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MC33PF8200DEES

NXP Semiconductors

MC33PF8200DEES by NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

Median Price

$10.590

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 360 parts In-Stock

1+ parts

$10.590

100+ parts

$7.100

1k+ parts

$6.780

10k+ parts

-

360

$10.590

$7.100

$6.780

-

Chip1Stop

Japan . 110 parts In-Stock

1+ parts

$11.600

100+ parts

$7.770

1k+ parts

$6.990

10k+ parts

$6.210

110

$11.600

$7.770

$6.990

$6.210

DigiKey

USA . 65 parts In-Stock

1+ parts

$11.770

100+ parts

$7.881

1k+ parts

$7.335

10k+ parts

$7.171

65

$11.770

$7.881

$7.335

$7.171

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.936

10k+ parts

-

9,880

-

-

$6.936

-

Future Electronics

Canada . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.370

10k+ parts

-

260

-

-

$5.370

-

EBV Elektronik

Germany . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

260

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,752 parts In-Stock

1+ parts

$9.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,752

$9.700

-

-

-

Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Vyrian

USA . 4,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,294

-

-

-

-

Anansix

USA . 1,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,251

-

-

-

-

NAC Semi

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.520

10k+ parts

-

520

-

-

$8.520

-

TME

Poland . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.130

10k+ parts

-

260

-

-

$8.130

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 625 parts In-Stock

1+ parts

$9.189

100+ parts

-

1k+ parts

-

10k+ parts

-

625

$9.189

-

-

-

Microchip USA

USA . 1,283 parts In-Stock

1+ parts

$25.793

100+ parts

-

1k+ parts

-

10k+ parts

-

1,283

$25.793

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

UNI Independent Distributors

Spain . 3,682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,682

-

-

-

-

Futuretech Components

Singapore . 2,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,600

-

-

-

-

Technical Specifications

Power Management ICs MC33PF8200DEES attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.8V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33PF8200DEES Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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