs from Micron, Samsung, ISSI, Cypress, Nanya, Hynix and others. Our product portfolio includes a full range of 3.3V and 5V Asynchronous SRAMs used with mainstream digital signal processors (DSPs) and microcontrollers; and synchronous SRAMs, low-power SRAMs, Pseudo SRAMs, 3.3V synchronous DRAMs (SDR), mobile DDRs, 2.5V single (DDR1), 1.8V double (DDR2), and 1.5V and 1.35V triple rate (DDR3) 1.2V quadruple rate(DDR4) synchronous DRAMs, along with 5V Parallel NOR Flash devices. A high wafer die investment means we can minimize or eliminate die shrinks while maintaining stable pricing. Our goal is to establish long-term relationships with customers and to provide long-term support for the parts we manufacture. We deliver most of our SRAM, DRAM, and FLASH products direct from stock, with inventory held in the U.S., Shanghai and Taiwan. Our competitive pricing, quick sample turnaround, and world-class customer service and support have made Alliance Memory a trusted resource for a growing range of must-have memory ICs for the communications, computing, embedded, IoT, industrial, and consumer markets. Alliance Memory, Inc. is a privately held company with headquarters in Kirkland, Washington.

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