Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
MC33PF8100CFESR2
NXP Semiconductors
POWER SUPPLY MANAGEMENT CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
POWER SUPPLY MANAGEMENT CIRCUIT
e3
3
260
TIN
40
MC33PF8100CHESR2
POWER SUPPLY MANAGEMENT CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
MC33PF8100CHES
POWER SUPPLY MANAGEMENT CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
MC33PF8100EAESR2
MC33PF8100EAESR2 by NXP Semiconductors is a Power Management IC with 12 channels, Vsup ranging from 2.5V to 5.5V, and adjustable threshold at +2.8V. It comes in a square chip carrier package suitable for power supply management circuits, with a temperature range of -40 to 105°C.
YES
S-PQCC-N56
8 mm
12
1
56
105 Cel
-40 Cel
PLASTIC/EPOXY
HVQCCN
LCC56,.31SQ,20
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1 mm
5.5 V
2.5 V
5 V
NO LEAD
.5 mm
QUAD
+2.8V
MC33PF8100EAES
MC33PF8100EAES by NXP Semiconductors is a Power Management IC with 5V nominal voltage, 12 channels, and adjustable threshold. It is used in power supply management circuits, featuring a package style of CHIP CARRIER and operating temperatures from -40 to 105°C.
MC33PF8100EPESR2
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
INDUSTRIAL
MC33PF8100EPES
MC33PF8100EPES by NXP Semiconductors is a Power Management IC with 12 channels, Vsup range of 2.7-5.5V, and operating temp from -40 to 105°C. It comes in a square chip carrier package with tin finish terminals, suitable for industrial applications requiring precise power supply management.
2.7 V
MC33PF8100EQESR2
MC33PF8100EQES
MC33PF8100EQES by NXP Semiconductors is a Power Management IC with 12 channels, operating at -40 to 105°C. It has a supply voltage range of 2.7V to 5.5V and features adjustable threshold levels. This chip carrier package is suitable for industrial applications requiring precise power supply management.
MC33PF8100ERESR2
POWER SUPPLY MANAGEMENT CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
MC33PF8100ERES
POWER SUPPLY MANAGEMENT CIRCUIT; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
MC33PF8100F3ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
MC33PF8100F3ES
POWER SUPPLY MANAGEMENT CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
MC33PF8101A0ESR2
9
MC33PF8200A0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;
MC33PF8200A0ES
MC33PF8200A0ES by NXP Semiconductors is a Power Management IC with 56 terminals, operating b/w -40 to 105°C. It has a nominal voltage of 5V and supports up to 12 channels. Ideal for applications requiring precise power supply management in compact spaces.
MC33PF8200CXESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PQCC-N56;
MC33PF8200CXES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;
MC33PF8200D2ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
MC33PF8200D2ES
MC33PF8200D2ES by NXP Semiconductors is a Power Management IC with 12 channels, Vsup ranging from 2.5V to 5.5V, and adjustable threshold of +2.8V. It comes in a square chip carrier package suitable for power supply management circuits, with an operating temperature range of -40°C to 105°C.
MC33PF8200DBESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Finish: TIN;
MC33PF8200DBES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 5.5 V;
MC33PF8200DEESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;
MC33PF8200DEES
MC33PF8200DFESR2
MC33PF8200DFES
MC33PF8200DFES by NXP Semiconductors is a Power Management IC with 56 terminals, operating b/w -40 to 105 °C. It has a supply voltage range of 2.5V to 5.5V and features 12 channels for power supply management circuits. This chip carrier with a very thin profile is suitable for applications requiring precise power control in compact spaces.
MC33PF8200DHESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;
MC33PF8200DHES
MC33PF8200EMESR2
MC33PF8200EMES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 105 Cel;
MC33PF8200ESESR2
MC33PF8200ESES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;
MC33PF8200ETESR2
MC33PF8200ETES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;
MC33PF8201A0ESR2
MC33PF8201A0ES
MC33PF8201A0ES by NXP Semiconductors is a Power Management IC with 56 terminals, operating from -40 to 105°C. It has a supply voltage range of 2.7-5.5V and features 9 channels for industrial applications requiring precise power supply management in compact spaces.
MC34PF8101A0EPR2
MC34PF8101A0EP
BQ25125YFPT
Texas Instruments
BQ25125YFPT by Texas Instruments is a Power Management IC with 25 terminals, operating b/w -40 to 85°C. It has a nominal voltage of 5V and supports adjustable threshold. Ideal for industrial applications requiring precise power supply management in compact spaces.
ALSO REQUIRES 3.4V TO 20V SUPPLY
R-PBGA-B25
e1
2.53 mm
25
85 Cel
VFBGA
RECTANGULAR
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
3.4 V
TIN SILVER COPPER
BALL
.4 mm
BOTTOM
30
2.468 mm
PT7A7613M8-13
Diodes Incorporated
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE; Surface Mount: YES;
NO
S-PDSO-G8
3 mm
8
TSSOP
TSSOP8,.19
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
NOT SPECIFIED
1.1 mm
.2 mA
3 V
3.3 V
GULL WING
.65 mm
DUAL
+3.08V
PT7A7613S-13
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
R-PDSO-G8
4.9 mm
SOP
SOP8,.24
SMALL OUTLINE
1.6 mm
1.27 mm
3.85 mm
PT7A7614S-13
+2.93V
MC32PF1550A0EPR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 7;
S-PQCC-N40
5 mm
7
QCCN
.9 mm
4.5 V
3.6 V
+6.5V
MC32PF1550A9EPR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;
e4
NICKEL PALLADIUM GOLD
MC32PF1550A9EP
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.5 V;
L5965SQ-V0T
STMicroelectronics
L5965SQ-V0T by STMicroelectronics is a robust power management IC designed for automotive applications, featuring a nominal voltage of 14V and operating temperatures from -40 °C to 125 °C. It supports up to 7 channels with adjustable thresholds at +3.2/3.4V. This compact chip carrier design ensures efficient performance in demanding environments.
S-XQCC-N48
7 mm
48
125 Cel
UNSPECIFIED
HQCCN
LCC48,.28SQ,20
CHIP CARRIER, HEAT SINK/SLUG
AEC-Q100
1.05 mm
32 V
4 V
14 V
AUTOMOTIVE
+3.2,3.4V
MC33PF8100FJESR2
MC33PF8100FJES
MC33PF8100FJES by NXP Semiconductors is a Power Management IC with 12 channels, 56 terminals, and adjustable threshold voltage of +2.8V. It operates b/w -40 to 105 °C and has a package style of CHIP CARRIER. Ideal for power supply management circuits in various applications.
© 2023 All rights reserved
