Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Insulated Gate Bipolar Transistors (IGBT) are electronic devices used in power electronics to control and switch high voltage and high current levels. They are commonly used in applications such as motor drives, power supplies, and welding equipment.The IGBT is a three-terminal device that combines the high-speed switching capability of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) with the low conduction losses of a bipolar transistor. The IGBT consists of a p-type and n-type semiconductor material, which are sandwiched between two electrodes, and an insulated gate electrode.The IGBT is operated by applying a voltage to the gate electrode, which creates a conductive channel between the p-type and n-type material, allowing current to flow through the device. The IGBT is turned off by reducing the gate voltage, which reduces the conductivity of the channel and stops the flow of current.IGBTs are designed to handle high voltage and high current levels, and have a low on-resistance and high switching speed. They are typically used in applications that require efficient and precise control of power, such as motor drives and power supplies.IGBTs are subject to various standards and regulations, such as UL (Underwriters Laboratories) and CE (Conformité Européenne), to ensure their safety and performance. Proper selection and use of IGBTs are critical to ensure reliable and efficient operation of power electronics systems. IGBTs are often used in conjunction with other components, such as diodes and capacitors, to form complete power electronics circuits.
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FS300R12OE4BOSA1
Infineon Technologies
N-CHANNEL; Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 1650 W; Maximum Collector Current (IC): 460 A; Minimum Operating Temperature: -40 Cel;
ISOLATED
460 A
1200 V
3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
6.4 V
20 V
R-XUFM-X29
6
29
150 Cel
-40 Cel
UNSPECIFIED
RECTANGULAR
FLANGE MOUNT
NOT SPECIFIED
N-CHANNEL
1650 W
UL APPROVED
NO
UPPER
POWER CONTROL
SILICON
650 ns
280 ns
2.1 V
FS300R17KE3BOSA1
N-CHANNEL; Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Collector Current (IC): 375 A; JESD-30 Code: R-XUFM-X29; Maximum Operating Temperature: 150 Cel;
375 A
1700 V
Not Qualified
1300 ns
384 ns
FS300R17KE4BOSA1
N-CHANNEL; Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Collector Current (IC): 375 A; Terminal Form: UNSPECIFIED; Transistor Application: POWER CONTROL;
175 Cel
1520 ns
405 ns
FS300R17OE4BOSA1
N-CHANNEL; Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: YES; Maximum Power Dissipation (Abs): 1850 W; Maximum Collector Current (IC): 450 A; Minimum Operating Temperature: -40 Cel;
450 A
3 BANKS, SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR
1850 W
YES
910 ns
385 ns
2.3 V
FS30R06W1E3BOMA1
FS30R06W1E3BOMA1 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements, max. collector current of 45A, and turn off time of 355ns. It is used for power control applications, featuring a max operating temp. of 175°C and max. collector-emitter voltage of 600V in a rectangular package style with flange mount.
45 A
600 V
COMPLEX
R-XUFM-X15
15
355 ns
52 ns
FS35R12KT3BOSA1
N-CHANNEL; Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Collector Current (IC): 55 A; Package Body Material: UNSPECIFIED; No. of Elements: 6;
55 A
BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
R-XUFM-X28
28
610 ns
140 ns
FS35R12W1T4BOMA1
N-CHANNEL; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): 65 A; No. of Elements: 6; Case Connection: ISOLATED;
65 A
520 ns
57 ns
FS450R12KE3BOSA1
FS450R12KE3BOSA1 by Infineon is an N-CHANNEL IGBT with 6 elements, 1200V max voltage, and 600A max current. It has a toff of 810ns and ton of 400ns. Ideal for high-power applications requiring fast switching capabilities in industries like renewable energy and industrial motor drives.
600 A
810 ns
400 ns
FS450R12KE4BOSA1
N-CHANNEL; Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Collector Current (IC): 675 A; Nominal Turn Off Time (toff): 740 ns; JESD-30 Code: R-XUFM-X29;
675 A
740 ns
290 ns
FS450R12OE4BOSA1
Infineon's FS450R12OE4BOSA1 is an N-CHANNEL IGBT with 6 elements, 1200V VCEsat, and 660A IC. Ideal for power control applications, it features a 2250W max power dissipation, -40 to 150 °C operating temp range, and UL approval.
660 A
2250 W
680 ns
FS450R17KE3BOSA1
FS450R17KE3BOSA1 by Infineon is an N-CHANNEL IGBT with 6 elements, max IC of 605A, and toff of 1300ns. It is used in power electronics applications requiring high voltage (1700V) and current handling capabilities. The device features a flange mount package style, isolated case connection, and silicon transistor element material for efficient performance.
