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SIA453EDJ-T1-GE3

Vishay Intertechnology

SIA453EDJ-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIA453EDJ-T1-GE3 is a P-channel FET with 30V DS breakdown voltage, 80A IDM, and 0.026 ohm RDS(on). Ideal for switching applications, it features a built-in diode, operates in enhancement mode, and has a small outline package style.

Median Price

$1.219

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,883 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,965 parts In-Stock

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Chip Stock

USA . 2,722 parts In-Stock

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Dan-Mar Components

USA . 1,965 parts In-Stock

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1,965

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Bristol Electronics

USA . 1,765 parts In-Stock

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$1.219

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$0.682

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$0.643

1,765

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$1.219

$0.682

$0.643

Nova Conductors

Japan . 150 parts In-Stock

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Prism Electronics

USA . 100 parts In-Stock

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Semtec, LLC

USA . 74 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,338 parts In-Stock

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$0.817

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3,338

$0.817

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$1.045

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$0.951

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$0.857

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50

$1.045

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$0.857

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Corohmni

South Africa . 320 parts In-Stock

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$1.780

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320

$1.780

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Ampacity Inc.

Singapore . 1,200 parts In-Stock

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$9.050

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AZTECH Wire

Italy . 734 parts In-Stock

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$9.271

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Continental Prestige Electronics

USA . 6,355 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,700 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Kepictronics

USA . 441 parts In-Stock

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441

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Overview

Discover the power and reliability of the SIA453EDJ-T1-GE3 by Vishay Intertechnology, a high-quality Power Field Effect Transistor perfect for switching applications. With a single configuration and built-in diode, this P-Channel transistor offers enhanced performance and efficiency. Say goodbye to technical headaches and hello to seamless operation with this surface mount device. Trust in Vishay Intertechnology's expertise and elevate your projects with the SIA453EDJ-T1-GE3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower resistance and higher efficiency compared to N-channel FETs, making them a good choice for various applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and protects against reverse current flow, enhancing the overall functionality and reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and efficient power management, making it ideal for various electronic devices.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation onto circuit boards, saving space and reducing assembly time in electronic devices.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage of 30V ensures reliable performance and protection against voltage spikes, making it suitable for a wide range of applications requiring voltage regulation.

Maximum Pulsed Drain Current (IDM): 80 A

The high pulsed drain current rating of 80A enables the FET to handle high peak currents without damage, making it suitable for demanding applications that require high power handling capabilities.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET provides high switching speeds, low power consumption, and reliable performance, making it a suitable choice for a wide range of applications.

Maximum Drain-Source On Resistance: 0.026 ohm

The low drain-source on resistance of 0.026 ohms ensures efficient power flow and minimal power loss, making this FET ideal for applications that require high efficiency and low heat dissipation.

Technical Specifications

Power Field Effect Transistors (FET) SIA453EDJ-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

80 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIA453EDJ-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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