Loading...

POWER SUPPLY MANAGEMENT CIRCUIT Power Management ICs 1,357

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage Normal Position (V) No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Output (V) Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Protection(s) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Maximum Switch-on Time Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
TPS65911AA2NMAR by Texas Instruments

TPS65911AA2NMAR

Texas Instruments

TPS65911AA2NMAR by Texas Instruments is a Power Management IC with 98 terminals, operating at -40 to 85 °C. It features a max switching frequency of 3300 kHz and is ideal for industrial applications requiring power supply management circuits.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PBGA-B98

e1

9 mm

3

13

1

13

98

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA98,8X13,25

RECTANGULAR

GRID ARRAY

260

1 mm

5.5 V

2.7 V

3.8 V

YES

3300 kHz

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

+2.1V

30

6 mm

TPS65911AA2NMAT by Texas Instruments

TPS65911AA2NMAT

Texas Instruments

TPS65911AA2NMAT by Texas Instruments is a Power Management IC with 98 terminals, operating at -40 to 85°C. It features a max switching frequency of 3300 kHz and supports 13 channels for industrial applications. The IC has a package style of GRID ARRAY, terminal finish of TIN SILVER COPPER, and nominal voltage of 3.8V.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PBGA-B98

e1

9 mm

3

13

1

13

98

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA98,8X13,25

RECTANGULAR

GRID ARRAY

260

1 mm

5.5 V

2.7 V

3.8 V

YES

3300 kHz

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

+2.1V

30

6 mm

TPS6591133A2NMA by Texas Instruments

TPS6591133A2NMA

Texas Instruments

TPS6591133A2NMA by Texas Instruments is a Power Management IC with 98 terminals, operating at -40 to 85°C. It features a max switching frequency of 3300 kHz and is ideal for industrial applications requiring power supply management circuits.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PBGA-B98

e1

9 mm

3

13

1

13

98

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA98,8X13,25

RECTANGULAR

GRID ARRAY

260

1 mm

5.5 V

2.7 V

3.8 V

YES

3300 kHz

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

+2.1V

30

6 mm

MC33FS8420G0ESR2 by NXP Semiconductors

MC33FS8420G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8415G0ES by NXP Semiconductors

MC33FS8415G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A2ESR2 by NXP Semiconductors

MC33FS8510A2ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510D3ESR2 by NXP Semiconductors

MC33FS8510D3ESR2

NXP Semiconductors

MC33FS8510D3ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125 °C. It has a supply voltage range of 5.1V to 36V and a max current of 25mA. Ideal for automotive applications due to AEC-Q100 screening level and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A0ESR2 by NXP Semiconductors

MC33FS8510A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G6ES by NXP Semiconductors

MC33FS8410G6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G0ESR2 by NXP Semiconductors

MC33FS8410G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G5ESR2 by NXP Semiconductors

MC33FS8400G5ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G0ESR2 by NXP Semiconductors

MC33FS8400G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A4ESR2 by NXP Semiconductors

MC33FS8530A4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A1ESR2 by NXP Semiconductors

MC33FS8530A1ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8520A0ES by NXP Semiconductors

MC33FS8520A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Current (Isup): 25 mA;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8405G0ES by NXP Semiconductors

MC33FS8405G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G0ES by NXP Semiconductors

MC33FS8410G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G3ESR2 by NXP Semiconductors

MC33FS8410G3ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G6ESR2 by NXP Semiconductors

MC33FS8410G6ESR2

NXP Semiconductors

MC33FS8410G6ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and max current of 25mA. Ideal for power supply management circuits in automotive applications due to AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G0ES by NXP Semiconductors

MC33FS8430G0ES

NXP Semiconductors

MC33FS8430G0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating voltage range of 5.1V to 36V, and AEC-Q100 screening level. It features a package style of CHIP CARRIER and is suitable for automotive power supply management applications.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G0ESR2 by NXP Semiconductors

MC33FS8430G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G2ES by NXP Semiconductors

MC33FS8430G2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Finish: TIN;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G4ES by NXP Semiconductors

