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780 Microprocessors 51

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LS1046ASE8Q1A by NXP Semiconductors

LS1046ASE8Q1A

NXP Semiconductors

LS1046ASE8Q1A by NXP Semiconductors is a microprocessor with a package shape of square and 780 terminals. It has a max seated height of 2.07 mm and operates at a speed of 64 rpm. This processor is commonly used in various applications requiring high-performance computing.

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

2.07 mm

64 rpm

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXE7PQB by NXP Semiconductors

T1042NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Bit Size: 32;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7MQB by NXP Semiconductors

T1022NSE7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7PQB by NXP Semiconductors

T1022NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7WQB by NXP Semiconductors

T1022NSE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Speed: 1500 rpm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7MQB by NXP Semiconductors

T1022NSN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7PQB by NXP Semiconductors

T1022NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7WQB by NXP Semiconductors

T1022NSN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 16;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXE7MQB by NXP Semiconductors

T1022NXE7MQB

NXP Semiconductors

The NXP Semiconductors T1022NXE7MQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. With a max clock frequency of 133.3 MHz, it is suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems. The package style is grid array, fine pitch, making it ideal for surface mount assembly in compact electronic devices.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXE7WQB by NXP Semiconductors

T1022NXE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXN7MQB by NXP Semiconductors

T1022NXN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXN7PQB by NXP Semiconductors

T1022NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Boundary Scan: YES;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NXN7WQB by NXP Semiconductors

T1022NXN7WQB

NXP Semiconductors

The NXP Semiconductors T1022NXN7WQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. Operating at a max clock frequency of 133.3 MHz, it is suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems. With low power mode enabled, it offers efficient performance in a compact square package measuring 23mm x 23mm.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSE7MQB by NXP Semiconductors

T1042NSE7MQB

NXP Semiconductors

The NXP Semiconductors T1042NSE7MQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. With a max clock frequency of 133.3 MHz, it is suitable for high-speed computing applications requiring low power mode operation. The package style is grid array, fine pitch, making it ideal for compact designs in various electronic devices.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSE7PQB by NXP Semiconductors

T1042NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSE7WQB by NXP Semiconductors

T1042NSE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSN7MQB by NXP Semiconductors

T1042NSN7MQB

NXP Semiconductors

The NXP Semiconductors T1042NSN7MQB microprocessor features a 32-bit architecture with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 133.3 MHz, making it suitable for high-speed computing applications. With low power mode support and CMOS technology, this processor is ideal for energy-efficient systems requiring fast processing capabilities.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSN7PQB by NXP Semiconductors

T1042NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NSN7WQB by NXP Semiconductors

T1042NSN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXE7MQB by NXP Semiconductors

T1042NXE7MQB

NXP Semiconductors

The NXP Semiconductors T1042NXE7MQB microprocessor features a 32-bit architecture with a clock frequency of 133.3 MHz, ideal for high-speed applications. With integrated cache and low power mode, it offers efficient performance at a supply voltage range of 0.97 V to 1.03 V. This square-shaped processor in grid array package is suitable for various RISC-based systems requiring fast data processing.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXE7WQB by NXP Semiconductors

T1042NXE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.07 mm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXN7MQB by NXP Semiconductors

T1042NXN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Speed: 1200 rpm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXN7PQB by NXP Semiconductors

T1042NXN7PQB

NXP Semiconductors

T1042NXN7PQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max clock frequency of 133.3 MHz. It is commonly used in applications requiring high-speed processing, such as networking and telecommunications.

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1042NXN7WQB by NXP Semiconductors

T1042NXN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Speed: 1500 rpm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8TTB by NXP Semiconductors

T2081NSN8TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8MQLB by NXP Semiconductors

T2081NSE8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8P1B by NXP Semiconductors

T2081NSE8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8PTB by NXP Semiconductors

T2081NSE8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8T1B by NXP Semiconductors

T2081NSE8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8TTB by NXP Semiconductors

T2081NSE8TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8MQLB by NXP Semiconductors

T2081NSN8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8P1B by NXP Semiconductors

T2081NSN8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8PTB by NXP Semiconductors

T2081NSN8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8T1B by NXP Semiconductors

T2081NSN8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8MQLB by NXP Semiconductors

T2081NXE8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8P1B by NXP Semiconductors

T2081NXE8P1B

NXP Semiconductors

The NXP Semiconductors T2081NXE8P1B microprocessor features a 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates in temperatures ranging from -40 to 105°C and offers low power mode for energy efficiency.

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8PTB by NXP Semiconductors

T2081NXE8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8T1B by NXP Semiconductors

T2081NXE8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8TTB by NXP Semiconductors

T2081NXE8TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8MQLB by NXP Semiconductors

T2081NXN8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8P1B by NXP Semiconductors

T2081NXN8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8PTB by NXP Semiconductors

T2081NXN8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8T1B by NXP Semiconductors

T2081NXN8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8TTB by NXP Semiconductors

T2081NXN8TTB

NXP Semiconductors

The NXP Semiconductors T2081NXN8TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. The package style is grid array with 780 terminals in a square shape.

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

LS1043ASE8PQB by NXP Semiconductors

LS1043ASE8PQB

NXP Semiconductors

LS1043ASE8PQB by NXP Semiconductors is a 64-bit microprocessor with integrated cache, 32-bit external data bus width, and low power mode. It is used in System on Chip (SoC) applications for high-speed processing at temperatures up to 105°C.

ALSO OPERATES AT 1V NOMINAL SUPPLY

14

64

YES

32

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SoC

LS1043ASN8MQB by NXP Semiconductors

LS1043ASN8MQB

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V NOMINAL SUPPLY

14

64

YES

32

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

30

23 mm

SoC

T1040NSN7WQB by NXP Semiconductors

T1040NSN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1040NXN7PQB by NXP Semiconductors

T1040NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC