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OTHER Multi-functional Peripherals 37

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
VCE6467TZUTL1 by Texas Instruments

VCE6467TZUTL1

Texas Instruments

Multifunction Peripherals; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;

0

32

YES

I2C; USB

35 MHz

0

FIXED POINT

S-PBGA-B529

19 mm

4

33

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

128

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

30

19 mm

CC1111F16RSPR by Texas Instruments

CC1111F16RSPR

Texas Instruments

The Texas Instruments CC1111F16RSPR is a CMOS chip carrier with 36 terminals in a square package. It features nickel palladium gold terminal finish, 0.5mm pitch, and 0.9mm seated height. Ideal for applications requiring multi-functional peripherals in compact spaces.

S-XQCC-N36

e4

6 mm

3

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1111F16RSP by Texas Instruments

CC1111F16RSP

Texas Instruments

The Texas Instruments CC1111F16RSP is a CMOS chip carrier with 36 terminals, 0.5mm pitch, and 0.9mm seated height. It can withstand peak reflow temperatures of 260°C for up to 30 seconds. Ideal for applications requiring multi-functional peripherals in compact spaces.

S-XQCC-N36

e4

6 mm

3

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1111F32RSP by Texas Instruments

CC1111F32RSP

Texas Instruments

CC1111F32RSP by Texas Instruments is a 8051 CPU family chip carrier with 4096 RAM bytes. It features 21 I/O lines, operates b/w 0-85°C, and has a terminal pitch of 0.5mm. Ideal for applications requiring multi-functional peripherals in compact spaces.

8051

S-PQCC-N36

e4

6 mm

3

21

36

85 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

4096

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1111F8RSPR by Texas Instruments

CC1111F8RSPR

Texas Instruments

The Texas Instruments CC1111F8RSPR is a CMOS chip carrier with 36 terminals, 0.5mm pitch, and 0.9mm seated height. It features nickel palladium gold finish and can withstand peak reflow temperature of 260°C for up to 30s. Ideal for applications requiring multi-functional peripherals in compact spaces.

S-XQCC-N36

e4

6 mm

3

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1111F8RSP by Texas Instruments

CC1111F8RSP

Texas Instruments

Multifunction Peripherals; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

8051

S-PQCC-N36

e4

6 mm

3

21

36

85 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

4096

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

STPCC5HEBC by STMicroelectronics

STPCC5HEBC

STMicroelectronics

STPCC5HEBC by STMicroelectronics is a multifunction peripheral IC with a max supply voltage of 2.7V and operates within -40 °C to 85°C. It features a 32-bit address bus and supports PCI/ISA bus compatibility. Ideal for compact, high-performance applications in embedded systems.

32

YES

PCI; ISA

14.318 MHz

32

S-PBGA-B388

e0

35 mm

388

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA388,26X26,40

SQUARE

GRID ARRAY

3.3

Not Qualified

2.38 mm

Multifunction Peripherals

2.7 V

2.45 V

2.5 V

YES

CMOS

OTHER

TIN LEAD

BALL

1.27 mm

BOTTOM

35 mm

MULTIFUNCTION PERIPHERAL

STPCI2GDYI by STMicroelectronics

STPCI2GDYI

STMicroelectronics

STPCI2GDYI by STMicroelectronics is a multi-functional peripheral with 32-bit address bus width and 516 terminals. It operates b/w 0-85 °C, supports USB, PCI, ISA, PCMCIA buses, and has a clock frequency of 14.31818 MHz. Ideal for applications requiring high-speed data processing in compact electronic devices.

ALSO REQUIRES 3.3V SUPPLY

32

YES

USB; PCI; ISA; PCMCIA

14.31818 MHz

32

S-PBGA-B516

e0

35 mm

24

516

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,50

SQUARE

GRID ARRAY

2.5,3.3

Not Qualified

2.38 mm

Other Microprocessor ICs

2.7 V

2.45 V

2.5 V

YES

CMOS

OTHER

TIN LEAD

BALL

1.27 mm

BOTTOM

35 mm

STPCI2HEYC by STMicroelectronics

STPCI2HEYC

STMicroelectronics

STPCI2HEYC by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 2.7V, supporting USB and PCI bus compatibility. It features a 32-bit address bus width and operates at temperatures from 0 °C to 85°C. Ideal for compact applications, it comes in a square grid array package with 516 terminals.

ALSO REQUIRES 3.3V SUPPLY

32

YES

USB; PCI; ISA; PCMCIA

14.31818 MHz

32

S-PBGA-B516

e0

35 mm

24

516

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,50

SQUARE

GRID ARRAY

2.5,3.3

Not Qualified

2.38 mm

Other Microprocessor ICs

2.7 V

2.45 V

2.5 V

YES

CMOS

OTHER

TIN LEAD

BALL

1.27 mm

BOTTOM

35 mm

MCIMX6G2DVK05AB by NXP Semiconductors

MCIMX6G2DVK05AB

NXP Semiconductors

MCIMX6G2DVK05AB by NXP Semiconductors is a multi-functional peripheral IC with integrated cache and low power mode. It features an address bus width of 26, external data bus width of 16, and operates at a speed of 528 rpm. Ideal for applications requiring high-speed processing in compact electronic devices.

