Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.
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MT53E512M32D2FW-046AIT:D
Micron Technology
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Sequential Burst Length: 16,32;
MULTI BANK PAGE BURST
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX
2136.7 MHz
COMMON
16,32
R-PBGA-B200
14.5 mm
17179869184 bit
LPDDR4 DRAM
32
1
200
536870912 words
512M
SYNCHRONOUS
95 Cel
-40 Cel
512MX32
PLASTIC/EPOXY
TFBGA
BGA200,12X22,32/25
RECTANGULAR
GRID ARRAY, THIN PROFILE, FINE PITCH
AEC-Q100
1.1 mm
YES
1.17 V
1.06 V
1.1
CMOS
BALL
.8 mm
BOTTOM
10 mm
S27KL0642GABHM020
Infineon Technologies
HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Memory Width: 1;
35 ns
200 MHz
R-PBGA-B24
67108864 bit
HYPERRAM
3
24
67108864 words
64M
125 Cel
64MX1
BGA
GRID ARRAY
3.6 V
2.7 V
S27KS0642GABHM023
HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 64MX1; Screening Level: AEC-Q100;
2 V
1.7 V
1.8
S70KL1282GABHM020
HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 128M; Terminal Position: BOTTOM;
R-PBGA-B240
134217728 bit
134217728 words
128M
128MX1
S27KS0642GABHM020
HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Package Body Material: PLASTIC/EPOXY;
S70KS1282GABHM023
HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Technology: CMOS; Memory Width: 1;
S27KL0642GABHM023
HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Package Body Material: PLASTIC/EPOXY;
S70KL1282GABHM023
HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words: 134217728 words; Screening Level: AEC-Q100;
S70KS1282GABHM020
HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 128MX1; Maximum Operating Temperature: 125 Cel;
S27KL0642GABHA023
Infineon's S27KL0642GABHA023 DRAM features 8MX8 organization, operates synchronously at up to 200 MHz, and has a memory density of 67108864 bits. Ideal for automotive applications due to AEC-Q100 screening level and common I/O type.
8 mm
8
8388608 words
8M
85 Cel
8MX8
3-STATE
VBGA
BGA24,5X5,40
GRID ARRAY, VERY THIN PROFILE
1 mm
.00025 Amp
30 mA
6 mm
S27KL0642GABHV023
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B24; Minimum Supply Voltage (Vsup): 2.7 V;
105 Cel
.00036 Amp
S27KL0642GABHV020
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Memory Density: 67108864 bit;
S70KL1282GABHV023
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA24,5X5,40; Package Body Material: PLASTIC/EPOXY;
16777216 words
16M
16MX8
.00075 Amp
60 mA
MT61M256M32JE-10AAT:A
GDDR6 DRAM; No. of Terminals: 180; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.2125 V; Memory Density: 8589934592 bit;
AUTO/SELF REFRESH
16
1500 MHz
R-PBGA-B180
14 mm
8589934592 bit
GDDR6 DRAM
180
268435456 words
256M
256MX32
BGA180,14X18,30
1.2 mm
1.2875 V
1.2125 V
1.25
.75 mm
12 mm
MT61M256M32JE-12AAT:A
Micron Technology's MT61M256M32JE-12AAT:A is a GDDR6 DRAM with 256MX32 organization, operating at up to 1500 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for high-performance applications requiring fast memory access and data processing.
MT60B1G16HC-48B:A
Micron Technology's MT60B1G16HC-48B:A is a DDR5 DRAM with 1GX16 organization, operating at 2403.8 MHz clock frequency. It features 8192 refresh cycles and supports multi-bank page burst access mode. This memory module is suitable for high-performance applications requiring fast synchronous operation in a compact grid array package.
SELF REFRESH
2403.8 MHz
R-PBGA-B102
DDR5 DRAM
102
1073741824 words
1G
0 Cel
1GX16
VFBGA
BGA102,9X17,32
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
8192
9 mm
MT40A4G4SA-062E:F
DDR4 DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH;
1600 MHz
R-PBGA-B78
11 mm
DDR4 DRAM
4
78
4294967296 words
4G
4GX4
BGA78,9X13,32
1.26 V
1.14 V
1.2
7.5 mm
MT40A1G16KD-062EIT:ETR
Micron Technology's MT40A1G16KD-062EIT:ETR is a DDR4 DRAM with 1GX16 organization, operating at 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Suitable for applications requiring high-speed memory access in devices like computers and servers.
R-PBGA-B96
e1
13 mm
96
BGA96,9X16,32
260
TIN SILVER COPPER
30
MT40A1G16KD-062EIT:E
Micron Technology's MT40A1G16KD-062EIT:E is a DDR4 DRAM with 1GX16 organization, operating at 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices like computers and servers.
MT40A2G8SA-062E:F
Micron Technology's MT40A2G8SA-062E:F is a DDR4 DRAM with 2GX8 organization, operating at up to 1600 MHz. It features a thin profile grid array package suitable for applications requiring high-speed synchronous memory with common I/O.
