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DP83848K

Texas Instruments

DP83848K by Texas Instruments

DP83848K by Texas Instruments is a 40-terminal Ethernet transceiver with CMOS technology. Operating at -40 to 85°C, it has a 3.3V supply voltage and 0.5mm terminal pitch. Ideal for network interfaces, this chip carrier package is surface mountable and suited for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,098 parts In-Stock

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Vyrian

USA . 2,057 parts In-Stock

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2,057

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Anansix

USA . 712 parts In-Stock

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Parana Technologies

USA . 1,485 parts In-Stock

1+ parts

$7.316

100+ parts

$679.383

1k+ parts

$6.584

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1,485

$7.316

$679.383

$6.584

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Native Components

USA . 53 parts In-Stock

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$7.545

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53

$7.545

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DigiPath Technology Company

USA . 1,997 parts In-Stock

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$8.056

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1,997

$8.056

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ChromeModa Solutions

Germany . 4,639 parts In-Stock

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$8.220

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$6.740

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4,639

$8.220

$6.740

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IDEA Electronic Components Group

UK . 2,034 parts In-Stock

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$8.220

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$7.398

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2,034

$8.220

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$7.398

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AZTECH Wire

Italy . 725 parts In-Stock

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$14.010

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725

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One Stop Electronics

USA . 1,594 parts In-Stock

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$365.000

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Lixinc

USA . 7,146 parts In-Stock

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Corphita

USA . 2,808 parts In-Stock

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Northwest PG Solutions

USA . 2,313 parts In-Stock

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$7.394

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2,313

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock seamless networking with the DP83848K by Texas Instruments, a top-of-the-line Ethernet transceiver that guarantees high-quality performance and reliability. Manufactured by industry leader Texas Instruments, this network interface chip boasts a sleek square package shape with a very thin profile, making it an ideal choice for a wide range of applications. With a temperature grade of industrial and a nominal supply voltage of 3.3V, the DP83848K offers customers unparalleled value, benefits, and advantages in their networking solutions. Upgrade your network today with the DP83848K and experience superior connectivity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and cost-effective PCB assembly, making this product suitable for mass production in electronic devices.

Package Shape: SQUARE

Square package shape provides efficient use of PCB space and allows for uniform and symmetrical placement in circuit designs.

No. of Terminals: 40

40 terminals provide ample connectivity options for various networking applications, making this product versatile and adaptable to different setups.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packages ensures efficient heat dissipation and compact design, making this product suitable for space-constrained environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh operating conditions and environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in extreme cold conditions, making this product ideal for a wide range of environments.

Terminal Position: QUAD

Quad terminal position allows for easy PCB layout and routing, simplifying the assembly process and improving overall efficiency.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8 mm, this product offers a low profile design that is suitable for thin and compact electronic devices.

Width: 6 mm

A width of 6 mm provides a balance between compactness and ease of handling during assembly, making this product convenient for integration into electronic systems.

Length: 6 mm

A length of 6 mm offers a symmetrical and uniform footprint that facilitates consistent placement on PCBs, ensuring proper alignment and routing in electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can operate reliably in rugged environments with varying temperature conditions, ensuring long-term durability and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for stable data transmission in networking applications.

Terminal Form: NO LEAD

The no-lead terminal form provides improved thermal performance and solder joint reliability, enhancing the overall quality and longevity of this product.

Telecom IC Type: ETHERNET TRANSCEIVER

As an Ethernet transceiver, this product enables high-speed data communication over networks, making it suitable for a wide range of network interface applications.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this product is compatible with standard power sources and ensures stable operation for network connectivity without the need for additional voltage regulation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and improved signal integrity, making this product suitable for compact electronic devices with demanding networking requirements.

Technical Specifications

Network Interfaces DP83848K attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

DP83848K Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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