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XC7VX690T-2FFG1761I

Xilinx

XC7VX690T-2FFG1761I by Xilinx

Xilinx XC7VX690T-2FFG1761I FPGA features 693120 logic cells, 54150 CLBs, and 850 inputs/outputs. Utilized in high-performance applications like telecommunications equipment due to its max clock frequency of 1818 MHz and advanced CMOS technology.

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Overview

Unlock the potential of cutting-edge technology with the XC7VX690T-2FFG1761I by Xilinx. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Xilinx delivers unmatched quality and reliability. With 693120 logic cells and 54150 CLBs, this FPGA offers exceptional performance and versatility. Whether you are looking to enhance your data processing capabilities, accelerate AI applications, or improve networking solutions, the XC7VX690T-2FFG1761I provides the value, benefits, and advantages that customers need to stay ahead in today's fast-paced technological landscape. Experience innovation like never before with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, making it suitable for various applications.

No. of Logic Cells: 693120

With a high number of logic cells, this FPGA offers extensive processing capabilities for complex designs.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption and minimizing heat generation, enhancing energy efficiency.

No. of CLBs: 54150

The large number of Configurable Logic Blocks (CLBs) allows for versatile and customizable functionality in the FPGA design.

Technology Used: CMOS

The use of CMOS technology ensures high performance, low power consumption, and reliable operation in the FPGA.

No. of Inputs: 850

With a high number of inputs, this FPGA can handle a wide range of incoming signals and data for processing.

Package Shape: SQUARE

The square shape of the package offers efficient use of space on the circuit board, enabling compact designs.

Form Of Terminal: BALL

The ball terminals provide secure connections and reliable signal transmission, ensuring stable performance in the FPGA.

Power Supplies (V): 1,1.8

The multiple voltage options allow for flexible power configurations, accommodating different system requirements.

No. of Terminals: 1761

The numerous terminals enable a robust connection to the circuit board, enhancing signal integrity and reliability.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility and adaptability for various applications and design changes.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient heat dissipation and mechanical stability, ensuring long-term reliability.

Minimum / Maximum Supply Voltage: 0.97 V / 1.03 V

The narrow voltage range allows for precise power management, ensuring stable performance and protection against overvoltage.

Maximum Operating Temperature: 100 °C

The high operating temperature range makes this FPGA suitable for industrial and harsh environments, offering reliable operation under extreme conditions.

Pitch Of Terminal: 1 mm

The small terminal pitch allows for high-density mounting, maximizing the use of available board space for other components.

Maximum Combinatorial Delay of a CLB: 0.61 ns

The low combinational delay ensures quick signal processing and minimal latency in the FPGA design.

Organization: 54150 CLBS

The organized layout of CLBs simplifies design implementation and debugging, making the FPGA user-friendly for engineers.

Minimum Operating Temperature: -40 °C

The wide temperature range enables this FPGA to function in cold environments or outdoor applications, offering versatility in operation.

Finishing Of Terminal Used: TIN SILVER COPPER

The combination of terminal finishes provides corrosion resistance and stable interconnectivity, ensuring long-term performance.

Position Of Terminal: BOTTOM

The bottom position of terminals allows for easy access and soldering during assembly, improving the overall manufacturability of the device.

Moisture Sensitivity Level (MSL): 4

The MSL rating indicates the device's resistance to moisture, making it suitable for high-humidity environments or reflow soldering processes.

Maximum Seated Height: 3.5 mm

The low profile of the device minimizes the overall height of the circuit board, allowing for compact system designs and efficient use of space.

Width: 42.5 mm

The standard width dimension provides compatibility with common board layouts and facilitates easy integration into existing systems.

Maximum Clock Frequency: 1818 MHz

The high clock frequency capability enables fast signal processing and high-speed data transfer, making this FPGA suitable for real-time applications.

No. of Outputs: 850

The abundance of outputs offers flexibility and versatility in routing signals to external components, enhancing the functionality of the FPGA design.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature minimizes thermal stress on the device and ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance allows for robust solder joints and secure connections, ensuring the durability of the FPGA in harsh environments.

Length: 42.5 mm

The standard length dimension enables compatibility with various board sizes and layouts, facilitating easy installation and integration of the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7VX690T-2FFG1761I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

693120

No. of Inputs:

850

No. of Outputs:

850

No. of CLBs:

54150

Maximum Clock Frequency:

1818 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

54150 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

42.5 mm

Width:

42.5 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1760,42X42,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1761

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7VX690T-2FFG1761I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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