Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
L5965SQ-V0Y
STMicroelectronics
L5965SQ-V0Y by STMicroelectronics is a robust power management IC designed for automotive applications, featuring a nominal voltage of 14V and operating temperature range from -40 °C to 125 °C. It supports up to 7 channels with adjustable thresholds at +3.2/3.4V. This surface-mount device ensures reliability with AEC-Q100 screening and a compact chip carrier design.
YES
POWER SUPPLY MANAGEMENT CIRCUIT
S-XQCC-N48
7 mm
3
7
1
48
125 Cel
-40 Cel
UNSPECIFIED
HQCCN
LCC48,.28SQ,20
SQUARE
CHIP CARRIER, HEAT SINK/SLUG
AEC-Q100
1.05 mm
32 V
4 V
14 V
AUTOMOTIVE
NO LEAD
.5 mm
QUAD
+3.2,3.4V
MCP1318T-29LE/OTVAO
Microchip Technology
MCP1318T-29LE/OTVAO by Microchip Tech is a 5-terminal power management IC with nominal voltage of 1.5V and threshold voltage of +2.9V. It's AEC-Q100 screened, suitable for automotive applications, operates b/w -40 to 125 °C, and has a low profile package style for space-constrained designs.
RESET THRESHOLD VOLTAGE IS 2.9V
NO
R-PDSO-G5
2.95 mm
5
PLASTIC/EPOXY
LSSOP
TSOP5/6,.11,37
RECTANGULAR
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
1.45 mm
.01 mA
5.5 V
1 V
1.5 V
GULL WING
.95 mm
DUAL
+2.9V
1.625 mm
MCP1320T-29LE/OTVAO
MCP1320T-29LE/OTVAO by Microchip is a Power Management IC with AEC-Q100 screening for automotive applications. It operates at -40 to 125 °C, with Vsup ranging from 1V to 5.5V. This IC has a small outline package, matte tin finish, and dual terminal position for compact designs in automotive power supply management circuits.
RESET THRESHOLD VOLTAGE IS 2.9V; MANUAL RESET INPUT
e3
MATTE TIN
MCP1321T-29LE/OTVAO
MCP1321T-29LE/OTVAO by Microchip: Power Management IC with 5 terminals, Vsup of 1.5V, and AEC-Q100 screening for automotive applications. Small outline package, dual terminal position, and low profile design make it suitable for power supply management circuits in automotive systems. Operating temperature range from -40 to 125 °C with a max seated height of 1.45mm.
PT7M823LW5-7
Diodes Incorporated
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
3 mm
85 Cel
SOP5/6,.11,.37
NOT SPECIFIED
1.3 mm
.036 mA
4.5 V
5 V
INDUSTRIAL
+4.63 V
1.6 mm
MIC826RYMT-T5
MIC826RYMT-T5 by Microchip Tech is a Power Management IC with 6 terminals, operating from -40 to 125 °C. It has a supply voltage range of 2.7V to 3.6V and threshold voltage of +2.625V, suitable for automotive applications due to its small form factor and lead-free terminal finish.
THRESHOLD VOLTAGE= 2.625 V
S-PDSO-N6
e4
6
VSON
SMALL OUTLINE, VERY THIN PROFILE
260
.6 mm
3.6 V
2.7 V
3 V
NICKEL PALLADIUM GOLD
+2.625V
40
MIC826YYMT-T5
MIC826YYMT-T5 by Microchip Technology is a Power Management IC with 6 terminals, operating b/w -40 to 125 °C. It has a small outline package style, suitable for automotive applications. With a supply voltage range of 2.25V to 2.75V and a threshold voltage of +2.188V, it offers efficient power supply management in compact designs.
THRESHOLD VOLTAGE= 2.188 V
2.75 V
2.25 V
+2.188V
ISL91211AIIZ-T
Renesas Electronics
Renesas Electronics' ISL91211AIIZ-T is a Power Management IC with 3 channels, Vsup range of 2.5V to 5.5V, and adjustable threshold voltage of +2.58V. It comes in a rectangular package style with 54 terminals suitable for power supply management circuits in various applications.
