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LFBGA Other Function Telecom Interface ICs 29

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
AD9993BBCZ by Analog Devices

AD9993BBCZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

AD9364BBCZREEL by Analog Devices

AD9364BBCZREEL

Analog Devices

AD9364BBCZREEL by Analog Devices is a 144-terminal telecom IC with a supply voltage of 1.8V, operating b/w -40 to 85°C. It features a grid array package style and is suitable for telecom circuit applications requiring low profile and fine pitch components.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD9364BBCZ by Analog Devices

AD9364BBCZ

Analog Devices

AD9364BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.8V. Ideal for telecom circuits, it features a fine pitch and bottom terminal position for surface mount applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

DS1852B-000 by Maxim Integrated

DS1852B-000

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B25

e0

5 mm

3

1

25

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

5 mm

STA2500DCTR by STMicroelectronics

STA2500DCTR

STMicroelectronics

STA2500DCTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates at a nominal voltage of 2.75V, with a temperature range from -40 °C to 85 °C. This compact 48-terminal device features a square grid array package for efficient surface mounting.

S-PBGA-B48

6 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

NOT SPECIFIED

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

6 mm

STA2500DC by STMicroelectronics

STA2500DC

STMicroelectronics

STA2500DC by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates within -40 °C to 85 °C, features a compact 6mm x 6mm grid array package, and requires a nominal voltage of 2.75V. Ideal for reliable telecom solutions, it supports surface mount technology with 48 terminals.

S-PBGA-B48

6 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

NOT SPECIFIED

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

6 mm

STA2500DTR by STMicroelectronics

STA2500DTR

STMicroelectronics

STA2500DTR by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 48-terminal grid array with a nominal voltage of 2.75V and peak reflow temp of 260 °C. Ideal for reliable performance in demanding environments.

S-PBGA-B48

e1

6 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

260

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

6 mm

STA2500D by STMicroelectronics

STA2500D

STMicroelectronics

STA2500D by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 48-terminal grid array with a nominal voltage of 2.75V and supports surface mount technology. Ideal for robust telecom systems, it ensures reliable performance in demanding environments.

S-PBGA-B48

e1

6 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

260

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

6 mm

ADRV9009BBCZ-REEL by Analog Devices

ADRV9009BBCZ-REEL

Analog Devices

ADRV9009BBCZ-REEL by Analog Devices is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-1REEL by Analog Devices

ADRV9008BBCZ-1REEL

Analog Devices

Analog Devices ADRV9008BBCZ-1REEL is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuit applications requiring fine pitch and bottom terminal position.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-2REEL by Analog Devices

ADRV9008BBCZ-2REEL

Analog Devices

Analog Devices ADRV9008BBCZ-2REEL is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

FIDO5100CBCZ by Analog Devices

FIDO5100CBCZ

Analog Devices

FIDO5100CBCZ by Analog Devices is a telecom IC with 144 terminals in a square grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With a low profile of 1.24mm and CMOS technology, it has a nominal voltage of 1.2V for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5200CBCZ by Analog Devices

FIDO5200CBCZ

Analog Devices

FIDO5200CBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With CMOS technology and a nominal voltage of 1.2V, it is ideal for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5110BBCZ by Analog Devices

FIDO5110BBCZ

Analog Devices

FIDO5110BBCZ by Analog Devices is a Telecom Circuit IC with 144 terminals in a low profile, fine pitch grid array package. Operating temperature range from -40 to 85 °C makes it suitable for industrial applications. It operates at a nominal voltage of 1.2V and utilizes CMOS technology for efficient performance.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5110CBCZ by Analog Devices

FIDO5110CBCZ

Analog Devices

FIDO5110CBCZ by Analog Devices is a telecom IC with 144 terminals in a square grid array package. Operating temperature ranges from -40 to 105 °C, suitable for industrial use. It features CMOS technology, 1.2V supply voltage, and 0.8mm terminal pitch, ideal for telecom circuit applications.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5210BBCZ by Analog Devices

FIDO5210BBCZ

Analog Devices

FIDO5210BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With a nominal voltage of 1.2V and CMOS technology, it's ideal for telecom circuit interfaces.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5210CBCZ by Analog Devices

FIDO5210CBCZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

AD9671KBCZ by Analog Devices

AD9671KBCZ

Analog Devices

AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.

