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NXP Semiconductors Multi-functional Peripherals 104

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LH75401N0Q100C0,55 by NXP Semiconductors

LH75401N0Q100C0,55

NXP Semiconductors

NXP Semiconductors' LH75401N0Q100C0,55 is a Multi-functional Peripheral IC with 24-bit Address Bus, 16-bit External Data Bus, and 20 MHz Clock Frequency. Ideal for applications requiring CAN, SSP, and UART(3) bus compatibility in a compact FLATPACK package.

ALSO REQUIRES 3.3 V SUPPLY

24

YES

CAN, SSP, UART(3)

20 MHz

16

S-PQFP-G144

e3

20 mm

3

76

5

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

250

Not Qualified

32768

1.6 mm

70 mA

1.98 V

1.7 V

1.8 V

YES

CMOS

Tin (Sn)

GULL WING

.5 mm

QUAD

40

20 mm

MULTIFUNCTION PERIPHERAL

LH75411N0Q100C0,55 by NXP Semiconductors

LH75411N0Q100C0,55

NXP Semiconductors

NXP Semiconductors' LH75411N0Q100C0,55 is a Multi-functional Peripheral IC with 24-bit Address Bus and 16-bit External Data Bus. It operates at 20 MHz clock frequency, suitable for CAN, SSP, UART(3) bus compatibility applications. The device features a low profile flatpack package with 144 terminals and supports boundary scan testing.

ALSO REQUIRES 3.3 V SUPPLY

24

YES

CAN, SSP, UART(3)

20 MHz

16

S-PQFP-G144

e3

20 mm

76

5

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Not Qualified

32768

1.6 mm

70 mA

1.98 V

1.7 V

1.8 V

YES

CMOS

TIN

GULL WING

.5 mm

QUAD

20 mm

MULTIFUNCTION PERIPHERAL

LH75401N0Q100C0 by NXP Semiconductors

LH75401N0Q100C0

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.98 V;

ALSO REQUIRES 3.3 V SUPPLY

24

YES

CAN, SSP, UART(3)

20 MHz

16

S-PQFP-G144

e3

20 mm

3

76

5

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Not Qualified

32768

1.6 mm

70 mA

1.98 V

1.7 V

1.8 V

YES

CMOS

TIN

GULL WING

.5 mm

QUAD

20 mm

MULTIFUNCTION PERIPHERAL

MIMX8MD6CVAHZAA by NXP Semiconductors

MIMX8MD6CVAHZAA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MQ5CVAHZAA by NXP Semiconductors

MIMX8MQ5CVAHZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MQ5CVAHZAA is a multi-functional peripheral IC with 621 terminals, operating at -40 to 105°C. It features 81920 RAM words, supports Ethernet, I2C, and USB buses, and has a max clock frequency of 40 MHz. Ideal for industrial applications requiring high-speed data processing in compact form factors.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MQ6CVAHZAA by NXP Semiconductors

MIMX8MQ6CVAHZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MQ6CVAHZAA is a multi-functional peripheral with a max clock frequency of 40 MHz. It is widely used in industrial applications and supports various bus compatibilities such as Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MD6CVAHZAB by NXP Semiconductors

MIMX8MD6CVAHZAB

NXP Semiconductors

NXP Semiconductors' MIMX8MD6CVAHZAB is a multi-functional peripheral IC with 621 terminals, 81920 RAM words, and 40 MHz max clock frequency. Ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART & USB bus compatibility at -40 to 105°C operating temp.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MQ5CVAHZAB by NXP Semiconductors

MIMX8MQ5CVAHZAB

NXP Semiconductors

The NXP Semiconductors MIMX8MQ5CVAHZAB is a multi-functional peripheral IC with 621 terminals, 81920 RAM words, and a max clock frequency of 40 MHz. It is ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB bus compatibility in a compact square package with fine pitch grid array style.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

e2

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MQ6CVAHZAB by NXP Semiconductors

MIMX8MQ6CVAHZAB

NXP Semiconductors

The NXP Semiconductors MIMX8MQ6CVAHZAB is a multi-functional peripheral IC with 621 terminals, 81920 RAM words, and a max clock frequency of 40 MHz. It is ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB bus compatibility in a compact square package with a terminal pitch of 0.65 mm.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

e2

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MM2CVTKZAA by NXP Semiconductors

MIMX8MM2CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM2CVTKZAA is a multi-functional SoC with 288K RAM, suitable for industrial applications. It features a max supply voltage of 1V, operating temperature range from -40 to 105°C, and compatibility with Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB interfaces. This package has a grid array style with 486 terminals in a square shape.