605 A
FS450R17KE4BOSA1
N-CHANNEL; Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Collector Current (IC): 600 A; Terminal Form: UNSPECIFIED; Transistor Application: POWER CONTROL;
1600 ns
380 ns
FS450R17OE4BOSA1
N-CHANNEL; Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 2400 W; Maximum Collector Current (IC): 630 A; Package Body Material: UNSPECIFIED;
630 A
2400 W
1100 ns
310 ns
FS50R06W1E3BOMA1
Infineon's FS50R06W1E3BOMA1 is an N-CHANNEL IGBT with 6 elements, max. collector current of 70A, and turn off time of 370ns. Ideal for power control applications, it operates at up to 175°C with a max. collector-emitter voltage of 600V in a rectangular package style.
70 A
370 ns
250 ns
FS50R12W2T4BOMA1
Infineon's FS50R12W2T4BOMA1 is an N-CHANNEL IGBT with 6 elements, max. collector current of 83A, and max. collector-emitter voltage of 1200V. Ideal for power control applications due to its fast turn-off time (490ns) and high operating temperature (175°C). Package style: FLANGE MOUNT, configuration: COMPLEX.
83 A
490 ns
185 ns
FS75R07N2E4BOSA1
N-CHANNEL; Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Package Style (Meter): FLANGE MOUNT; Case Connection: ISOLATED; Reference Standard: UL APPROVED;
650 V
R-XUFM-X19
19
320 ns
45 ns
FS75R12KE3GBOSA1
FS75R12KE3GBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements in a bridge configuration. It has a max collector-emitter voltage of 1200V, collector current of 100A, and turn-off time of 610ns. Ideal for applications requiring high power switching such as motor drives and inverters due to its silicon transistor element material and isolated case connection.
100 A
R-XUFM-X35
35
340 ns
FS75R12KT3GBOSA1
FS75R12KT3GBOSA1 by Infineon is a N-CHANNEL IGBT with 6 elements in BRIDGE configuration. It has a toff of 610 ns and ton of 340 ns, suitable for high-power applications. With a Vce(max) of 1200V and Ic(max) of 100A, it operates at temperatures up to 150°C, making it ideal for industrial power systems.
FS75R12KT3BOSA1
Infineon FS75R12KT3BOSA1 is a N-CHANNEL IGBT with 6 elements, built-in diode, and thermistor. It has a max voltage of 1200V, current of 105A, and turn-off time of 610ns. Ideal for applications requiring high power efficiency in industrial systems like motor drives and renewable energy converters.
105 A
FS75R12W2T4BOMA1
Infineon's FS75R12W2T4BOMA1 is an N-CHANNEL IGBT with 6 elements, max. collector-emitter voltage of 1200V, and max. collector current of 107A. Ideal for power control applications, it features a nominal turn-off time of 490ns and nominal turn-on time of 185ns.
107 A
FZ1200R12KL4CNOSA1
N-CHANNEL; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): 1900 A; Case Connection: ISOLATED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
1900 A
R-XUFM-X5
2
5
1290 ns
750 ns
FZ1600R12KL4CNOSA1
N-CHANNEL; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): 2450 A; Package Shape: RECTANGULAR; JESD-30 Code: R-XUFM-X7;
2450 A
R-XUFM-X7
7
1310 ns
FZ1600R17KE3NOSA1
N-CHANNEL; Configuration: PARALLEL, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 2300 A; JESD-30 Code: R-XUFM-X7; Package Style (Meter): FLANGE MOUNT;
2300 A
PARALLEL, 2 ELEMENTS WITH BUILT-IN DIODE
1
1770 ns
FZ2400R12HP4NPSA1
N-CHANNEL; Configuration: COMMON GATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 3460 A; Maximum Operating Temperature: 150 Cel; Terminal Form: UNSPECIFIED;
3460 A
COMMON GATE, 2 ELEMENTS WITH BUILT-IN DIODE
1440 ns
880 ns
FZ2400R12KE3NOSA1
FZ2400R12KE3NOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 1200V VCE, 3200A IC, and 1140ns toff. It is used in high-power applications like industrial motor drives due to its complex configuration and fast switching times.
3200 A
1140 ns
890 ns
FZ2400R17KE3NOSA1
N-CHANNEL; Configuration: PARALLEL, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 3200 A; Terminal Form: UNSPECIFIED; Maximum Collector-Emitter Voltage: 1700 V;
1890 ns
850 ns
FZ3600R12KE3NOSA1
N-CHANNEL; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): 4700 A; Qualification: Not Qualified; JESD-30 Code: R-XUFM-X9;
4700 A
R-XUFM-X9
3
9
FZ400R12KE4HOSA1
FZ400R12KE4HOSA1 by Infineon is an N-CHANNEL IGBT with 1200V max collector-emitter voltage. It has a single configuration with built-in diode, ideal for power control applications. Featuring 810ns turn off time and 370ns turn on time, it operates at up to 150°C temperature in a rectangular package style.