26

YES

16

FIXED POINT

YES

S-PBGA-B272

9 mm

YES

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G2DVM05AB by NXP Semiconductors

MCIMX6G2DVM05AB

NXP Semiconductors

MCIMX6G2DVM05AB by NXP Semiconductors is a Multi-functional Peripherals IC with 16-bit external data bus width, integrated cache, and low power mode. It operates b/w 0-95 °C and has a max supply voltage of 1.3 V. Ideal for applications requiring high-speed processing in compact devices.

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e1

14 mm

YES

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G3DVM05AB by NXP Semiconductors

MCIMX6G3DVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e1

14 mm

YES

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

OMAP3530ECBBLPD by Texas Instruments

OMAP3530ECBBLPD

Texas Instruments

OMAP3530ECBBLPD by Texas Instruments features 64K RAM, 16-bit external data bus, and 38.4 MHz clock frequency. Ideal for microprocessor applications requiring low power mode and compatibility with CAN, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B515

e1

12 mm

YES

3

188

515

90 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

64K

.9 mm

720 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MICROPROCESSOR, RISC

66AK2H06DAAW24 by Texas Instruments

66AK2H06DAAW24

Texas Instruments

The Texas Instruments 66AK2H06DAAW24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It is a microprocessor suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The device operates b/w temperatures of 0 to 85°C and features a terminal pitch of 1mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H06DAAW2 by Texas Instruments

66AK2H06DAAW2

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12DAAW24 by Texas Instruments

66AK2H12DAAW24

Texas Instruments

The Texas Instruments 66AK2H12DAAW24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It is a microprocessor with RISC technology, suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The package style is grid array with 1517 terminals in a square shape measuring 40mm x 40mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12DAAW2 by Texas Instruments

66AK2H12DAAW2

Texas Instruments

The Texas Instruments 66AK2H12DAAW2 is a multi-functional peripheral with 32-bit address bus width and 128 external data bus width. It is a microprocessor RISC type IC suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. With a package style of grid array and terminal pitch of 1mm, it operates b/w 0 to 85°C temperature range.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H14DAAW24 by Texas Instruments

66AK2H14DAAW24

Texas Instruments

The Texas Instruments 66AK2H14DAAW24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It features a CMOS technology microprocessor with 6M RAM words, suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB bus compatibility. The package style is grid array with 1517 terminals in a square shape measuring 40mm x 40mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

MIMX8ML3DVNLZAB by NXP Semiconductors

MIMX8ML3DVNLZAB

NXP Semiconductors

The NXP Semiconductors MIMX8ML3DVNLZAB is a multi-functional peripheral IC with 548 terminals, 888832 RAM words, and a max clock frequency of 24 MHz. It is suitable for applications requiring Ethernet, I2C, I2S, PCI, SPI, UART, and USB bus compatibility in a compact square package with low profile and fine pitch design.

0

YES

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

24 MHz

0

S-PBGA-B548

15 mm

3

136

16

548

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA548,29X29,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

888832

1.481 mm

2200 mA

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

15 mm

MULTIFUNCTION PERIPHERAL

MIMX8ML8DVNLZAB by NXP Semiconductors

MIMX8ML8DVNLZAB

NXP Semiconductors

The NXP Semiconductors MIMX8ML8DVNLZAB is a multi-functional peripheral IC with 548 terminals, operating at 24 MHz clock frequency. It supports various bus compatibilities like Ethernet, I2C, and USB. This CMOS technology chip has a low profile package style and is suitable for applications requiring high-speed data processing in compact electronic devices.

0

YES

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

24 MHz

0

S-PBGA-B548

15 mm

3

136

16

548

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA548,29X29,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

888832

1.481 mm

2200 mA

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

15 mm

MULTIFUNCTION PERIPHERAL

MIMX8ML6DVNLZAB by NXP Semiconductors

MIMX8ML6DVNLZAB

NXP Semiconductors

The NXP Semiconductors MIMX8ML6DVNLZAB is a multi-functional peripheral IC with 548 terminals, operating at a max clock frequency of 24 MHz. It supports various bus compatibilities like Ethernet, I2C, and USB, making it ideal for applications requiring high-speed data processing in compact electronic devices. With a low profile package style and CMOS technology, this component offers efficient performance in space-constrained environments.

0

YES

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

24 MHz

0

S-PBGA-B548

15 mm

3

136

16

548

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA548,29X29,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

888832

1.481 mm

2200 mA

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

15 mm

MULTIFUNCTION PERIPHERAL

LS1027ASE7HNA by NXP Semiconductors

LS1027ASE7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASE7HNA by NXP Semiconductors

LS1017ASE7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7NQA by NXP Semiconductors

LS1017ASN7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7PQA by NXP Semiconductors

LS1017ASN7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASE7KQA by NXP Semiconductors

LS1017ASE7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASE7NQA by NXP Semiconductors

LS1017ASE7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASE7KQA by NXP Semiconductors

LS1027ASE7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7PQA by NXP Semiconductors

LS1027ASN7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASE7NQA by NXP Semiconductors

LS1027ASE7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASE7PQA by NXP Semiconductors

LS1027ASE7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7NQA by NXP Semiconductors

LS1027ASN7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASE7PQA by NXP Semiconductors

LS1017ASE7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7HNA by NXP Semiconductors

LS1027ASN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7KQA by NXP Semiconductors

LS1027ASN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7HNA by NXP Semiconductors

LS1017ASN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7KQA by NXP Semiconductors

LS1017ASN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL