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XC7VX485T-2FFG1761C

Xilinx

XC7VX485T-2FFG1761C by Xilinx

The Xilinx XC7VX485T-2FFG1761C is a FPGA with 485,760 logic cells and 37950 CLBs. It operates at max frequency of 1818 MHz, suitable for high-performance applications like telecommunications and data processing. With a package style of grid array and CMOS technology, it offers versatile programmable IC solutions.

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Vyrian

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AZTECH Wire

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One Stop Electronics

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Modulus Dynamics

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Texas Native Microelectronics

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Overview

Unlock the potential of your designs with the XC7VX485T-2FFG1761C by Xilinx, a cutting-edge Field Programmable Gate Array (FPGA) that offers unparalleled quality and performance. With over 485,000 logic cells and advanced CMOS technology, this FPGA delivers superior flexibility and efficiency for a wide range of applications. Xilinx, a trusted industry leader, ensures top-notch reliability and support, making the XC7VX485T-2FFG1761C a valuable investment for your projects. Experience the benefits of faster processing speeds, optimized power consumption, and seamless integration with this exceptional FPGA solution. Elevate your designs to the next level with Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and flexibility for various mounting options.

No. of Logic Cells: 485760

Offers high capacity for complex logic designs.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.03 V

Ensures stable power operation within specified limits.

Technology Used: CMOS

Utilizes efficient and low-power consumption technology.

No. of Inputs: 700

Provides ample input channels for versatile connectivity.

Package Shape: SQUARE

Facilitates compact and uniform board layout designs.

Power Supplies (V): 1,1.8

Offers flexibility for different power requirements.

No. of Terminals: 1761

Provides multiple connection points for enhanced versatility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for customizable logic functions and configurations.

Package Style (Meter): GRID ARRAY

Facilitates efficient heat dissipation and signal routing.

Minimum Supply Voltage: 0.97 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Suitable for various environmental conditions and applications.

Pitch Of Terminal: 1 mm

Optimal spacing for easy connection and board layout.

Maximum Combinatorial Delay of a CLB: 0.61 ns

Provides fast processing and response times for logic operations.

Organization: 37950 CLBS

Offers a high level of organization for complex logic designs.

Minimum Operating Temperature: 0 °C

Ensures reliable operation even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Enhances conductivity and durability of terminal connections.

Position Of Terminal: BOTTOM

Facilitates easy access and connections on circuit boards.

Maximum Seated Height: 3.5 mm

Allows for low-profile and space-saving board designs.

Width: 42.5 mm

Compact size for efficient board layout and integration.

Maximum Clock Frequency: 1818 MHz

High clock speed for rapid processing and operation.

No. of Outputs: 700

Provides multiple output channels for versatile connectivity.

Length: 42.5 mm

Uniform size for consistent board dimensions and layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7VX485T-2FFG1761C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

485760

No. of Inputs:

700

No. of Outputs:

700

No. of CLBs:

37950

Maximum Clock Frequency:

1818 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

37950 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

42.5 mm

Width:

42.5 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1760,42X42,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1761

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7VX485T-2FFG1761C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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