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L5965SQ-V0Y

STMicroelectronics

L5965SQ-V0Y by STMicroelectronics

L5965SQ-V0Y by STMicroelectronics is a robust power management IC designed for automotive applications, featuring a nominal voltage of 14V and operating temperature range from -40 °C to 125 °C. It supports up to 7 channels with adjustable thresholds at +3.2/3.4V. This surface-mount device ensures reliability with AEC-Q100 screening and a compact chip carrier design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,108 parts In-Stock

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Digiode

USA . 1,679 parts In-Stock

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1,679

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Anansix

USA . 302 parts In-Stock

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302

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Vigor

Singapore . 7,500 parts In-Stock

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$6.280

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7,500

$6.280

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IDEA Electronic Components Group

UK . 245 parts In-Stock

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$18.009

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$16.208

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245

$18.009

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$16.208

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AZTECH Wire

Italy . 1,150 parts In-Stock

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$20.710

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$20.710

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MKK Technologies

India . 1,661 parts In-Stock

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$33.865

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1,661

$33.865

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DigiPath Technology Company

USA . 1,661 parts In-Stock

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$33.865

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1,661

$33.865

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,934 parts In-Stock

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Microchip USA

USA . 3,049 parts In-Stock

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Corphita

USA . 1,842 parts In-Stock

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Parana Technologies

USA . 1,000 parts In-Stock

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$21.532

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$21.532

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Overview

Unlock the potential of your automotive designs with the L5965SQ-V0Y from STMicroelectronics, a leader in power management solutions. This cutting-edge IC ensures exceptional performance across a wide temperature range, delivering reliability and efficiency that you can trust. With its versatile applications and robust design, it empowers engineers to create innovative systems while enhancing energy savings, ultimately driving value and success in every project.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact circuit boards, making it suitable for modern electronic applications where space is a premium.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures that the product meets stringent automotive standards, making it reliable for automotive applications.

Package Shape: SQUARE

The square package shape provides efficient use of board space and allows for better thermal management, essential for power management ICs.

Nominal Supply Voltage (Vsup): 14 V

A nominal supply voltage of 14 V makes it versatile for various power management applications across different industries.

No. of Terminals: 48

With 48 terminals, the IC can handle multiple connections, facilitating complex power management tasks in sophisticated applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The heat sink/slug package style allows for enhanced thermal dissipation, ideal for high-performance power management applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable operation in high-temperature environments, particularly important for automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes it suitable for extreme environments, enhancing its reliability in automotive and industrial applications.

Terminal Position: QUAD

Quad terminal positioning supports efficient PCB layout design and simplifies routing for power and ground connections.

Maximum Seated Height: 1.05 mm

With a low seated height, this IC is suited for compact designs, contributing to slimmer profile applications.

Width: 7 mm

A width of 7 mm allows for flexibility in design and efficient use of space in multi-layer circuit boards.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This IC is specifically designed for power management, ensuring efficient and effective operation for a range of supply needs.

Minimum Supply Voltage (Vsup): 4 V

A minimum supply voltage of 4 V allows for operation in low-voltage environments, increasing the application's versatility.

Length: 7 mm

The compact length of 7 mm enhances integration with other components in tight electronic spaces.

Nominal Threshold Voltage (V): +3.2, 3.4V

Adjustable nominal threshold voltages provide flexibility in design choices for various application requirements.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures robustness and reliability in automotive settings where performance is critical.

No. of Channels: 7

Having 7 channels permits handling of multiple power supplies simultaneously, making it ideal for complex systems.

Terminal Form: NO LEAD

No lead design minimizes PCB footprint and enhances thermal efficiency, which is advantageous for high-density applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for better routing on high-density circuit boards, improving overall design efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate level of moisture sensitivity, ensuring appropriate storage and handling conditions are followed.

Maximum Supply Voltage (Vsup): 32 V

A maximum supply voltage of 32 V provides a wide range of applications and ensures compatibility with various power systems.

Adjustable Threshold: YES

The adjustable threshold feature empowers designers to customize voltage settings, enhancing design flexibility and functionality.

Technical Specifications

Power Management ICs L5965SQ-V0Y attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Screening Level:

AEC-Q100

Maximum Seated Height:

1.05 mm

Maximum Supply Voltage (Vsup):

32 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.2,3.4V

Width (mm):

7 mm

Trade Compliance

L5965SQ-V0Y Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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