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W25Q40CLSSIG

Winbond Electronics

W25Q40CLSSIG by Winbond Electronics

W25Q40CLSSIG by Winbond Electronics is a 4MX1 NOR flash memory with 104 MHz clock frequency, SPI serial bus type. Operating at -40 to 85 °C, it offers 100000 Write/Erase Cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact form factors.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,136 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 482 parts In-Stock

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$2.398

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482

$2.398

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Aztec Data Supply Inc.

USA . 2,761 parts In-Stock

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$5.292

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AZTECH Wire

Italy . 193 parts In-Stock

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$14.033

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193

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,334 parts In-Stock

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Argo Parts USA

USA . 5,255 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the W25Q40CLSSIG by Winbond Electronics - a high-quality flash memory solution that delivers unmatched performance and reliability. With Winbond's reputation for excellence in manufacturing, this product guarantees seamless operation and durability. Ideal for a wide range of applications, this flash memory offers customers the value of fast data transfer, secure storage, and efficient power consumption. Elevate your technology experience with Winbond Electronics and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for easy handling and long-term use.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures that data transfer and processing are synchronized, leading to efficient performance and reliability.

Maximum Clock Frequency (fCLK): 104 MHz

With a high maximum clock frequency, this flash memory can process data quickly, making it suitable for applications requiring high-speed operations.

Endurance: 100000 Write/Erase Cycles

The high endurance level of 100000 write/erase cycles ensures durability and longevity of the flash memory, making it a reliable storage solution.

Memory Density: 4194304 bit

With a high memory density of 4194304 bits, this flash memory can store a large amount of data in a compact size, making it ideal for space-constrained applications.

Technical Specifications

Flash Memory W25Q40CLSSIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

Length:

5.28 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

16 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

5.28 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q40CLSSIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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