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S25FL128LAGMFV010

Infineon Technologies

S25FL128LAGMFV010 by Infineon Technologies

S25FL128LAGMFV010 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus, and 100000 write/erase cycles. It operates at -40 to 105 °C, suitable for industrial applications requiring high endurance and fast data transfer. The small outline package with dual terminals and hardware/software write protection makes it ideal for compact electronic devices.

Median Price

$2.620

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,118 parts In-Stock

1+ parts

$2.590

100+ parts

$2.250

1k+ parts

$2.110

10k+ parts

-

1,118

$2.590

$2.250

$2.110

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Chip1Stop

Japan . 1,521 parts In-Stock

1+ parts

$2.610

100+ parts

$2.300

1k+ parts

-

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1,521

$2.610

$2.300

-

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Mouser Electronics

USA . 2,761 parts In-Stock

1+ parts

$2.620

100+ parts

$2.280

1k+ parts

$2.090

10k+ parts

$1.970

2,761

$2.620

$2.280

$2.090

$1.970

DigiKey

USA . 1,129 parts In-Stock

1+ parts

$2.620

100+ parts

$2.271

1k+ parts

$2.137

10k+ parts

$1.972

1,129

$2.620

$2.271

$2.137

$1.972

Element14

Singapore . 645 parts In-Stock

1+ parts

$4.534

100+ parts

$3.574

1k+ parts

$3.276

10k+ parts

-

645

$4.534

$3.574

$3.276

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Farnell

UK . 645 parts In-Stock

1+ parts

$4.957

100+ parts

$3.511

1k+ parts

$3.369

10k+ parts

-

645

$4.957

$3.511

$3.369

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Rochester

USA . 1,784 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

1,784

-

$1.560

$1.390

$1.310

Verical

USA . 1,212 parts In-Stock

1+ parts

-

100+ parts

$2.196

1k+ parts

$1.960

10k+ parts

$1.854

1,212

-

$2.196

$1.960

$1.854

RS (Exports)

UK . 293 parts In-Stock

1+ parts

-

100+ parts

$4.574

1k+ parts

$3.873

10k+ parts

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293

-

$4.574

$3.873

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 62 parts In-Stock

1+ parts

$1.644

100+ parts

-

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62

$1.644

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.226

100+ parts

-

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10

$3.226

-

-

-

Chip Stock

USA . 5,340 parts In-Stock

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5,340

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ACDS - Activité Composants Distribution Service

France . 1,400 parts In-Stock

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1,400

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Vyrian

USA . 1,229 parts In-Stock

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Flip Electronics

USA . 890 parts In-Stock

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890

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Speed Components Ltd

Israel . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,445 parts In-Stock

1+ parts

$1.470

100+ parts

-

1k+ parts

-

10k+ parts

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1,445

$1.470

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Semicontronic

India . 1,419 parts In-Stock

1+ parts

$1.470

100+ parts

$1.433

1k+ parts

$1.426

10k+ parts

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1,419

$1.470

$1.433

$1.426

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Corphita

USA . 179 parts In-Stock

1+ parts

$1.557

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179

$1.557

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Continental Prestige Electronics

USA . 668 parts In-Stock

1+ parts

$1.670

100+ parts

$1.160

1k+ parts

$1.090

10k+ parts

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668

$1.670

$1.160

$1.090

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Aztec Data Supply Inc.

USA . 4,361 parts In-Stock

1+ parts

$2.230

100+ parts

-

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4,361

$2.230

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Argo Parts USA

USA . 4,234 parts In-Stock

1+ parts

$3.226

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4,234

$3.226

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Netroflash

USA . 500 parts In-Stock

1+ parts

$3.226

100+ parts

$3.162

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500

$3.226

$3.162

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CoreStaff

Japan . 1,336 parts In-Stock

1+ parts

$3.470

100+ parts

$2.920

1k+ parts

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1,336

$3.470

$2.920

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Modulus Dynamics

Lithuania . 6,231 parts In-Stock

1+ parts

$4.431

100+ parts

$4.254

1k+ parts

$4.077

10k+ parts

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6,231

$4.431

$4.254

$4.077

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Corohmni

South Africa . 5 parts In-Stock

1+ parts

$5.527

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5

$5.527

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$6.034

100+ parts

$5.732

1k+ parts

$5.732

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5,000

$6.034

$5.732

$5.732

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QUARKTWIN TECHNOLOGY LTD

USA . 26,779 parts In-Stock

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26,779

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RC Electronics

USA . 6,684 parts In-Stock

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$3.450

1k+ parts

$3.150

10k+ parts

$3.050

6,684

-

$3.450

$3.150

$3.050

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 2 parts In-Stock

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2

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Overview

Unlock the power of reliable and high-quality flash memory with the S25FL128LAGMFV010 by Infineon Technologies. Designed to meet the demands of industrial applications, this NOR type memory offers 16MX8 organization, 133 MHz clock frequency, and 100,000 write/erase cycles for lasting performance. With a compact square package style and synchronous operating mode, this flash memory is perfect for a wide range of applications. Trust in Infineon's expertise and choose the S25FL128LAGMFV010 for dependable storage solutions that deliver value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable construction for ease of handling and transportation.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, providing efficient use of space and simplified assembly processes.

Package Shape: SQUARE

The square shape of the package offers uniformity in design, making it easy to stack or arrange multiple units for compact storage.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and coordination between the memory and the system, enhancing overall performance and reliability.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V ensures compatibility with a wide range of systems and power sources, making it versatile and easy to integrate.

No. of Terminals: 8

With 8 terminals, this product offers greater connectivity options and flexibility in interfacing with other components, enhancing overall functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space in compact designs, making it ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliability and stability in harsh environments, making it suitable for industrial use.

Organization: 16MX8

The organization of 16MX8 provides a high memory capacity and efficient data storage arrangement, allowing for large amounts of information to be stored and accessed quickly.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for multiple devices to share a common bus, enabling flexibility and efficiency in data transmission.

Technical Specifications

Flash Memory S25FL128LAGMFV010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00006 Amp

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5.28 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128LAGMFV010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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