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5962-8606309UX

Waferscale Integration

5962-8606309UX by Waferscale Integration

UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 32768 words;

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Anansix

USA . 2,213 parts In-Stock

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Digiode

USA . 1,067 parts In-Stock

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Vyrian

USA . 27 parts In-Stock

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IDEA Electronic Components Group

UK . 2,109 parts In-Stock

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$3.961

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$3.565

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MKK Technologies

India . 2,047 parts In-Stock

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$7.448

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DigiPath Technology Company

USA . 2,047 parts In-Stock

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$7.448

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Northwest PG Solutions

USA . 1,334 parts In-Stock

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Native Components

USA . 239 parts In-Stock

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Corphita

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Parana Technologies

USA . 79 parts In-Stock

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Technical Specifications

EPROM 5962-8606309UX attributes and parameters. Explore more EPROM devices from Waferscale Integration

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Standby Current:

.045 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

115 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

5962-8606309UX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Waferscale Integration

STMicroelectronics acquires Waferscale Integration, Inc. After many years of cooperating as their design and manufacturing partner, STMicroelectronics is acquiring provider of programmable system devices (PSDs), Waferscale Integration Inc. (Fremont, California). WSI was a privately held corporation funded by corporate, institutional, private and venture capital investors. Prior to the acquisition, ST held a 14.5% minority interest in the company and will invest $68 million to acquire full ownership. With the acquisition of WSI, ST will obtain the product portfolio, intellectual property and technologies developed by the company in the field of non-volatile memories and memory systems. The acquisition will also reinforce ST's presence in Israel, where ST has a joint Design Center with Altec-Lansing, and in Silicon Valley, where ST already has an advanced Design Center, a joint Design Center with Hitachi and close links with the University of California at Berkeley. WSI is known for PSD products that combine memory functions such as Flash, EEPROM and SRAM with programmable logic on a chip that is designed to work with a standard microcontroller. PSDs can be programmed without special manufacturing equipment, even in the field, making them particularly attractive in applications such as medical equipment, automotive control systems, industrial process control systems, applications where large amounts of parameter updates are required, and low to medium volume applications. "We have been delighted by the acceptance to date of our innovative Flash products. Now that it is supported by ST's manufacturing machine and global resources in product support and development, the PSD concept will proliferate across the ST customer base and will meet the needs of new high volume customers, while providing enhanced service to our current customer base," said Mike Callahan, President and CEO of WSI. WSI's operations will continue to be headquartered in the Silicon Valley area but will now function as an operational Business Unit within STMicroelectronics' Memory Products Group. STMicroelectronics designs, develops, manufactures and markets semiconductor integrated circuits (ICs) and discrete devices used in a wide variety of microelectronic applications, including telecommunications systems, computer systems, consumer products, automotive products and industrial automation and control systems.

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