Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT48LC2M32B2P-7:GTR
Micron Technology
MT48LC2M32B2P-7:GTR by Micron Technology is a 2MX32 Synchronous DRAM with a memory density of 67108864 bit. It operates at a max temperature of 70°C and has a supply voltage range of 3V to 3.6V. This memory IC is commonly used in applications requiring high-speed data storage and retrieval, such as computer systems and networking devices.
FOUR BANK PAGE BURST
5.5 ns
AUTO/SELF REFRESH
R-PDSO-G86
e3
22.22 mm
67108864 bit
SYNCHRONOUS DRAM
32
1
86
2097152 words
2M
SYNCHRONOUS
70 Cel
0 Cel
2MX32
PLASTIC/EPOXY
TSOP2
RECTANGULAR
SMALL OUTLINE, THIN PROFILE
260
Not Qualified
1.2 mm
YES
3.6 V
3 V
3.3
CMOS
COMMERCIAL
Matte Tin (Sn)
GULL WING
.5 mm
DUAL
30
10.16 mm
MT48LC2M32B2P-7IT:GTR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 86; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
105 Cel
-40 Cel
INDUSTRIAL
MATTE TIN
MT48H16M32LFCM-6LIT:B
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
5 ns
166 MHz
COMMON
1,2,4,8
R-PBGA-B90
e1
13 mm
536870912 bit
90
16777216 words
16M
85 Cel
16MX32
3-STATE
VFBGA
BGA90,9X15,32
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.8
8192
1 mm
1,2,4,8,FP
.00001 Amp
DRAMs
105 mA
1.95 V
1.7 V
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
10 mm
MT46V64M8TG-75Z:D
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.75 ns
133 MHz
2,4,8
R-PDSO-G66
e0
DDR1 DRAM
8
66
67108864 words
64M
64MX8
TSSOP
TSSOP66,.46
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
2.5
.005 Amp
2.7 V
2.3 V
TIN LEAD
.65 mm
MT47H128M8BT-37EL:A
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 92; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MULTI BANK PAGE BURST
.5 ns
266 MHz
4,8
R-PBGA-B92
19 mm
1073741824 bit
DDR2 DRAM
92
134217728 words
128M
128MX8
TFBGA
BGA92,9X21,32
GRID ARRAY, THIN PROFILE, FINE PITCH
290 mA
1.9 V
OTHER
11 mm
MT47H128M8BT-3L:A
.45 ns
333 MHz
300 mA
MT47H128M8BT-5EL:A
.6 ns
200 MHz
260 mA
MT47H32M16CC-37EL:B
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B84
12.5 mm
16
84
33554432 words
32M
32MX16
BGA84,9X15,32
GRID ARRAY
.007 Amp
340 mA
12 mm
MT47H32M16CC-5EL:B
MT48LC4M16A2P-6IT:G
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
167 MHz
R-PDSO-G54
54
4194304 words
4M
4MX16
TSOP54,.46,32
4096
.002 Amp
250 mA
MT48LC2M32B2P-6IT:G
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 86; Package Code: TSSOP; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
TSSOP86,.46,20
225 mA
MT36LSDF12872G-133D1
SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Width: 72;
DUAL BANK PAGE BURST
5.4 ns
R-XDMA-N168
9663676416 bit
SYNCHRONOUS DRAM MODULE
72
168
128MX72
UNSPECIFIED
DIMM
MICROELECTRONIC ASSEMBLY
NO
NO LEAD
MT48LC8M16A2B4-75:G
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
S-PBGA-B54
8 mm
134217728 bit
8388608 words
8M
8MX16
BGA54,9X9,32
SQUARE
310 mA
MT48LC8M16A2B4-75IT:G
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
Tin/Silver/Copper (Sn/Ag/Cu)
MT18LSDT6472G-133D2
SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Ports: 1;
SINGLE BANK PAGE BURST
4831838208 bit
55 Cel
64MX72
MT46H16M32LFCM-75IT
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
6 ns
120 mA
MT47H32M16CC-37EIT:B
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT47H32M16CC-5EIT:B
MT47H64M8CB-25:B
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.4 ns
400 MHz
R-PBGA-B60
60
BGA60,9X11,32
MT47H64M8CB-37EIT:B
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT47H64M8CB-5EIT:B
220 mA
MT49H16M18CFM-5IT
DDR DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 144; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 301989888 bit;
AUTO REFRESH
SEPARATE
R-PBGA-B144
18.5 mm
301989888 bit
DDR DRAM
18
144
16MX18
BGA
BGA144,12X18,40/32
1.5/1.8,1.8,2.5
.93 mm
.026 Amp
597 mA
TIN LEAD SILVER
MT18KSF1G72PDZ-1G6N1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.283 V;
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
R-XDMA-N240
133.35 mm
77309411328 bit
DDR DRAM MODULE
240
1073741824 words
1G
1GX72
30.5 mm
1.45 V
1.283 V
1.35
4 mm
MT41J64M16TW-093:J
MT41J64M16TW-093:J by Micron Technology is a DDR3 DRAM with 64MX16 organization, 1.5V nominal voltage, and operating temperature range of 0 to 85°C. It is commonly used in applications requiring synchronous operation and multi-bank page burst access mode.
R-PBGA-B96
14 mm
DDR3 DRAM
96
64MX16
1.575 V
1.425 V
1.5
MT47H256M8THN-25E:M
DDR2 DRAM; No. of Terminals: 63; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Package Equivalence Code: BGA63,9X11,32;
SELF REFRESH
R-PBGA-B63
2147483648 bit
63
268435456 words
256M
256MX8
BGA63,9X11,32
.02 Amp
230 mA
MT46V128M4BN-6:F
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: TBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.7 ns
4
128MX4
TBGA
BGA60,9X12,40/32
GRID ARRAY, THIN PROFILE
405 mA
MT46V32M16BN-5B:F
2.6
480 mA
2.5 V
MT46V32M16BN-5BIT:F
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT46V32M16BN-5BLIT:F
MT46V32M16BN-6IT:F
Micron Technology's MT46V32M16BN-6IT:F is a DDR1 DRAM with 32MX16 organization, operating at 166 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
MT46V32M16FN-5B:F
MT46V32M16FN-6:F
MT46V32M16FN-6IT:F
235
Tin/Lead/Silver (Sn/Pb/Ag)
MT46V32M16P-5B:F
Micron Technology's MT46V32M16P-5B:F is a DDR1 DRAM with 32MX16 organization, operating at 200 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring fast memory access and high data transfer rates in commercial-grade devices.
MT46V32M16P-6T:F
Micron Technology's MT46V32M16P-6T:F is a DDR1 DRAM with 32MX16 organization, operating at 166 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in commercial temperature environments.
3
MT46V32M16P-6TIT:F
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT46V32M16P-6TL:F
MT46V32M16P-6TLIT:F
MT46V32M16TG-5B:F
MT46V32M16TG-6T:F
Tin/Lead (Sn/Pb)
MT46V32M16TG-6TIT:F
MT46V64M8BN-5B:F
450 mA
MT46V64M8BN-6:F
MT46V64M8BN-6IT:F
MT46V64M8BN-6L:F
MT46V64M8FN-6IT:F
MT46V64M8P-5B:F
MT46V64M8P-5BLIT:F
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