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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCVU13P-1FHGB2104E by Xilinx

XCVU13P-1FHGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-1FHGB2104I by Xilinx

XCVU13P-1FHGB2104I

Xilinx

Xilinx XCVU13P-1FHGB2104I FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Utilizes a grid array package style with a square shape and plastic/epoxy material.

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-2FHGA2104I by Xilinx

XCVU13P-2FHGA2104I

Xilinx

Xilinx XCVU13P-2FHGA2104I FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Package style is grid array with a square shape and bottom terminal position.

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-2FHGB2104I by Xilinx

XCVU13P-2FHGB2104I

Xilinx

Xilinx XCVU13P-2FHGB2104I FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for industrial applications, it operates b/w -40 to 100 °C with a supply voltage range of 0.825V to 0.876V. The package style is grid array with a square shape and bottom terminal position.

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-2FIGD2104I by Xilinx

XCVU13P-2FIGD2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-3FHGA2104E by Xilinx

XCVU13P-3FHGA2104E

Xilinx

Xilinx XCVU13P-3FHGA2104E FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for high-performance computing applications requiring advanced programmable ICs with a package style of grid array.

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-3FHGB2104E by Xilinx

XCVU13P-3FHGB2104E

Xilinx

Xilinx XCVU13P-3FHGB2104E FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact square package with a grid array style. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-3FHGC2104E by Xilinx

XCVU13P-3FHGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-3FIGD2104E by Xilinx

XCVU13P-3FIGD2104E

Xilinx

Xilinx XCVU13P-3FIGD2104E FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY body material. Operates b/w 0-100°C temperature range, making it suitable for various industrial and commercial projects.

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-L2FIGD2104E by Xilinx

XCVU13P-L2FIGD2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

.72

.698 V

.742 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.59 mm

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU160-H1FLGB2104E by Xilinx

XCVU160-H1FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

115800

115800 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU5P-1FLVA2104E by Xilinx

XCVU5P-1FLVA2104E

Xilinx

Xilinx XCVU5P-1FLVA2104E FPGA features 1313763 logic cells, 75072 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-1FLVA2104I by Xilinx

XCVU5P-1FLVA2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-1FLVB2104E by Xilinx

XCVU5P-1FLVB2104E

Xilinx

Xilinx XCVU5P-1FLVB2104E FPGA features 1313763 logic cells, 75072 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.876 V. Package style is grid array in a square shape with ball terminals, suitable for various industrial uses.

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-1FLVB2104I by Xilinx

XCVU5P-1FLVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-1FLVC2104E by Xilinx

XCVU5P-1FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-2FLVA2104I by Xilinx

XCVU5P-2FLVA2104I

Xilinx

Xilinx XCVU5P-2FLVA2104I FPGA offers 1313763 logic cells, 75072 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.825V to 0.876V.

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-2FLVB2104I by Xilinx

XCVU5P-2FLVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-3FLVA2104E by Xilinx

XCVU5P-3FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-3FLVC2104E by Xilinx

XCVU5P-3FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-L2FLVA2104E by Xilinx

XCVU5P-L2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75073

75073 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-1FLVA2104I by Xilinx

XCVU7P-1FLVA2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-1FLVB2104E by Xilinx

XCVU7P-1FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-1FLVB2104I by Xilinx

XCVU7P-1FLVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-2FLVA2104I by Xilinx

XCVU7P-2FLVA2104I

Xilinx

Xilinx XCVU7P-2FLVA2104I FPGA offers 1724100 logic cells, 98520 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-2FLVB2104I by Xilinx

XCVU7P-2FLVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-2FLVC2104I by Xilinx

XCVU7P-2FLVC2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-3FLVA2104E by Xilinx

XCVU7P-3FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-3FLVB2104E by Xilinx

XCVU7P-3FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-3FLVC2104E by Xilinx

XCVU7P-3FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-L2FLVA2104E by Xilinx

XCVU7P-L2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-L2FLVC2104E by Xilinx

XCVU7P-L2FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU9P-1FLGA2104E by Xilinx

XCVU9P-1FLGA2104E

Xilinx

Xilinx XCVU9P-1FLGA2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it versatile for various industrial uses.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-1FLGA2104I by Xilinx

XCVU9P-1FLGA2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-1FLGB2104E by Xilinx

XCVU9P-1FLGB2104E

Xilinx

Xilinx XCVU9P-1FLGB2104E FPGA boasts 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY body material. Operates b/w 0-100°C, offering versatility in various industrial settings.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-1FLGB2104I by Xilinx

XCVU9P-1FLGB2104I

Xilinx

Xilinx XCVU9P-1FLGB2104I FPGA features 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for industrial applications, it operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package measures 47.5mm x 47.5mm with a seated height of 4.32mm, making it suitable for various high-performance computing tasks.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-1FLGC2104E by Xilinx

XCVU9P-1FLGC2104E

Xilinx

Xilinx XCVU9P-1FLGC2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY material. Operating b/w 0-100°C, it's suitable for various industries needing efficient processing power.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-2FLGA2104I by Xilinx

XCVU9P-2FLGA2104I

Xilinx

Xilinx XCVU9P-2FLGA2104I FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Package style: Grid Array, suitable for surface mount assembly.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-2FLGB2104I by Xilinx

XCVU9P-2FLGB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

2104

S-PBGA-B2104

e1

XCVU9P-2FLGC2104I by Xilinx

XCVU9P-2FLGC2104I

Xilinx

Xilinx XCVU9P-2FLGC2104I FPGA features 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Utilizes a grid array package style with a square shape and plastic/epoxy material.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-2FSGD2104I by Xilinx

XCVU9P-2FSGD2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-3FLGA2104E by Xilinx

XCVU9P-3FLGA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-3FLGB2104E by Xilinx

XCVU9P-3FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-3FSGD2104E by Xilinx

XCVU9P-3FSGD2104E

Xilinx

Xilinx XCVU9P-3FSGD2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a package style of grid array. Operating temperature ranges from 0 to 100°C, making it suitable for various industrial uses.

FPGA

2586150

832

832

147780

147780 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU095-2FFVB2104E by Xilinx

XCVU095-2FFVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCVU095-2FFVB2104I by Xilinx

XCVU095-2FFVB2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCVU7P-2FLVB2104E by Xilinx

XCVU7P-2FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU11P-2FLGB2104E by Xilinx

XCVU11P-2FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1