Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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EDB8164B4PT-1DIT-F-D
Micron Technology
LPDDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Length: 12 mm;
SINGLE BANK PAGE BURST
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
S-PBGA-B216
12 mm
8589934592 bit
LPDDR2 DRAM
64
1
216
134217728 words
128M
SYNCHRONOUS
85 Cel
-40 Cel
128MX64
PLASTIC/EPOXY
VFBGA
SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.8 mm
YES
1.95 V
1.14 V
1.2
CMOS
INDUSTRIAL
BALL
.4 mm
BOTTOM
EDBA164B2PR-1D-F-D
LPDDR2 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: BALL;
DUAL BANK PAGE BURST
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY
17179869184 bit
268435456 words
256M
256MX64
NOT SPECIFIED
1 mm
1.3 V
EDB4432BBPA-1D-F-D
Micron Technology's EDB4432BBPA-1D-F-D is a 128MX32 LPDDR2 DRAM with 4294967296 bit memory density. Operating at 1.2V, it features synchronous mode and self-refresh capability. Ideal for applications requiring single bank page burst access mode in a compact GRID ARRAY package style.
S-PBGA-B168
e1
4294967296 bit
32
168
128MX32
TIN SILVER COPPER
.5 mm
EDB4432BBPA-1D-F-R
Micron Technology's EDB4432BBPA-1D-F-R is a 128MX32 LPDDR2 DRAM with 4294967296 bit memory density. Operating at 1.2V, it features synchronous mode and self-refresh capability. Ideal for applications requiring single bank page burst access mode in a compact GRID ARRAY package style.
EDB8132B4PB-8D-F-D
Micron Technology's EDB8132B4PB-8D-F-D is a 256MX32 LPDDR2 DRAM with a square package and PLASTIC/EPOXY body material. It operates in SYNCHRONOUS mode, has a self-refresh feature, and requires a nominal voltage of 1.2V. This memory module is suitable for applications that require high-density data storage and fast access speeds.
256MX32
EDB8132B4PM-1D-F-D
LPDDR2 DRAM; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Form: BALL; No. of Functions: 1;
.82 mm
EDBA232B2PB-1D-F-D
LPDDR2 DRAM; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 1.2; Terminal Form: BALL;
536870912 words
512M
512MX32
260
Tin/Silver/Copper (Sn/Ag/Cu)
30
EDBA232B2PF-1D-F-D
LPDDR2 DRAM; No. of Terminals: 168; Package Code: TFBGA; Package Shape: SQUARE; Additional Features: AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.02 mm
EDBM432B3PF-1D-F-D
LPDDR2 DRAM; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; No. of Ports: 1; Minimum Supply Voltage (Vsup): 1.14 V;
12884901888 bit
402653184 words
384M
384MX32
.92 mm
MT46H128M32L2KQ-5IT:BTR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
FOUR BANK PAGE BURST
5 ns
AUTO/SELF REFRESH
DDR1 DRAM
.75 mm
1.7 V
1.8
MT48LC4M16A2B4-7E:GTR
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
5.4 ns
S-PBGA-B54
8 mm
67108864 bit
SYNCHRONOUS DRAM
16
54
4194304 words
4M
70 Cel
0 Cel
4MX16
3.6 V
3 V
3.3
COMMERCIAL
MT48LC8M16A2B4-75IT:GTR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: SQUARE; Memory Width: 16;
134217728 bit
8388608 words
8M
8MX16
MT46H64M32L2JG-6IT:ATR
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;
6 ns
2147483648 bit
LPDDR1 DRAM
67108864 words
64M
64MX32
.9 mm
MT46H128M32L2KQ-5WT:BTR
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Additional Features: AUTO/SELF REFRESH;
-20 Cel
OTHER
MT46H32M32LFMA-5IT:BTR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;
1073741824 bit
33554432 words
32M
32MX32
.7 mm
MT46H128M32L2KQ-48IT:CTR
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Organization: 128MX32;
MT46H128M32L2KQ-48WT:CTR
LPDDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Additional Features: AUTO/SELF REFRESH;
-25 Cel
MT44K16M36RB-093E:B
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B168; Package Style (Meter): GRID ARRAY, THIN PROFILE;
MULTI BANK PAGE BURST
13.5 mm
603979776 bit
DDR DRAM
36
16777216 words
16M
16MX36
TBGA
GRID ARRAY, THIN PROFILE
1.2 mm
1.42 V
1.28 V
1.35
MT52L256M64D2GN-107WT:B
LPDDR3 DRAM; No. of Terminals: 256; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.14 V; Terminal Finish: TIN SILVER COPPER;
S-PBGA-B256
14 mm
LPDDR3 DRAM
256
EDB8132B4PM-1DAT-F-D
LPDDR2 DRAM; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; No. of Ports: 1; Maximum Seated Height: .82 mm;
Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2)
MT52L256M64D2LZ-107XT:B
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Self Refresh: YES;
933 MHz
COMMON
105 Cel
-30 Cel
3-STATE
BGA216,29X29,16
.012 Amp
320 mA
EDF8164A3MA-GD-F-D
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
S-PBGA-B253
11 mm
253
.85 mm
EDFA164A2MA-GD-F-D
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Length: 11 mm;
EDFA164A2MA-JD-F-D
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.14 V;
EDFA364A3MA-GD-F-D
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; No. of Functions: 1;
12.5 mm
EDFB164A1MA-GD-F-D
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
34359738368 bit
512MX64
.95 mm
EDFB164A1MA-JD-F-D
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Self Refresh: YES;
EDFP164A3PD-JD-F-D
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 256; Package Code: VFBGA; Package Shape: SQUARE; No. of Words Code: 384M;
25769803776 bit
384MX64
IS42S16160J-7BL-TR
Integrated Silicon Solution
IS42S16160J-7BL-TR by Integrated Silicon Solution is a 16MX16 Synchronous DRAM with 268Mbit memory density. Operating at 3.3V, it offers a max access time of 5.4ns and features self-refresh capability. Ideal for applications requiring high-speed memory performance in commercial temperature environments.
