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SIA444DJT-T1-GE3

Vishay Intertechnology

SIA444DJT-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIA444DJT-T1-GE3 is a N-channel Power FET with 30V DS Breakdown Voltage, ideal for switching applications. Featuring a single configuration with built-in diode, it offers 12A max Drain Current and 0.017 ohm max On Resistance. This MOSFET operates in enhancement mode at up to 150°C, making it suitable for high-power applications.

Median Price

$0.178

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$0.178

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Vyrian

USA . 6,227 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,767 parts In-Stock

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$0.178

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$0.174

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Argo Parts USA

USA . 2,139 parts In-Stock

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$0.178

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$0.173

2,139

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Netroflash

USA . 50 parts In-Stock

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$0.178

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$0.174

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Aztec Data Supply Inc.

USA . 1,413 parts In-Stock

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$1.290

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Corohmni

South Africa . 6 parts In-Stock

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$1.566

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AZTECH Wire

Italy . 549 parts In-Stock

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$16.098

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549

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Ampacity Inc.

Singapore . 871 parts In-Stock

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$34.050

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$34.050

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Semicontronic

India . 1,406 parts In-Stock

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$38.050

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$37.099

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$36.908

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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Kepictronics

USA . 3,690 parts In-Stock

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Perfect Parts

USA . 3,360 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Overview

Enhance your electronic designs with the Vishay Intertechnology SIA444DJT-T1-GE3 Power Field Effect Transistor (FET). Designed with high-quality materials and advanced technology, this N-channel transistor offers superior performance in switching applications. With a maximum drain current of 12A and a low on-resistance of 0.017 ohm, this FET delivers reliable power management. Whether you're working on automotive, industrial, or consumer electronics projects, trust Vishay Intertechnology to provide the innovative solutions you need for success. Upgrade your designs today with the SIA444DJT-T1-GE3!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides durability to the package, ensuring the reliability and longevity of the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher current-carrying capabilities, making them efficient for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for efficient switching and protection against reverse current flow, enhancing the functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in controlling the flow of current.

Surface Mount: YES

Surface mount configuration allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without getting damaged, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 40 A

High pulsed drain current rating allows the FET to handle short bursts of current without getting damaged, making it suitable for applications with high inrush currents.

Maximum Power Dissipation (Abs): 19 W

High power dissipation capability ensures the FET can handle heat generated during operation, improving overall reliability.

Maximum Operating Temperature: 150 °C

High operating temperature rating allows the FET to operate reliably in demanding environments without overheating.

Technical Specifications

Power Field Effect Transistors (FET) SIA444DJT-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIA444DJT-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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