2147483648 words
2G
2GX8
SQR-SD3M-8G1K8SNLB
Advantech
Advantech's SQR-SD3M-8G1K8SNLB DDR3L DRAM MODULE features 8GX8 organization, 1.35V supply voltage, and 85°C max operating temp. Ideal for applications requiring high memory density and fast synchronous operation in microelectronic assemblies.
R-XDMA-N204
68719476736 bit
DDR3L DRAM MODULE
204
8589934592 words
8G
-20 Cel
8GX8
UNSPECIFIED
DIMM
MICROELECTRONIC ASSEMBLY
1.35
NO
NO LEAD
DUAL
SQR-SD3I-8G1K6SNLB
Advantech's SQR-SD3I-8G1K6SNLB DDR3L DRAM Module features 8GX1 organization, 204 terminals, and operates at 1.35V. Ideal for applications requiring high memory density and reliable performance in a wide temperature range from -40 to 85°C.
8GX1
SQR-SD3M-8G1K6SNLB
Advantech's SQR-SD3M-8G1K6SNLB DDR3L DRAM Module features 8GX1 organization, 204 terminals, and operates at 1.35V. Ideal for applications requiring high memory density and synchronous operation in a compact MICROELECTRONIC ASSEMBLY package.
MT53E512M64D2HJ-046WT:B
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Terminal Form: BALL; Technology: CMOS;
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
S-PBGA-B556
12.4 mm
34359738368 bit
64
556
-25 Cel
512MX64
BGA556,29X29,16
SQUARE
.4 mm
S80KS2564GACHV040
Infineon's S80KS2564GACHV040 is a 16MX16 DRAM with 1.8V supply voltage, operating at up to 200MHz clock frequency. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability in a compact grid array package.
S-PBGA-B49
268435456 bit
49
16MX16
BGA49,7X7,20
.00155 Amp
22 mA
S80KS2564GACHI040
HYPERRAM; No. of Terminals: 49; Package Code: VBGA; Package Shape: SQUARE; Maximum Standby Current: .0012 Amp; Maximum Operating Temperature: 85 Cel;
.0012 Amp
MT53E128M16D1DS-046WT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words Code: 128M; Terminal Form: BALL;
SINGLE BANK PAGE BURST
SELF REFRESH, IT ALSO REQUIRES 1.8V NOMINAL SUPPLY, TERM PITCH-MAX
2133 MHz
2147483648 bit
128MX16
MT53E128M32D2FW-046IT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 10 mm; Memory Width: 32;
4294967296 bit
128MX32
MT53E128M32D2FW-046WT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.17 V; Minimum Operating Temperature: -25 Cel;
MT40A512M16TB-062E:J
Micron Technology's MT40A512M16TB-062E:J is a DDR4 DRAM with 512MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data access in thin-profile devices.
13.5 mm
512MX16
65536
MT40A1G8SA-062E:J
Micron Technology's MT40A1G8SA-062E:J is a DDR4 DRAM with 1GX8 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data access in thin-profile devices.
1GX8
BGA78,6X13,32
MT40A2G4SA-062E:J
DDR4 DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 65536; Package Shape: RECTANGULAR; No. of Ports: 1;
2GX4
MT40A2G4SA-062E:R
DDR4 DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 65536; Package Shape: RECTANGULAR; Package Equivalence Code: BGA78,6X13,32;
MT47H32M8BP-3:BTR
DDR2 DRAM; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Maximum Supply Current: 250 mA;
FOUR BANK PAGE BURST
.45 ns
333 MHz
4,8
R-PBGA-B60
DDR2 DRAM
60
33554432 words
32M
32MX8
BGA60,9X11,32
.04 Amp
250 mA
1.9 V
MT53B512M32D2NP-062AAT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
DUAL BANK PAGE BURST
16384
.0033 Amp
410 mA
MT53B512M32D2NP-062AIT:C
.0025 Amp
400 mA
MT53B256M32D1DS-062AIT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Memory Density: 8589934592 bit;
MT53B256M32D1NP-062AAT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Technology: CMOS;
MT53B256M32D1NP-062AIT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; No. of Words: 268435456 words;
MT47H64M16NF-25EAAT:MTR
Micron Technology's MT47H64M16NF-25EAAT:MTR is a DDR2 DRAM with 64MX16 organization, operating at 400 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Suitable for applications requiring high memory density and fast data access in automotive electronics or industrial control systems.
.4 ns
400 MHz
R-PBGA-B84
12.5 mm
1073741824 bit
84
64MX16
BGA84,9X15,32
.01 Amp
260 mA
S27KL0643DPBHV020
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00036 Amp; No. of Words: 8388608 words;
166 MHz
28 mA
S27KL0643DPBHV023
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B24; Organization: 8MX8;
S70KL1283GABHV020
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Self Refresh: YES; Minimum Operating Temperature: -40 Cel;
S27KL0643DPBHI020
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Technology: CMOS;
S27KL0643DPBHI023
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Maximum Supply Voltage (Vsup): 3.6 V;
S27KL0643GABHV023
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Technology: CMOS; Package Equivalence Code: BGA24,5X5,40;
S70KL1283DPBHI020
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 166 MHz; Self Refresh: YES;
.0005 Amp
56 mA
S70KL1283DPBHI023
HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm; Technology: CMOS;
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