268435456 bit
16MX16
MT48LC8M16A2B4-6AXIT:L
Micron Technology's MT48LC8M16A2B4-6AXIT:L is a 8MX16 Synchronous DRAM with 134217728 bit memory density. It operates at 3.3V, has a peak reflow temp of 260°C, and offers a max access time of 5.4 ns. Ideal for industrial applications requiring high-speed and reliable memory performance.
MT48LC4M16A2B4-75IT:GTR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3 V;
MT48LC16M16A2F4-6A:GTR
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: SQUARE; No. of Functions: 1;
AUTO REFRESH
MT48LC16M16A2F4-6AIT:GTR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm;
MT44K32M36RB-083F:ATR
DDR DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
1207959552 bit
95 Cel
32MX36
MT52L256M64D2PP-107WT:B
LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Organization: 256MX64;
CONFIGURABLE
BGA216,12X12,16
NO
IS42S16400J-6BLI-TR
IS42S16400J-6BLI-TR by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with 3.3V supply, operating at 166MHz. It features self-refresh mode, 54 terminals in a thin profile grid array package, and supports common I/O type. Ideal for industrial applications requiring fast memory access and high density storage capabilities.
166 MHz
1,2,4,8
BGA54,9X9,32
Not Qualified
4096
1,2,4,8,FP
.002 Amp
DRAMs
150 mA
W9864G6JT-6ITR
Winbond Electronics
W9864G6JT-6ITR by Winbond Electronics is a 4MX16 Synchronous DRAM with 67108864 bit memory density. It operates at 3.3V, has a max access time of 5ns, and supports four bank page burst access mode. This thin profile memory IC is ideal for industrial applications requiring high-speed data processing in compact spaces.
AS4C32M16SB-7BINTR
Alliance Memory
Alliance Memory's AS4C32M16SB-7BINTR is a 32MX16 DRAM with 3.3V supply, operating at 143MHz clock frequency. Ideal for industrial applications, it features synchronous operation, self-refresh capability, and a thin profile grid array package.
143 MHz
COMMON/SEPARATE
536870912 bit
32MX16
8192
.008 Amp
120 mA
AS4C32M16SB-7BIN
Alliance Memory's AS4C32M16SB-7BIN is a 32MX16 DRAM with 3.3V supply, operating at 143MHz clock frequency. Ideal for industrial applications, it features synchronous operation, self-refresh capability, and a thin profile grid array package.
MT53E512M64D2HJ-046WT:B
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Terminal Form: BALL; Technology: CMOS;
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
2136.7 MHz
16,32
S-PBGA-B556
12.4 mm
LPDDR4 DRAM
556
BGA556,29X29,16
1.1 mm
1.17 V
1.06 V
1.1
S80KS2564GACHV040
Infineon Technologies
Infineon's S80KS2564GACHV040 is a 16MX16 DRAM with 1.8V supply voltage, operating at up to 200MHz clock frequency. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability in a compact grid array package.
35 ns
SELF REFRESH
200 MHz
S-PBGA-B49
HYPERRAM
3
49
VBGA
BGA49,7X7,20
GRID ARRAY, VERY THIN PROFILE
.00155 Amp
22 mA
2 V
S80KS2564GACHI040
HYPERRAM; No. of Terminals: 49; Package Code: VBGA; Package Shape: SQUARE; Maximum Standby Current: .0012 Amp; Maximum Operating Temperature: 85 Cel;
.0012 Amp
MT53E768M64D4HJ-046AAT:A
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Maximum Standby Current: .0032 Amp; Memory Density: 51539607552 bit;
3.5 ns
2133 MHz
51539607552 bit
805306368 words
768M
768MX64
.0032 Amp
MT53E768M64D4HJ-046AIT:A
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Package Body Material: PLASTIC/EPOXY;
MT53E512M64D4HJ-046AAT:D
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Sequential Burst Length: 16,32; Output Characteristics: 3-STATE;
.0036 Amp
390 mA
MT53E512M64D4HJ-046AIT:D
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Maximum Clock Frequency (fCLK): 2133 MHz; Output Characteristics: 3-STATE;
MT53E512M64D4NK-046WT:D
LPDDR4 DRAM; No. of Terminals: 366; Package Code: VFBGA; Package Shape: SQUARE; Maximum Supply Current: 360 mA; Additional Features: SELF REFRESH; IT ALSO REQUIRES 1.8V NOM;
S-PBGA-B366
15 mm
366
BGA366,29X29,20
360 mA
MT53E512M64D4NK-053WT:D
Micron Technology's MT53E512M64D4NK-053WT:D is a LPDDR4 DRAM with 512MX64 organization, operating at 1866 MHz. It features a very thin profile, fine pitch grid array package style and supports multi-bank page burst access mode. Ideal for applications requiring high-speed memory performance in compact devices.
1866 MHz
300 mA
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