R-PBGA-B54
3.67 mm
54
VFBGA
BGA54,6X9,16
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.55 mm
2.5 V
3.7 V
BALL
.4 mm
BOTTOM
+2.58V
2.551 mm
ISL91211BIIZ-T
ISL91211BIIZ-T by Renesas Electronics is a Power Management IC with 54 terminals, operating b/w -40 to 85°C. It features a nominal voltage of 3.7V and supports adjustable threshold voltage up to +2.58V. Ideal for applications requiring precise power supply management in compact spaces with its very thin profile grid array package style.
R-XBGA-B54
4
ISL91302BIIZ-T
ISL91302BIIZ-T by Renesas Electronics is a Power Management IC with 54 terminals, operating b/w -40 to 85°C. It has a nominal voltage of 3.7V and adjustable threshold of 2.6V, suitable for power supply management circuits in various applications. The package style is grid array with very thin profile and fine pitch, making it ideal for compact designs requiring precise power control.
.006 mA
2.6
MCP1316T-46FE/OT
MCP1316T-46FE/OT by Microchip Tech is a Power Management IC with 3V supply voltage, -40 to 125°C operating temp range, and automotive grade. It has 5 terminals, matte tin finish, and adjustable threshold voltage of +4.6V. Ideal for power supply management circuits in compact applications requiring low profile components.
2.9 mm
TS 16949
+4.6V
1.55 mm
LC051281XA-MH
Onsemi
LC051281XA-MH by Onsemi is a Power Management IC with 8 terminals, operating at -30 to 85 °C. It has a nominal voltage of 7V and supports a max supply current of 0.01mA. Ideal for power supply management circuits, this IC features a very thin profile package style in plastic/epoxy material.
R-PBGA-B8
e1
1.11 mm
8
-30 Cel
BGA8(UNSPEC)
8 V
6 V
7 V
CMOS
OTHER
TIN SILVER COPPER
.19 mm
+3.5V
30
1.01 mm
MC33FS5502Y0ESR2
NXP Semiconductors
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;
S-PQCC-N56
8 mm
56
HVQCCN
LCC56,.31SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1 mm
60 V
TIN
+7.5V
MC33FS5502Y0ES
MC33FS5502Y0ES by NXP Semiconductors is a Power Management IC with 4 channels, adjustable threshold voltage of +7.5V, and max supply voltage of 60V. It is designed for automotive applications meeting AEC-Q100 standards, featuring a package style of CHIP CARRIER and operating temperature range from -40 to 125 °C.
MC33FS5502Y3ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;
MPF5023AMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
MPF5023AMMA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
MPF5023AMMA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: TIN;
MPF5023AMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
MPF5024AVNA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3;
MPF5024AMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
MPF5024AMMA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
BQ21062YFPT
Texas Instruments
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
R-PBGA-B20
2.015 mm
20
BGA20,4X5,16
1.6 mA
5.25 V
3.15 V
+2.54V
1.615 mm
MPF7100BVBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 105 Cel;
S-PQCC-N48
105 Cel
+2.8V
MPF7100BVMA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;
MPF7100BVMA1ES
MPF7100BVMA1ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;
MPF7100BVMA3ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 7 mm;
MPF7100BVBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 7 mm;
MPF7100BVBA1ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;
MPF7100BVBA4ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;
MPF7100BVMA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;
MPF7100BVMA2ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
MPF7100BVMA4ES
MPF7100BMBA0ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;
MPF7100BVBA1ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +2.8V;
MPF7100BVBA2ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;
MPF7100BVBA3ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.5 V;
MPF7100BVBA3ESR2
MPF7100BVMA2ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 5.5 V;
MPF7100BMBA0ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Adjustable Threshold: YES;
MPF7100BMMA0ESR2
MPF7100BVBA2ES
MPF7100BVBA4ES
MPF7100BVMA3ES
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;
MPF7100BVMA4ESR2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 7;
MWCT1011A3VLH
POWER SUPPLY MANAGEMENT CIRCUIT; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MWCT1001A3VLH
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;
S-PQFP-G64
10 mm
64
LQFP
QFP64,.47SQ,20
FLATPACK, LOW PROFILE
3.3 V
+2.73V
© 2023 All rights reserved
