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UNSPECIFIED Other Function Telecom Interface ICs 27

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
TPIC82010FFER by Texas Instruments

TPIC82010FFER

Texas Instruments

TPIC82010FFER by Texas Instruments is a telecom IC with 16 terminals, operating from -40 to 125°C. It's an automotive-grade chip with a nominal voltage of 3V, suitable for telecom circuit applications. The package is ceramic and metal-sealed, designed for surface mount assembly.

X-CUUC-N16

1

16

125 Cel

-40 Cel

CERAMIC, METAL-SEALED COFIRED

DIE

UNSPECIFIED

UNCASED CHIP

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

UPPER

RI-I02-112A-03 by Texas Instruments

RI-I02-112A-03

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Maximum Operating Temperature: 70 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

1

70 Cel

-25 Cel

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

TELECOM CIRCUIT

OTHER

NOT SPECIFIED

HTSFCH4801EV/DH,11 by NXP Semiconductors

HTSFCH4801EV/DH,11

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Qualification: Not Qualified;

X-XUUC-N

e4

1

85 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

UPPER

HTSMOH3201EV,118 by NXP Semiconductors

HTSMOH3201EV,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;

X-XUUC-N

1

85 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

TELECOM CIRCUIT

OTHER

NO LEAD

UPPER

HTSMOH5601EV,118 by NXP Semiconductors

HTSMOH5601EV,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Qualification: Not Qualified;

X-XUUC-N

e4

1

85 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

TELECOM CIRCUIT

OTHER

SILVER

NO LEAD

UPPER

RI-TRP-R9TD-16 by Texas Instruments

RI-TRP-R9TD-16

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; No. of Functions: 1; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -25 Cel;

1

85 Cel

-25 Cel

UNSPECIFIED

UNSPECIFIED

TELECOM CIRCUIT

OTHER

RI-TRP-W9TD-13 by Texas Instruments

RI-TRP-W9TD-13

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; No. of Functions: 1; Minimum Operating Temperature: -25 Cel;

1

70 Cel

-25 Cel

UNSPECIFIED

UNSPECIFIED

TELECOM CIRCUIT

OTHER

RI-TRP-W9TD-30 by Texas Instruments

RI-TRP-W9TD-30

Texas Instruments

TELECOM CIRCUIT; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; No. of Functions: 1; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

1

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

TELECOM CIRCUIT

NOT SPECIFIED

RI-TRP-R4FF-30 by Texas Instruments

RI-TRP-R4FF-30

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Package Body Material: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;

1

50 Cel

-25 Cel

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

TELECOM CIRCUIT

OTHER

NOT SPECIFIED

RI-TRP-W4FF-30 by Texas Instruments

RI-TRP-W4FF-30

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Package Body Material: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;

1

50 Cel

-25 Cel

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

TELECOM CIRCUIT

OTHER

NOT SPECIFIED

SL2S2002FUD,003 by NXP Semiconductors

SL2S2002FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S2102FUD,003 by NXP Semiconductors

SL2S2102FUD,003

NXP Semiconductors

SL2S2102FUD,003 by NXP Semiconductors is a CMOS telecom IC with 4 terminals. It operates in industrial temperature range (-40 to 85°C) and is surface mountable. Ideal for telecom circuit applications due to its uncased chip package style.

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5002FUD,003 by NXP Semiconductors

SL2S5002FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5102FUD,003 by NXP Semiconductors

SL2S5102FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

TRPGR30ENATGB by Texas Instruments

TRPGR30ENATGB

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel; Package Body Material: UNSPECIFIED;

31.2 mm

1

70 Cel

-25 Cel

UNSPECIFIED

UNSPECIFIED

TELECOM CIRCUIT

OTHER

UNSPECIFIED

3.85 mm

RI-TRP-R9BK-20 by Texas Instruments

RI-TRP-R9BK-20

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Qualification: Not Qualified; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Maximum Operating Temperature: 70 Cel;

1

70 Cel

-25 Cel

UNSPECIFIED

DIE OR CHIP

UNSPECIFIED

NOT SPECIFIED

Not Qualified

Other Telecom ICs

TELECOM CIRCUIT

OTHER

NOT SPECIFIED

RF-HDT-AJLC-G0 by Texas Instruments

RF-HDT-AJLC-G0

Texas Instruments

RF-HDT-AJLC-G0 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. Operating temperature range from -40°C to 85°C, making it suitable for various applications. Its uncased chip package style and no-lead terminal form offer flexibility in design and integration.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

