Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TDA8026ET/C2,518
NXP Semiconductors
TDA8026ET/C2,518 by NXP Semiconductors is a microprocessor circuit with a 3.3V supply and operates b/w -25 °C to 85 °C. It features a fine pitch grid array package with 64 terminals and supports surface mount technology. Ideal for various embedded applications, it ensures reliable performance in compact designs.
S-PBGA-B64
e1
2
64
85 Cel
-25 Cel
PLASTIC/EPOXY
FBGA
BGA64,8X8,32
SQUARE
GRID ARRAY, FINE PITCH
260
3.3
Not Qualified
Other Microprocessor ICs
260 mA
3.3 V
YES
OTHER
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
30
MICROPROCESSOR CIRCUIT
TDA8026ET/C2,551
NXP Semiconductors TDA8026ET/C2,551 is a MICROPROCESSOR CIRCUIT with 64 terminals and 3.3V supply voltage. It operates b/w -25 to 85°C, suitable for various applications requiring a fine pitch GRID ARRAY package style. With a peak reflow temp of 260°C, it's ideal for SMT assembly in electronics manufacturing.
TDA8026ET/C2,557
TDA8026ET/C2,557 by NXP Semiconductors is a microprocessor circuit in a square grid array package. It operates at 3.3V with a max current of 260mA and supports temperatures from -25 °C to 85 °C. Ideal for compact electronic applications requiring efficient processing.
CC430F6145IRGCR
Texas Instruments
CC430F6145IRGCR by Texas Instruments is a 16-bit microprocessor with 2/3.3V power supplies, 16384 ROM words, and 2048 RAM bytes. It operates in industrial temperatures from -40 to 85°C and is ideal for applications requiring a MICROPROCESSOR CIRCUIT in a compact CHIP CARRIER package with PLASTIC/EPOXY material.
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY
16
MSP430
S-PQCC-N64
e4
9 mm
3
-40 Cel
HVQCCN
LCC64,.35SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
2/3.3
2048
16384
FLASH
1 mm
20 rpm
Microcontrollers
3.6 V
2.4 V
CMOS
INDUSTRIAL
NICKEL PALLADIUM GOLD
NO LEAD
.5 mm
QUAD
CC430F6145IRGCT
CC430F6145IRGCT by Texas Instruments is a 16-bit microprocessor with 2/3.3V power supplies, 16384 ROM words, and 2048 RAM bytes. It operates in industrial temperatures from -40 to 85°C and is ideal for applications requiring a MICROPROCESSOR CIRCUIT in a compact CHIP CARRIER package with very thin profile.
9LPRS511EGLFT
Integrated Device Technology
9LPRS511EGLFT by Integrated Device Technology is a 64-terminal microprocessor circuit with CMOS technology. Operating at 3.3V, it has a temp range of 0-70°C and peak reflow temp of 260°C. Ideal for applications requiring small outline, thin profile ICs in commercial-grade environments.
R-PDSO-G64
e3
1
70 Cel
0 Cel
TSSOP
TSSOP64,.32,20
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Clock Generators
COMMERCIAL
TIN
GULL WING
DUAL
SN74LVT18512DGG
SN74LVT18512DGG by Texas Instruments is a 64-terminal CMOS microprocessor circuit with a supply voltage range of 2.7V to 3.6V, suitable for industrial applications. This IC operates in temperatures from -40°C to 85°C and features a small outline package style with gull wing terminals for surface mount assembly.
17 mm
NOT SPECIFIED
1.2 mm
2.7 V
6.1 mm
SN74LVT8986PM
SN74LVT8986PM by Texas Instruments is a 64-terminal IC with a supply voltage range of 2.7V to 3.6V, operating temperature from -40°C to 85°C, and BICMOS technology. It is ideal for industrial applications requiring a microprocessor circuit in a square flatpack package with gull wing terminals.
0
S-PQFP-G64
10 mm
LFQFP
QFP64,.47SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
1.6 mm
3 V
BICMOS
STA2058
STMicroelectronics
STA2058 by STMicroelectronics is a low-profile microprocessor circuit with a supply voltage range of 2.97V to 3.63V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 64-terminal flatpack design, ideal for industrial applications. Its CMOS technology ensures efficient performance in space-constrained environments.
