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NXP Semiconductors Multi-functional Peripherals 104

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LS1017AXE7HNA by NXP Semiconductors

LS1017AXE7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXN7KQA by NXP Semiconductors

LS1017AXN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7HNA by NXP Semiconductors

LS1027ASN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7KQA by NXP Semiconductors

LS1027ASN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXE7NQA by NXP Semiconductors

LS1027AXE7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7HNA by NXP Semiconductors

LS1017ASN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7KQA by NXP Semiconductors

LS1017ASN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MN1CVPIZAA by NXP Semiconductors

MIMX8MN1CVPIZAA

NXP Semiconductors

SYSTEM ON CHIP; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e6; Terminal Finish: Tin/Bismuth (Sn/Bi); Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

e6

3

260

Tin/Bismuth (Sn/Bi)

40

SYSTEM ON CHIP