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MC33PF8200D2ES

NXP Semiconductors

MC33PF8200D2ES by NXP Semiconductors

MC33PF8200D2ES by NXP Semiconductors is a Power Management IC with 12 channels, Vsup ranging from 2.5V to 5.5V, and adjustable threshold of +2.8V. It comes in a square chip carrier package suitable for power supply management circuits, with an operating temperature range of -40°C to 105°C.

Median Price

$7.600

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 360 parts In-Stock

1+ parts

$7.130

100+ parts

-

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360

$7.130

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Mouser Electronics

USA . 257 parts In-Stock

1+ parts

$10.780

100+ parts

$8.130

1k+ parts

$7.280

10k+ parts

$7.120

257

$10.780

$8.130

$7.280

$7.120

DigiKey

USA . 314 parts In-Stock

1+ parts

-

100+ parts

$8.000

1k+ parts

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314

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$8.000

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Rochester

USA . 314 parts In-Stock

1+ parts

-

100+ parts

$6.080

1k+ parts

$5.440

10k+ parts

$5.120

314

-

$6.080

$5.440

$5.120

Verical

USA . 314 parts In-Stock

1+ parts

-

100+ parts

$7.600

1k+ parts

$6.800

10k+ parts

$6.400

314

-

$7.600

$6.800

$6.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 953 parts In-Stock

1+ parts

$6.403

100+ parts

-

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953

$6.403

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Vyrian

USA . 7,960 parts In-Stock

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7,960

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Flip Electronics

USA . 1,105 parts In-Stock

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1,105

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Anansix

USA . 767 parts In-Stock

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767

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DigiKey Marketplace

USA . 423 parts In-Stock

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423

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 165 parts In-Stock

1+ parts

$6.066

100+ parts

-

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165

$6.066

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Microchip USA

USA . 1,597 parts In-Stock

1+ parts

$25.790

100+ parts

$25.420

1k+ parts

$25.240

10k+ parts

$25.060

1,597

$25.790

$25.420

$25.240

$25.060

Lixinc

USA . 14,448 parts In-Stock

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14,448

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UNI Independent Distributors

Spain . 930 parts In-Stock

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930

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ChipstoGo Electronic ltd

UK . 780 parts In-Stock

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780

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Overview

Experience unrivaled performance and reliability with the MC33PF8200D2ES from NXP Semiconductors. As a leader in the industry, NXP's Power Management ICs are known for their superior quality and cutting-edge technology. This versatile chip carrier offers a wide range of applications, including power supply management circuits, with features like adjustable threshold voltage and a high operating temperature range. Trust NXP to deliver innovative solutions that provide value, efficiency, and peace of mind for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making it suitable for space-constrained applications.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard 5V supply voltage, compatible with many electronic devices.

No. of Terminals: 56

Having a large number of terminals allows for versatile connectivity options and functionality.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, making it suitable for a wide range of applications.

Width (mm): 8 mm

Compact width allows for easy integration into different electronic systems.

Minimum Supply Voltage (Vsup): 2.5 V

Offers a wide range of supply voltage flexibility, catering to different power requirements.

Nominal Threshold Voltage (V): +2.8V

Precise voltage threshold ensures accurate power management and control.

No. of Channels: 12

Multiple channels provide enhanced power distribution and monitoring capabilities.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for most assembly and storage conditions.

Adjustable Threshold: YES

Ability to adjust threshold voltage adds customization options and flexibility for power management settings.

Technical Specifications

Power Management ICs MC33PF8200D2ES attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.8V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33PF8200D2ES Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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