3.63 V
2.97 V
UCD3138ARGCR
UCD3138ARGCR by Texas Instruments is a 64-terminal microprocessor circuit with a max clock frequency of 2 MHz. It operates in automotive-grade temperatures from -40 to 125 °C and supports I2C and UART bus compatibility. This chip carrier package with a very thin profile is suitable for applications requiring high-performance control in harsh environments.
I2C; UART
2 MHz
125 Cel
AUTOMOTIVE
Nickel/Palladium/Gold (Ni/Pd/Au)
UCD3138ARGCT
UCD3138ARGCT by Texas Instruments is a 64-terminal microprocessor circuit with CMOS technology. It operates at 3-3.6V, -40 to 125°C, and supports I2C and UART bus compatibility. Ideal for automotive applications due to its compact square package style and low profile design.
ATMXT224T-CCU027
Microchip Technology
CAPACITIVE TOUCH SCREEN CONTROLLERS; Terminal Form: BALL; No. of Terminals: 64; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES;
5 mm
VFBGA
BGA64,8X8,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.6 mm
3.47 V
CAPACITIVE TOUCH SCREEN CONTROLLERS
CY8C4247AZS-M485
Infineon Technologies
CY8C4247AZS-M485 by Infineon is a 64-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.71V to 1.89V. Ideal for applications requiring low-profile, fine-pitch ICs in automotive electronics meeting AEC-Q100 standards.
105 Cel
AEC-Q100
1.89 V
1.71 V
1.8 V
PROGRAMMABLE SoC
CY8C4147AZE-S275T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
5.5 V
PSoC
CY8C4147AZS-S255T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;
CY8C4147AZE-S445T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
CY8C4147AZE-S465T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Screening Level: AEC-Q100;
CY8C4146AZE-S255T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH;
CY8C4146AZE-S275T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
CY8C4127AZE-S445T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Length: 10 mm;
CY8C4146AZE-S455T
CY8C4126AZE-S455T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
CY8C4127AZE-S455T
CY8C4146AZE-S245T
CY8C4146AZE-S265T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Minimum Supply Voltage: 1.8 V;
CY8C4147AZE-S245T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
CY8C4147AZE-S295T
CY8C4147AZE-S265T
CY8C4147AZE-S285T
CY8C4147AZE-S455T
CY8C4147AZS-S295T
CY8C4147AZE-S255T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Technology: CMOS;
CY8C4147AZE-S475T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP64,.47SQ,20;
CY8C4147AZS-S455T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G64;
CYAT81658-64AA48T
1.95 V
1.7 V
CYAT81650-64AA48T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
CYAT81650-64AS48T
PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
CY8C6144AZI-S4F92
CY8C6144AZI-S4F92 by Infineon Technologies is a 64-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. This IC is ideal for applications requiring low-profile, fine-pitch packages in surface-mount configurations.
HLFQFP
HQFP64,.47SQ,20
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
CY8C6144AZI-S4F82
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
CY8C6144AZI-S4F62
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Package Equivalence Code: HQFP64,.47SQ,20;
CY8C6144AZQ-S4F92
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;
CY8C6144AZI-S4F12
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Width: 10 mm;
CY8C6244AZI-S4D82
Infineon's CY8C6244AZI-S4D82 is a 64-terminal SoC with CMOS technology. Operating b/w -40 to 85 °C, it supports supply voltage range of 1.7-3.6 V. Ideal for applications requiring low profile and fine pitch package styles in surface mount configurations.
SoC
CY8C6244AZI-S4D12
SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH;
CY8C6244AZI-S4D62
CY8C6244AZI-S4D62 by Infineon: 64-terminal SoC with CMOS tech, 1.7-3.6V supply, -40 to 85°C temp range. Ideal for applications requiring low-profile, fine-pitch ICs in plastic/epoxy packages.
CY8C6244AZQ-S4D92
SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
CY8C4147LQS-S295
PROGRAMMABLE SoC; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE; Width: 9 mm;
S-XQCC-N64
UNSPECIFIED
.9 mm
CY8C4147LQS-S475
PROGRAMMABLE SoC; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
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