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XC7V2000T-1FHG1761I

Xilinx

XC7V2000T-1FHG1761I by Xilinx

The Xilinx XC7V2000T-1FHG1761I FPGA features 1954560 logic cells, 152700 CLBs, and a max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and complex logic functions, such as telecommunications equipment and industrial automation systems.

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Overview

Unleash the power of cutting-edge technology with Xilinx's XC7V2000T-1FHG1761I Field Programmable Gate Array. With over 1.9 million logic cells and 152,700 CLBs, this FPGA is a game-changer in the world of programmable ICs. From aerospace to automotive industries, its versatility knows no bounds. Xilinx, a renowned manufacturer known for reliability and innovation, has crafted a product that offers unmatched performance and flexibility. Experience seamless integration, high clock frequencies, and optimal power efficiency with the XC7V2000T-1FHG1761I. Elevate your projects to new heights with Xilinx's FPGA solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the FPGA, making it suitable for various applications.

No. of Logic Cells: 1954560

High number of logic cells provide extensive logic processing capabilities, allowing for complex designs and algorithms to be implemented efficiently.

Surface Mount: YES

Surface mount capability simplifies the installation process and saves space on the PCB, making it ideal for compact electronic designs.

Maximum Supply Voltage: 1.03 V

With a maximum supply voltage of 1.03 V, this FPGA is energy efficient and can operate within low power consumption constraints.

Technology Used: CMOS

CMOS technology offers high-speed performance, low power consumption, and improved noise immunity, making the FPGA reliable and efficient.

No. of Inputs: 850

850 inputs allow for a wide range of input signals to be processed, enabling the FPGA to handle diverse data processing tasks effectively.

Package Shape: SQUARE

Square package shape provides uniform distribution of components and simplifies placement on the PCB, enhancing the overall reliability of the FPGA.

Form Of Terminal: BALL

Ball terminal design ensures secure connections and facilitates easy integration of the FPGA into the circuit layout, promoting efficient operation.

Power Supplies (V): 1, 1.8

Multiple power supply options (1V and 1.8V) offer flexibility in voltage requirements, enabling the FPGA to be compatible with different power sources.

No. of Terminals: 1761

High number of terminals allow for extensive connectivity options, making it easier to interface the FPGA with other components and subsystems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC type allows for reprogramming and customization of logic functions as needed, offering flexibility in design.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient thermal management and signal routing, enhancing the overall performance and reliability of the FPGA.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage requirement (0.97 V) ensures compatibility with a wide range of power sources and enables energy-efficient operation.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance (100°C) makes the FPGA suitable for industrial and harsh environments where temperature fluctuations are common.

Pitch Of Terminal: 1 mm

1 mm pitch of terminals allows for precise and secure connections, ensuring stable performance and preventing signal interference.

Maximum Combinatorial Delay of a CLB: 0.74 ns

Low maximum combinatorial delay of a Configurable Logic Block (CLB) (0.74 ns) ensures fast logic operations and reduced latency in processing tasks.

Organization: 152700 CLBS

Organized into 152700 Configurable Logic Blocks (CLBs), this FPGA offers scalable and efficient logic processing capabilities, making it suitable for complex designs.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range (-40°C) allows the FPGA to function in extreme cold conditions, making it versatile and suitable for various applications.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing of terminals ensures corrosion resistance and reliable contact points, enhancing the longevity and performance of the FPGA.

Position Of Terminal: BOTTOM

Bottom terminal positioning facilitates easy integration into the PCB layout, optimizing space usage and improving signal integrity in the circuit design.

Maximum Seated Height: 3.75 mm

Low maximum seated height of 3.75 mm allows for compact and space-saving PCB designs, making the FPGA ideal for applications with size constraints.

Width: 45 mm

Standard width of 45 mm ensures compatibility with common PCB layouts and facilitates easy installation and integration of the FPGA into electronic systems.

Maximum Clock Frequency: 1818 MHz

High maximum clock frequency of 1818 MHz allows for fast and efficient signal processing, making the FPGA suitable for high-speed applications that require quick response times.

No. of Outputs: 850

With 850 outputs, the FPGA can drive a large number of external devices and components, enabling it to control and manage multiple functions simultaneously.

Length: 45 mm

Standard length of 45 mm ensures compatibility with common PCB dimensions and simplifies the integration of the FPGA into electronic systems, enhancing ease of use.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7V2000T-1FHG1761I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1954560

No. of Inputs:

850

No. of Outputs:

850

No. of CLBs:

152700

Maximum Clock Frequency:

1818 MHz

CLB Maximum Delay:

0.74 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

152700 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

45 mm

Width:

45 mm

Maximum Seated Height:

3.75 mm

Package Equivalence Code:

BGA1760,42X42,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1761

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7V2000T-1FHG1761I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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