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MC33PF8100EAESR2

NXP Semiconductors

MC33PF8100EAESR2 by NXP Semiconductors

MC33PF8100EAESR2 by NXP Semiconductors is a Power Management IC with 12 channels, Vsup ranging from 2.5V to 5.5V, and adjustable threshold at +2.8V. It comes in a square chip carrier package suitable for power supply management circuits, with a temperature range of -40 to 105°C.

Median Price

$6.312

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 8,000 parts In-Stock

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Digiode

USA . 4,501 parts In-Stock

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Vyrian

USA . 3,563 parts In-Stock

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Anansix

USA . 449 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Ampacity Inc.

Singapore . 791 parts In-Stock

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$3.500

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One Stop Electronics

USA . 1,353 parts In-Stock

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AZTECH Wire

Italy . 764 parts In-Stock

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$9.752

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Microchip USA

USA . 6,205 parts In-Stock

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UNI Independent Distributors

Spain . 7,538 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Aranea Global

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Overview

Experience unparalleled power management with the MC33PF8100EAESR2 from NXP Semiconductors. This cutting-edge Power Management IC offers a wide range of applications, providing efficient and reliable performance in various electronic devices. With NXP Semiconductors' reputation for quality and innovation, you can trust that this product delivers exceptional value and benefits to meet all your power management needs. Upgrade your devices with the MC33PF8100EAESR2 for optimal performance and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components of the Power Management IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, making the integration of this Power Management IC seamless.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage makes this Power Management IC compatible with a wide range of applications and systems.

No. of Terminals: 56

With a high number of terminals, this Power Management IC offers versatile connectivity options and enables complex circuit designs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures that this Power Management IC can perform reliably even in demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows this Power Management IC to function effectively in a wide variety of environmental conditions.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, this Power Management IC is suitable for standard surface mount assembly processes, ensuring consistent performance and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within the 5.5V supply voltage limit provides a safety margin and prevents damage to the Power Management IC in case of voltage spikes.

Technical Specifications

Power Management ICs MC33PF8100EAESR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.8V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33PF8100EAESR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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