MC33FS8430G4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8435G0ES by NXP Semiconductors

MC33FS8435G0ES

NXP Semiconductors

MC33FS8435G0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125 °C. It has a supply voltage range of 5.1V to 36V and a max current of 25mA. This chip carrier package is suitable for power supply management circuits in automotive applications due to its AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8435G0ESR2 by NXP Semiconductors

MC33FS8435G0ESR2

NXP Semiconductors

MC33FS8435G0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It features a supply voltage range of 5.1-36V, suitable for automotive applications due to AEC-Q100 screening and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A0ES by NXP Semiconductors

MC33FS8510A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A4ES by NXP Semiconductors

MC33FS8530A4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G1ES by NXP Semiconductors

MC33FS8430G1ES

NXP Semiconductors

MC33FS8430G1ES by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It has a supply voltage range of 5.1-36V and a max seated height of 1mm. Ideal for power supply management circuits in automotive applications due to AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G1ESR2 by NXP Semiconductors

MC33FS8430G1ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G2ESR2 by NXP Semiconductors

MC33FS8430G2ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Screening Level: AEC-Q100;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G4ESR2 by NXP Semiconductors

MC33FS8430G4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8500A0ESR2 by NXP Semiconductors

MC33FS8500A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A2ES by NXP Semiconductors

MC33FS8510A2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510D3ES by NXP Semiconductors

MC33FS8510D3ES

NXP Semiconductors

MC33FS8510D3ES by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and terminal pitch of 0.5mm. Ideal for automotive applications due to AEC-Q100 screening level and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8520A0ESR2 by NXP Semiconductors

MC33FS8520A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A0ES by NXP Semiconductors

MC33FS8530A0ES

NXP Semiconductors

MC33FS8530A0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating voltage range of 5.1V to 36V, and AEC-Q100 screening level. It comes in a square chip carrier package with 56 terminals, suitable for power supply management circuits in automotive applications.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A0ESR2 by NXP Semiconductors

MC33FS8530A0ESR2

NXP Semiconductors

MC33FS8530A0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It has a supply voltage range of 5.1-36V and supports AEC-Q100 screening for automotive applications. The chip carrier package style with a low profile makes it suitable for compact designs in various electronic systems.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8420G0ES by NXP Semiconductors

MC33FS8420G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G0ES by NXP Semiconductors

MC33FS8400G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G5ES by NXP Semiconductors

MC33FS8400G5ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PQCC-N56;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8405G0ESR2 by NXP Semiconductors

MC33FS8405G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8415G0ESR2 by NXP Semiconductors

MC33FS8415G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 36 V;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8425G0ES by NXP Semiconductors

MC33FS8425G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8425G0ESR2 by NXP Semiconductors

MC33FS8425G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PQCC-N56;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8500A0ES by NXP Semiconductors

MC33FS8500A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-609 Code: e3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

TPS9901TPZPQ1 by Texas Instruments

TPS9901TPZPQ1

Texas Instruments

TPS9901TPZPQ1 by Texas Instruments is a Power Management IC with 100 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 3-3.6V and AEC-Q100 screening for industrial applications. The package style is flatpack with a low profile, suitable for power supply management circuits in automotive electronics.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQFP-G100

e4

14 mm

3

1

1

100

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

260

AEC-Q100

1.2 mm

3.6 V

3 V

3.3 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

+0.98V

30

14 mm

TPS9901TPZPRQ1 by Texas Instruments

TPS9901TPZPRQ1

Texas Instruments

TPS9901TPZPRQ1 by Texas Instruments is a Power Management IC with 100 terminals, operating b/w -40 to 105°C. It has a nominal voltage of 3.3V and supports a max supply voltage of 3.6V. This IC is ideal for industrial applications requiring power supply management circuits in compact spaces.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQFP-G100

e4

14 mm

3

1

1

100

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

260

AEC-Q100

1.2 mm

3.6 V

3 V

3.3 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

+0.98V

30

14 mm

MVR5510AMBA4ES by NXP Semiconductors

MVR5510AMBA4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm