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XC7V2000T-1FHG1761C

Xilinx

XC7V2000T-1FHG1761C by Xilinx

The Xilinx XC7V2000T-1FHG1761C is a FPGA with 1954560 logic cells, 152700 CLBs, and max clock frequency of 1818 MHz. It uses CMOS technology and has 850 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds in compact designs.

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Overview

Unlock limitless possibilities with the XC7V2000T-1FHG1761C by Xilinx, a leading manufacturer in Field Programmable Gate Arrays. Whether you're developing cutting-edge technology or revolutionizing existing systems, this FPGA offers unmatched performance and flexibility. With over 1.9 million logic cells and advanced CMOS technology, this powerhouse device delivers lightning-fast speeds and unparalleled customization. From telecommunications to aerospace, the applications are endless. Experience the ultimate in innovation and efficiency with the XC7V2000T-1FHG1761C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the FPGA lightweight and durable, ideal for applications where weight and durability are important factors.

No. of Logic Cells: 1954560

With a large number of logic cells, this FPGA is capable of handling complex algorithms and tasks efficiently.

Surface Mount: YES

Being surface mountable, this FPGA can be easily integrated into existing circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 152700

The high number of Configurable Logic Blocks (CLBs) allows for flexible customization and adaptation to various application requirements.

Technology Used: CMOS

The use of CMOS technology ensures low power consumption and high reliability, making it suitable for battery-powered devices.

No. of Inputs: 850

With a large number of inputs, this FPGA can interface with numerous external devices and sensors, enhancing its versatility.

Package Shape: SQUARE

The square shape of the package allows for easier handling and integration into space-constrained designs.

Form Of Terminal: BALL

The use of ball terminals simplifies the process of mounting and soldering the FPGA onto a circuit board, reducing assembly time.

Power Supplies (V): 0.9,1.8

Supporting multiple power supply options provides flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 1761

The high number of terminals allows for efficient signal routing and connectivity, enhancing overall performance.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology offers reconfigurability, allowing for quick changes and updates to the logic design without the need for a new chip.

Package Style (Meter): GRID ARRAY

The grid array package style offers increased mechanical strength and reliability, ensuring long-lasting performance in harsh environments.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the FPGA to perform reliably in demanding thermal conditions without overheating.

Pitch Of Terminal: 1 mm

The small pitch of terminals enables closer spacing for efficient signal routing, reducing signal interference and improving performance.

Maximum Combinatorial Delay of a CLB: 0.74 ns

The low maximum combinatorial delay of a CLB ensures fast processing of logic operations, enhancing overall speed and efficiency.

Organization: 152700 CLBS

The organized layout of CLBs simplifies the design process and enhances the overall performance of the FPGA.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable functionality even in cold environments, expanding the range of potential applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of multiple finishing materials provides durability and corrosion resistance, ensuring long-term reliability.

Position Of Terminal: BOTTOM

The bottom positioning of terminals allows for easier PCB layout and routing of signals, optimizing the overall design efficiency.

Maximum Seated Height: 3.75 mm

The low maximum seated height of the FPGA enables compact and slim designs, saving space in densely populated circuit boards.

Width: 45 mm

The compact width of the FPGA makes it suitable for space-constrained designs where size is a critical factor.

Maximum Clock Frequency: 1818 MHz

The high maximum clock frequency enables rapid data processing and high-speed operation, ideal for real-time applications.

No. of Outputs: 850

With a large number of outputs, this FPGA can drive multiple devices and interfaces, enhancing its connectivity and functionality.

Length: 45 mm

The compact length of the FPGA allows for efficient placement on PCBs, maximizing space utilization and design flexibility.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7V2000T-1FHG1761C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1954560

No. of Inputs:

850

No. of Outputs:

850

No. of CLBs:

152700

Maximum Clock Frequency:

1818 MHz

CLB Maximum Delay:

0.74 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

152700 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

0.9,1.8 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

45 mm

Width:

45 mm

Maximum Seated Height:

3.75 mm

Package Equivalence Code:

BGA1760,42X42,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1761

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7V2000T-1FHG1761C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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