SINGLE WITH BUILT-IN DIODE
R-XUFM-X3
FZ400R12KP4HOSA1
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Nominal Turn Off Time (toff): 840 ns; No. of Elements: 1; Package Shape: RECTANGULAR;
840 ns
315 ns
FZ400R17KE3HOSA1
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 780 A; Qualification: Not Qualified; Package Body Material: UNSPECIFIED;
780 A
R-XUFM-X4
4
1230 ns
FZ400R17KE4HOSA1
FZ400R17KE4HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max voltage of 1700V and current of 550A. It has a turn on time of 355ns and turn off time of 930ns, making it ideal for power control applications. The transistor comes in a rectangular package style with built-in diode, suitable for flange mount installations at temperatures up to 150°C.
550 A
930 ns
FZ400R65KE3NOSA1
FZ400R65KE3NOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 6500V VCEsat and 1200ns ton. Ideal for POWER CONTROL applications, it has a max operating temperature of 125°C. The transistor features a PLASTIC/EPOXY package body material and comes in a RECTANGULAR shape with 7 terminals.
6500 V
6.6 V
R-PUFM-X7
125 Cel
-50 Cel
PLASTIC/EPOXY
8100 ns
1200 ns
3.4 V
FZ600R12KE3HOSA1
FZ600R12KE3HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 900A max collector current, and 830ns turn off time. It is used for power control applications due to its single configuration with built-in diode and silicon transistor element material.
900 A
830 ns
FZ600R12KE4HOSA1
FZ600R12KE4HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 600A. It features a single configuration with built-in diode, ideal for power control applications. This rectangular package has a nominal turn-off time of 810ns and operates at temperatures up to 150°C.
FZ600R12KP4HOSA1
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 2400 A; Package Shape: RECTANGULAR; Terminal Position: UPPER;
2400 A
FZ600R12KS4HOSA1
FZ600R12KS4HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 1200V and a Nominal Turn Off Time of 590ns. It features a SINGLE configuration with BUILT-IN DIODE, suitable for high-power applications like industrial motor drives and renewable energy systems.
700 A
590 ns
180 ns
FZ600R17KE3HOSA1
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 840 A; Maximum Collector-Emitter Voltage: 1700 V; Transistor Application: POWER CONTROL;
840 A
FZ600R17KE4HOSA1
FZ600R17KE4HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1700V and a max collector current of 840A. It has a nominal turn-off time of 930ns and a turn-on time of 355ns, making it ideal for power control applications requiring high efficiency and fast switching capabilities. The transistor's single configuration with built-in diode and isolated case connection in a rectangular package shape ensure reliable performance in demanding environments.
FZ800R12KE3HOSA1
FZ800R12KE3HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max voltage of 1200V and current of 1200A. It has a turn on time of 440ns and turn off time of 1000ns, making it ideal for power control applications requiring high efficiency and performance in a flange mount package.
1200 A
1000 ns
440 ns
FZ800R12KL4CNOSA1
FZ800R12KL4CNOSA1 by Infineon Technologies is a N-CHANNEL IGBT with 2 elements in parallel. It has a max voltage of 1200V, max current of 1300A, and turn-off time of 1100ns. Ideal for power control applications due to its high performance and isolated case connection.
1300 A
450 ns
FZ800R33KF2CNOSA1
N-CHANNEL; Configuration: PARALLEL, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 9600 W; Maximum Collector Current (IC): 1300 A; No. of Terminals: 7;
3300 V
9600 W
Insulated Gate BIP Transistors
1900 ns
480 ns
4.25 V
FZ900R12KE4HOSA1
FZ900R12KE4HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max voltage of 1200V. It has a turn off time of 810ns and turn on time of 370ns, making it ideal for power control applications. The transistor comes in a rectangular package style with built-in diode, suitable for flange mount installations at temperatures up to 150°C.
FZ900R12KP4HOSA1
FZ900R12KP4HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V. It has a nominal turn off time of 840ns and turn on time of 370ns, making it ideal for power control applications. This single transistor with built-in diode comes in a rectangular package style with flange mount for easy installation.
FD400R12KE3HOSA1
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 580 A; Case Connection: ISOLATED; Peak Reflow Temperature (C): NOT SPECIFIED;
580 A
FF1200R12KE3NOSA1
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 1600 A; Nominal Turn On Time (ton): 880 ns; Package Style (Meter): FLANGE MOUNT;
1600 A
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
R-XUFM-X10
10
FF200R12KT3HOSA1
N-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 295 A; Case Connection: ISOLATED; No. of Terminals: 7;
295 A
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
215 ns
FF200R12MT4BOMA1
N-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Collector Current (IC): 295 A; Case Connection: ISOLATED; No. of Elements: 2;
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
600 ns
190 ns
FF225R12ME4BOSA1
FF225R12ME4BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, a built-in diode, and thermistor. It has a max voltage of 1200V, current of 320A, and turn-off time of 600ns. Ideal for applications requiring high power efficiency in industrial systems.
320 A
R-XUFM-X11
11
220 ns
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