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XOPA3S328RGRR

Texas Instruments

XOPA3S328RGRR by Texas Instruments

XOPA3S328RGRR by Texas Instruments is a CMOS operational amplifier with low-offset and low-bias features. It has a max input offset voltage of 90 uV, nominal unity gain bandwidth of 40 MHz, and min voltage gain of 31622. Ideal for applications requiring precise signal amplification in compact spaces due to its small package size and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,253 parts In-Stock

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Digiode

USA . 1,417 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,230 parts In-Stock

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$0.410

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$0.410

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Corohmni

South Africa . 450 parts In-Stock

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$4.008

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$4.008

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Parana Technologies

USA . 1,669 parts In-Stock

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$4.285

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$4.713

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$4.285

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DigiPath Technology Company

USA . 687 parts In-Stock

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$4.719

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$4.341

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687

$4.719

$4.341

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ChromeModa Solutions

Germany . 6,543 parts In-Stock

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$4.815

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$3.948

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IDEA Electronic Components Group

UK . 249 parts In-Stock

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$4.815

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$4.334

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AZTECH Wire

Italy . 684 parts In-Stock

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$6.474

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One Stop Electronics

USA . 339 parts In-Stock

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Argo Parts USA

USA . 4,493 parts In-Stock

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Continental Prestige Electronics

USA . 1,959 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience seamless and reliable performance with the XOPA3S328RGRR by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality Operational Amplifiers (Op Amps) like this one that offer unparalleled precision and efficiency. Ideal for a wide range of applications, this chip carrier boasts low-offset and low-bias features, ensuring optimal performance. With a nominal unity gain bandwidth of 40000 kHz and maximum seated height of just 1 mm, this operational amplifier is perfect for compact designs that require high-speed and wideband capabilities. Upgrade your projects with the XOPA3S328RGRR and enjoy superior quality and performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and cost-effectiveness, making the product a reliable choice.

Maximum Input Offset Voltage: 90 uV

This low value ensures accurate output signals, making the product suitable for precision applications.

Maximum Average Bias Current (IIB): 0.00001 uA

With such a low bias current, the product offers excellent stability and minimal interference in operation.

Surface Mount: YES

This feature allows for easy installation and saves space on the circuit board, making it a convenient choice for small designs.

No. of Functions: 2

With multiple functions, this product offers versatility and flexibility in various applications, making it a versatile choice.

Package Shape: SQUARE

The square shape of the package offers efficient use of space and easy integration into the circuit layout, making it a practical choice.

Nominal Common Mode Reject Ratio: 110 dB

This high rejection ratio ensures minimal noise and interference, making the product ideal for high-performance applications.

No. of Terminals: 20

With a higher number of terminals, this product offers connectivity options and allows for more complex circuit configurations, making it a versatile choice.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility in design and heat dissipation options, making the product suitable for diverse applications.

Maximum Supply Voltage Limit: 3 V

This limit ensures safe operation and protects the components, making the product reliable and long-lasting.

Technical Specifications

Operational Amplifiers (Op Amps) XOPA3S328RGRR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

40 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

110 dB

Minimum Common Mode Rejection Ratio (CMRR ):

96 dB

Input Offset Voltage Limit:

90 uV

Minimum Voltage Gain:

31622

Nominal Slew Rate:

30 V/us

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Maximum Supply Voltage:

3 V

Minimum Negative Supply Voltage:

-3 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

10 mA

Physical Characteristics

Length:

0.138 in (3.5 mm)

Width:

0.138 in (3.5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

20

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Quad

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Standards

JESD-30 Code:

S-PQCC-N20

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Equivalence Code:

LCC20,.14SQ,20

Trade Compliance

XOPA3S328RGRR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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