RF-HDT-AJLE-G1 by Texas Instruments

RF-HDT-AJLE-G1

Texas Instruments

Texas Instruments RF-HDT-AJLE-G1 is an industrial-grade telecom circuit IC with surface mount capability. Operating temperature ranges from -40°C to 85°C. Its uncased chip package style and no-lead terminal form make it suitable for various telecom interface applications.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

RF-HDT-AJLS-G1 by Texas Instruments

RF-HDT-AJLS-G1

Texas Instruments

RF-HDT-AJLS-G1 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. It operates b/w -40°C to 85°C, making it suitable for various temperature environments. With a terminal position of upper and no-lead terminal form, it is ideal for telecommunications applications.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

RF-HDT-SJLC-G0 by Texas Instruments

RF-HDT-SJLC-G0

Texas Instruments

RF-HDT-SJLC-G0 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. It operates b/w -40°C to 85°C, making it suitable for various temperature environments. With a terminal position of upper and no-lead terminal form, it is ideal for telecom interface applications.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

RF-HDT-WNMC-M0 by Texas Instruments

RF-HDT-WNMC-M0

Texas Instruments

Texas Instruments RF-HDT-WNMC-M0 is an industrial-grade telecom circuit IC with surface mount capability. Operating temperature ranges from -40°C to 85°C. It features a terminal position of upper and comes in unencased chip package style, suitable for various telecom interface applications.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

RI-TRP-RFOB-30 by Texas Instruments

RI-TRP-RFOB-30

Texas Instruments

RI-TRP-RFOB-30 by Texas Instruments is an industrial-grade telecom IC with temp range -40 to 85°C. It features a special shape plastic/epoxy package, tin silver copper terminal finish. Ideal for telecom circuits, this IC ensures reliable performance in various applications.

X-PXSS-X

e1

1

85 Cel

-40 Cel

PLASTIC/EPOXY

UNSPECIFIED

SPECIAL SHAPE

NO

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

UNSPECIFIED

UNSPECIFIED

RI-TRP-WFOB-30 by Texas Instruments

RI-TRP-WFOB-30

Texas Instruments

RI-TRP-WFOB-30 by Texas Instruments is an industrial-grade telecom IC with a temperature range of -40 to 85°C. It features a special shape plastic/epoxy package and terminal finish of tin silver copper. Ideal for telecom circuits, this IC offers reliable performance in various applications.

X-PXSS-X

e1

1

85 Cel

-40 Cel

PLASTIC/EPOXY

UNSPECIFIED

SPECIAL SHAPE

NO

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

UNSPECIFIED

UNSPECIFIED

TMS37145TEAIE by Texas Instruments

TMS37145TEAIE

Texas Instruments

TMS37145TEAIE by Texas Instruments is an industrial-grade telecom circuit IC with a max operating temp of 85°C and min of -40°C. It comes in a special shape plastic/epoxy package, measuring 12mm in width and 6mm in length. Ideal for telecom interface applications requiring high-temperature performance.

X-PXSS-X

6 mm

1

1

85 Cel

-40 Cel

PLASTIC/EPOXY

UNSPECIFIED

SPECIAL SHAPE

260

NO

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

30

12 mm

AX50311-1-WD1 by Onsemi

AX50311-1-WD1

Onsemi

AX50311-1-WD1 by Onsemi is a CMOS telecom IC with 3V supply voltage, 2 Mbps data rate, and industrial temperature grade. It is used in telecom circuits for applications requiring a surface mount unencased chip package style.

DATA RATE 350 KBPS FOR FSK,MODULATION

2 Mbps

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

DIE OR CHIP

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

XB24CASIT-001 by Digi International

XB24CASIT-001

Digi International

TELECOM CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: XMA; Package Shape: UNSPECIFIED; Width: 24.38 mm;

1 Mbps

X-XXMA-T20

27.61 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

XMA

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

3.3 V

NO

TELECOM CIRCUIT

THROUGH-HOLE

2 mm

UNSPECIFIED

24.38 mm

BB-485LDRC9 by Advantech

BB-485LDRC9

Advantech

Advantech's BB-485LDRC9 is a MICROELECTRONIC ASSEMBLY for TELECOM CIRCUIT applications. It operates b/w -40 to 80°C, with a data rate of 0.1152 Mbps. With dimensions of 25.1mm x 95.2mm x 78.8mm, it's ideal for telecom interface ICs in various industries.

.1152 Mbps

X-PXMA-X

95.2 mm

1

80 Cel

-40 Cel

PLASTIC/EPOXY

XMA

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

78.8 mm

NO

TELECOM CIRCUIT

UNSPECIFIED

UNSPECIFIED

25.1 mm