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

S-PBGA-B486

e2

14 mm

3

16

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

288K

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM4CVTKZAA by NXP Semiconductors

MIMX8MM4CVTKZAA

NXP Semiconductors

MIMX8MM4CVTKZAA by NXP Semiconductors is a multi-functional peripheral with a square package and 486 terminals. It operates at a voltage range of 0.9V to 1V and has a max operating temperature of 105°C. This SoC technology is compatible with various bus interfaces such as Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB.

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

S-PBGA-B486

e2

14 mm

3

16

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

288K

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM5CVTKZAA by NXP Semiconductors

MIMX8MM5CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM5CVTKZAA is a multi-functional SoC with 288K RAM, 486 terminals, and 0.95V nominal voltage. It is suitable for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB bus compatibility. With a temperature range of -40 to 105°C and boundary scan capability, it offers versatile performance in various electronic systems.

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

S-PBGA-B486

e2

14 mm

3

16

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

288K

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MCIMX7D5EVM10SC by NXP Semiconductors

MCIMX7D5EVM10SC

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.1 V;

S-PBGA-B541

19 mm

3

541

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

BALL

.75 mm

BOTTOM

40

19 mm

B4860NXN7QUMD by NXP Semiconductors

B4860NXN7QUMD

NXP Semiconductors

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1020; Package Code: BGA; Package Shape: SQUARE;

16

YES

USB; PCI; I2C

133.333 MHz

64

S-PBGA-B1020

e1

33 mm

3

1020

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

2.93 mm

1.08 V

1.02 V

1.05 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

33 mm

MCIMX6G1AVM05AB by NXP Semiconductors

MCIMX6G1AVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e2

14 mm

YES

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G1AVM07AB by NXP Semiconductors

MCIMX6G1AVM07AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e2

14 mm

YES

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

696 rpm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G2DVK05AB by NXP Semiconductors

MCIMX6G2DVK05AB

NXP Semiconductors

MCIMX6G2DVK05AB by NXP Semiconductors is a multi-functional peripheral IC with integrated cache and low power mode. It features an address bus width of 26, external data bus width of 16, and operates at a speed of 528 rpm. Ideal for applications requiring high-speed processing in compact electronic devices.

26

YES

16

FIXED POINT

YES

S-PBGA-B272

9 mm

YES

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G2DVM05AB by NXP Semiconductors

MCIMX6G2DVM05AB

NXP Semiconductors

MCIMX6G2DVM05AB by NXP Semiconductors is a Multi-functional Peripherals IC with 16-bit external data bus width, integrated cache, and low power mode. It operates b/w 0-95 °C and has a max supply voltage of 1.3 V. Ideal for applications requiring high-speed processing in compact devices.

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e1

14 mm

YES

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G3DVM05AB by NXP Semiconductors

MCIMX6G3DVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e1

14 mm

YES

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

LS1026ASN8P1A by NXP Semiconductors

LS1026ASN8P1A

NXP Semiconductors

LS1026ASN8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 1400 MHz max clock frequency, and 780 terminals. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact square package with a terminal pitch of 0.8 mm.

14

YES

I2C, PCI, SPI, UART, USB

1400 MHz

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8MQA by NXP Semiconductors

LS1026ASE8MQA

NXP Semiconductors

LS1026ASE8MQA by NXP Semiconductors is a multi-functional peripheral with a package body made of plastic/epoxy. It has a max supply voltage of 0.93V and an address bus width of 14. This versatile component is compatible with I2C, PCI, SPI, UART, and USB buses and can be used in various applications requiring high-performance peripherals.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8P1A by NXP Semiconductors

LS1026ASE8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8Q1A by NXP Semiconductors

LS1026ASE8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8T1A by NXP Semiconductors

