Loading...

VSP01M02ZWDR

Texas Instruments

VSP01M02ZWDR by Texas Instruments

VSP01M02ZWDR by Texas Instruments is a consumer circuit IC with 100 terminals in a square grid array package. Operating temperature ranges from -25 to 85°C, suitable for various applications. With a supply voltage range of 2.7-3.6V, it is ideal for compact electronic devices requiring high performance in limited space.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,831

-

-

-

-

Vyrian

USA . 2,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,775

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 730 parts In-Stock

1+ parts

$1.818

100+ parts

-

1k+ parts

$2.372

10k+ parts

-

730

$1.818

-

$2.372

-

ChromeModa Solutions

Germany . 4,356 parts In-Stock

1+ parts

$2.043

100+ parts

$1.675

1k+ parts

-

10k+ parts

-

4,356

$2.043

$1.675

-

-

IDEA Electronic Components Group

UK . 1,358 parts In-Stock

1+ parts

$2.043

100+ parts

-

1k+ parts

$1.839

10k+ parts

-

1,358

$2.043

-

$1.839

-

AZTECH Wire

Italy . 421 parts In-Stock

1+ parts

$7.214

100+ parts

-

1k+ parts

-

10k+ parts

-

421

$7.214

-

-

-

One Stop Electronics

USA . 1,594 parts In-Stock

1+ parts

$20.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

$20.800

-

-

-

Corphita

USA . 4,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,862

-

-

-

-

DigiPath Technology Company

USA . 495 parts In-Stock

1+ parts

-

100+ parts

$1.842

1k+ parts

-

10k+ parts

-

495

-

$1.842

-

-

Microchip USA

USA . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

220

-

-

-

-

Overview

Upgrade your consumer electronics with the VSP01M02ZWDR by Texas Instruments. Renowned for their high-quality manufacturing, Texas Instruments delivers excellence in the consumer IC category. This versatile product, with its grid array package style and fine pitch terminals, offers a wide range of applications. From household gadgets to smart devices, this IC provides reliability and efficiency. Experience the value and benefits that Texas Instruments brings to your projects with the VSP01M02ZWDR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape offers uniformity and compatibility with standardized mounting procedures.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and performance in various environmental conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for usage in cold environments without sacrificing functionality.

Width: 7 mm

Compact width enables space-saving design implementations in electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement promotes energy efficiency and extends battery life in portable devices.

Technical Specifications

Other Function Consumer ICs VSP01M02ZWDR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO IT REQUIRES 2.7V TO 3.6V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

VSP01M02ZWDR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 5