S-PBGA-B144

10 mm

3

1

144

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.4 V

YES

TELECOM CIRCUIT

OTHER

BALL

.8 mm

BOTTOM

30

10 mm

AD9670BBCZ by Analog Devices

AD9670BBCZ

Analog Devices

AD9670BBCZ by Analog Devices is a 144-terminal telecom IC with a 1.4V supply voltage. It features a low profile grid array package, operates b/w 0-85°C, and has a peak reflow temperature of 260°C. Ideal for telecom circuit applications requiring fine pitch components in a compact form factor.

S-PBGA-B144

10 mm

3

1

144

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.4 V

YES

TELECOM CIRCUIT

OTHER

BALL

.8 mm

BOTTOM

30

10 mm

AD9363ABCZ-REEL by Analog Devices

AD9363ABCZ-REEL

Analog Devices

AD9363ABCZ-REEL by Analog Devices is a telecom IC with 144 terminals in a square grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it has a low profile and fine pitch design for surface mounting applications.

S-PBGA-B144

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

10 mm

AD9363ABCZ by Analog Devices

AD9363ABCZ

Analog Devices

AD9363ABCZ by Analog Devices is a telecom IC with 144 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features a low profile design and ball terminal form.

S-PBGA-B144

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

10 mm

FIDO5100BBCZ by Analog Devices

FIDO5100BBCZ

Analog Devices

FIDO5100BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With CMOS technology and a supply voltage of 1.2V, it's ideal for telecom circuit integration in compact spaces.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5200BBCZ by Analog Devices

FIDO5200BBCZ

Analog Devices

FIDO5200BBCZ by Analog Devices is a telecom IC with 144 terminals in a low-profile grid array package. It operates b/w -40°C to 85°C, suitable for industrial applications. With CMOS technology and a nominal voltage of 1.2V, it's ideal for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

ADRV9009BBCZ by Analog Devices

ADRV9009BBCZ

Analog Devices

Analog Devices ADRV9009BBCZ is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a fine pitch terminal style and tin silver copper finish.

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-1 by Analog Devices

ADRV9008BBCZ-1

Analog Devices

ADRV9008BBCZ-1 by Analog Devices is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom applications requiring precise signal processing and connectivity in industrial environments.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-2 by Analog Devices

ADRV9008BBCZ-2

Analog Devices

Analog Devices' ADRV9008BBCZ-2 is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a bottom terminal position and plastic/epoxy body material.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

ADRV9026BBCZ-REEL by Analog Devices

ADRV9026BBCZ-REEL

Analog Devices

Analog Devices' ADRV9026BBCZ-REEL is a telecom IC with 4 functions, operating b/w -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and peak reflow temperature of 260°C.

ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE

S-PBGA-B289

e1

14 mm

3

4

289

110 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.46 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

14 mm

ADRV9026BBCZ by Analog Devices

ADRV9026BBCZ

Analog Devices

Analog Devices ADRV9026BBCZ is a telecom IC with 4 functions, operating at -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and terminal pitch of 0.8mm.

ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE

S-PBGA-B289

e1

14 mm

3

4

289

110 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.46 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

14 mm

BC57G687C-ANN-E4 by Qualcomm

BC57G687C-ANN-E4

Qualcomm

BC57G687C-ANN-E4 by Qualcomm is a telecom interface IC with 105 terminals in a low profile grid array package. Operating temperature ranges from -40 to 85°C, supporting data rates up to 12 Mbps. Ideal for telecom circuits, it has a nominal voltage of 1.5V and terminal pitch of 0.8mm.

12 Mbps

S-PBGA-B105

10 mm

1

105

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA105,11X11,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

AEC-Q100

1.6 mm

1.5 V

YES

TELECOM CIRCUIT

BALL

.8 mm

BOTTOM

10 mm