Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT48V4M32LFB5-8:G
Micron Technology
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
FOUR BANK PAGE BURST
7 ns
AUTO/SELF REFRESH
125 MHz
COMMON
1,2,4,8
R-PBGA-B90
e1
13 mm
268435456 bit
SYNCHRONOUS DRAM
32
1
90
8388608 words
8M
SYNCHRONOUS
70 Cel
0 Cel
8MX32
3-STATE
PLASTIC/EPOXY
VFBGA
BGA90,9X15,32
RECTANGULAR
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.8/2.5,2.5
Not Qualified
4096
1 mm
YES
1,2,4,8,FP
.00045 Amp
DRAMs
150 mA
2.7 V
2.3 V
2.5
CMOS
COMMERCIAL
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
8 mm
MT48V4M32LFB5-8IT:G
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
3
85 Cel
-40 Cel
INDUSTRIAL
MT48V4M32LFF5-10:G
100 MHz
e0
120 mA
TIN LEAD SILVER
MT48V4M32LFF5-10IT:G
MT48V4M32LFF5-8IT:G
MT48V8M16LFB4-8:G
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
S-PBGA-B54
134217728 bit
16
54
8MX16
BGA54,9X9,32
SQUARE
130 mA
MT48V8M16LFB4-8IT:G
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
MT48V8M16LFF4-10:G
100 mA
MT48V8M16LFF4-10IT:G
MT47H16M16BG-37V:B
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: LFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.5 ns
266 MHz
4,8
R-PBGA-B84
14 mm
DDR2 DRAM
84
16777216 words
16M
16MX16
LFBGA
BGA84,9X15,32
GRID ARRAY, LOW PROFILE, FINE PITCH
1.8
8192
1.3 mm
.006 Amp
280 mA
1.9 V
1.7 V
OTHER
MT47H16M16BG-3E:B
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
333 MHz
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.2 mm
.005 Amp
180 mA
MT47H256M4BT-3:A
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 92; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MULTI BANK PAGE BURST
R-PBGA-B92
19 mm
1073741824 bit
4
92
268435456 words
256M
256MX4
BGA92,9X21,32
260
300 mA
11 mm
MT48LC128M4A2TG-7E:C
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
5.4 ns
143 MHz
R-PDSO-G54
22.22 mm
536870912 bit
134217728 words
128M
128MX4
TSOP2
TSOP54,.46,32
SMALL OUTLINE, THIN PROFILE
3.3
.0035 Amp
255 mA
3.6 V
3 V
TIN LEAD
GULL WING
DUAL
10.16 mm
MT49H16M18BM-33
DDR DRAM; No. of Terminals: 144; Package Code: BGA; Package Shape: RECTANGULAR; Additional Features: AUTO REFRESH; No. of Words Code: 16M;
.3 ns
AUTO REFRESH
300 MHz
R-PBGA-B144
18.5 mm
301989888 bit
DDR DRAM
18
144
16MX18
BGA
BGA144,12X18,40/32
GRID ARRAY
1.5/1.8,1.8,2.5
.93 mm
2,4,8
MT36HTF51272PZ-667H1
Micron Technology's MT36HTF51272PZ-667H1 is a 512MX72 DDR DRAM MODULE with synchronous operation, self-refresh capability, and 333 MHz clock frequency. Ideal for commercial applications requiring high memory density and fast access times.
DUAL BANK PAGE BURST
.4 ns
R-XDMA-N240
e4
133.35 mm
38654705664 bit
DDR DRAM MODULE
72
240
536870912 words
512M
512MX72
UNSPECIFIED
DIMM
DIMM240,40
MICROELECTRONIC ASSEMBLY
30.5 mm
.252 Amp
Other Memory ICs
5160 mA
NO
Gold (Au)
NO LEAD
30.175 mm
MT41J1G4THD-15E:D
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
667 MHz
R-PBGA-B78
11.5 mm
4294967296 bit
DDR3 DRAM
78
1073741824 words
1G
1GX4
BGA78,9X13,32
1.5
.024 Amp
337 mA
1.575 V
1.425 V
9 mm
MT41J512M8THD-15E:D
8
512MX8
MT41J512M8THD-187E:D
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.425 V;
MT41J512M8THU-187E:A
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 82; Package Code: LFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
533 MHz
R-PBGA-B82
15 mm
82
BGA82,11X13,32
1.35 mm
.035 Amp
445 mA
12.5 mm
MT48LC4M16A2TG-75L:G
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
133 MHz
67108864 bit
4194304 words
4M
4MX16
.002 Amp
210 mA
MT48LC8M8A2TG-7EL:G
8MX8
230 mA
MT46V16M8TG-75:D
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
.75 ns
R-PDSO-G66
DDR1 DRAM
66
16MX8
TSSOP
TSSOP66,.46
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
235
.003 Amp
325 mA
Tin/Lead (Sn/Pb)
.65 mm
30
MT48LC16M8A2P-75IT:G
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
e3
310 mA
MATTE TIN
MT48LC32M4A2P-7E:G
33554432 words
32M
32MX4
330 mA
MT48LC32M4A2TG-75L:G
MT48LC8M16A2P-6AIT:G
Micron Technology's MT48LC8M16A2P-6AIT:G is a 3.3V Synchronous DRAM with 8MX16 organization, operating at 167 MHz clock frequency. It features self-refresh mode, common I/O type, and 4096 refresh cycles. Ideal for industrial applications requiring high-speed memory access in compact form factors.
167 MHz
MT18HVF25672PZ-667H1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SINGLE BANK PAGE BURST
19327352832 bit
256MX72
18.05 mm
.126 Amp
3330 mA
17.9 mm
MT46V16M16FG-6L:F
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: TBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.7 ns
R-PBGA-B60
60
TBGA
BGA60,9X12,40/32
GRID ARRAY, THIN PROFILE
2.6
.004 Amp
440 mA
MT46V16M16P-6TL:F
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT46V32M8P-6TIT:G
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
32MX8
410 mA
MT48H4M32LFB56:K
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
166 MHz
S-PBGA-B90
4MX32
.0002 Amp
1.95 V
MT48LC16M16A2BG-75IT:D
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B54
270 mA
MT48LC16M16A2BG-7EIT:D
135 mA
MT48LC16M16A2P-7EIT:D
Micron Technology's MT48LC16M16A2P-7EIT:D is a 16MX16 Synchronous DRAM with 3.3V supply, operating at up to 143MHz clock frequency. Ideal for industrial applications, it offers a memory density of 268MB and supports common I/O type with self-refresh capability.
Matte Tin (Sn)
MT48LC32M8A2BB-75IT:D
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
16 mm
BGA60,8X15,32
MT48LC64M4A2P-75L:D
67108864 words
64M
64MX4
MT48LC4M32LFF5-8:G
MT48LC8M16LFF4-75MIT:G
MT47H128M4CB-37E:B
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
12 mm
BGA60,9X11,32
.007 Amp
225 mA
Tin/Silver/Copper (Sn/Ag/Cu)
10 mm
MT47H128M4CB-3:B
240 mA
MT47H32M16CC-37E:B
32MX16
340 mA
MT47H32M16CC-3:B
350 mA
MT47H32M16CC-3E:B
MT47H32M16CC-5E:B
.6 ns
200 MHz
MT47H64M8CB-37E:B
64MX8
MT47H64M8CB-37V:B
267 MHz
MT47H64M8CB-3:B
MT47H64M8CB-5E:B
220 mA
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