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W25Q64FWSSIG

Winbond Electronics

W25Q64FWSSIG by Winbond Electronics

W25Q64FWSSIG by Winbond Electronics is a 64M NOR Flash Memory with SPI interface. Features include 104 MHz clock frequency, 1.8V programming voltage, and 100K Write/Erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact form factors.

Median Price

$0.911

Lifecycle Status

Suppliers In-Stock

15

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1k+

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Chip1Stop

Japan . 4,644 parts In-Stock

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Verical

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Chip Stock

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Vyrian

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Conversion2

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Cyclops Electronics Ltd

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Bristol Electronics

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Atlantic Semiconductor

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Nova Conductors

Japan . 900 parts In-Stock

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Sensible Micro Corp

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SPM Sales

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Semtec, LLC

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Prism Electronics

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Advanced Electronics

New Zealand . 50 parts In-Stock

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AZTECH Wire

Italy . 522 parts In-Stock

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RC Electronics

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Authorized Procurement Solutions

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Perfect Parts

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Continental Prestige Electronics

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Argo Parts USA

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GreenTree Electronics

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iodParts Technologies Inc.

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Bastille Electronics

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Overview

Unlock endless possibilities with the Winbond Electronics W25Q64FWSSIG Flash Memory. Manufactured by a trusted industry leader, this high-quality product offers reliable performance and durability. Perfect for a wide range of applications, this flash memory provides fast and efficient data storage solutions. Experience the value and benefits of seamless operation, secure data storage, and ease of use with the W25Q64FWSSIG. Take your projects to the next level with this versatile and advanced technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it a good choice for long-term use.

Surface Mount: YES

With surface mount capability, this flash memory can be easily integrated into various electronic devices, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making it suitable for compact designs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures synchronized data transfer, enhancing performance and speed.

Nominal Supply Voltage: 1.8V

Operating at a low nominal supply voltage of 1.8V helps reduce power consumption, making it energy-efficient.

No. of Terminals: 8

With 8 terminals, this flash memory offers sufficient connectivity options for integration into various electronic systems.

Package Style: SMALL OUTLINE

The small outline package style provides a compact form factor, suitable for applications with limited space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this flash memory can withstand demanding environmental conditions.

Organization: 64MX1

The organization of 64MX1 offers a high memory density, allowing for storage of a large amount of data in a compact chip.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN

The use of tin terminal finish protects against corrosion and ensures a stable electrical connection, increasing the longevity of the product.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and allows for more efficient routing of connections on a circuit board.

Write Protection: HARDWARE/SOFTWARE

The option for both hardware and software write protection enhances the security of stored data, making it a reliable choice for sensitive information.

Technical Specifications

Flash Memory W25Q64FWSSIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

1.8

Programming Voltage (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5.28 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q64FWSSIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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