LS1026ASE8T1A

NXP Semiconductors

LS1026ASE8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact grid array package style.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8MQA by NXP Semiconductors

LS1026ASN8MQA

NXP Semiconductors

LS1026ASN8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and CMOS technology.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8Q1A by NXP Semiconductors

LS1026ASN8Q1A

NXP Semiconductors

LS1026ASN8Q1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 780 terminals. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8T1A by NXP Semiconductors

LS1026ASN8T1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 14;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8MQA by NXP Semiconductors

LS1026AXE8MQA

NXP Semiconductors

LS1026AXE8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width and 14-bit address bus width. It features a grid array, fine pitch package style and is compatible with I2C, PCI, SPI, UART, and USB buses. This component is suitable for applications requiring high-speed data processing in compact electronic devices.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8P1A by NXP Semiconductors

LS1026AXE8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8Q1A by NXP Semiconductors

LS1026AXE8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.61 mm;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8T1A by NXP Semiconductors

LS1026AXE8T1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8MQA by NXP Semiconductors

LS1026AXN8MQA

NXP Semiconductors

LS1026AXN8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and a square shape measuring 23mm x 23mm.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8P1A by NXP Semiconductors

LS1026AXN8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8Q1A by NXP Semiconductors

LS1026AXN8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8T1A by NXP Semiconductors

LS1026AXN8T1A

NXP Semiconductors

LS1026AXN8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, USB buses and has a max supply voltage of 1.03V. Ideal for applications requiring high-speed data processing and connectivity.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASE8MQA by NXP Semiconductors

LS1046ASE8MQA

NXP Semiconductors

LS1046ASE8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and CMOS technology.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASE8P1A by NXP Semiconductors

LS1046ASE8P1A

NXP Semiconductors

LS1046ASE8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a square package shape, and CMOS technology. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASE8T1A by NXP Semiconductors

LS1046ASE8T1A

NXP Semiconductors

LS1046ASE8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, USB buses and has a CMOS technology with 14-bit address bus width. Ideal for high-performance computing applications.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASN8MQA by NXP Semiconductors

LS1046ASN8MQA

NXP Semiconductors

LS1046ASN8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, and USB bus compatibility. The package style is grid array with fine pitch terminals in a square shape measuring 23mm x 23mm.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASN8Q1A by NXP Semiconductors

LS1046ASN8Q1A

NXP Semiconductors

LS1046ASN8Q1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width and 14-bit address bus width. It features a grid array, fine pitch package style and is compatible with I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring high-speed data processing in compact electronic devices.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASN8T1A by NXP Semiconductors

LS1046ASN8T1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 14;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXE8P1A by NXP Semiconductors

LS1046AXE8P1A

NXP Semiconductors

LS1046AXE8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, and USB buses and is ideal for applications requiring high-speed data processing and connectivity.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXE8T1A by NXP Semiconductors

LS1046AXE8T1A

NXP Semiconductors

LS1046AXE8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals, and 14-bit address bus width. It is ideal for applications requiring I2C, PCI, SPI, UART, and USB bus compatibility in a compact square package with bottom terminal position.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXN8MQA by NXP Semiconductors

LS1046AXN8MQA

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Width: 23 mm;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXN8Q1A by NXP Semiconductors

LS1046AXN8Q1A

NXP Semiconductors

LS1046AXN8Q1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, and USB bus compatibility. The package style is grid array with fine pitch terminals in a square shape measuring 23mm x 23mm.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXN8T1A by NXP Semiconductors

LS1046AXN8T1A

NXP Semiconductors

LS1046AXN8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring high-speed data processing and connectivity in compact designs.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MIMX8MM6CVTKZAA by NXP Semiconductors

MIMX8MM6CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM6CVTKZAA is a multi-functional SoC with 288K RAM, suitable for industrial applications. It features a max supply voltage of 1V and operates in temperatures ranging from -40 to 105°C. With compatibility for Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB interfaces, it offers versatile connectivity options.

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

S-PBGA-B486

e2

14 mm

3

16

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

288K

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN6CVTIZAA by NXP Semiconductors

MIMX8MN6CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260;

e2

3

260

TIN SILVER

40

SYSTEM ON CHIP