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VSP01M01ZWD

Texas Instruments

VSP01M01ZWD by Texas Instruments

VSP01M01ZWD by Texas Instruments is a consumer IC with 100 terminals in a square package. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.7V to 3.6V. This thin profile, fine pitch IC is ideal for various consumer circuit applications due to its compact size and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,351

-

-

-

-

Vyrian

USA . 3,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,735

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 572 parts In-Stock

1+ parts

$0.141

100+ parts

$13.059

1k+ parts

$0.127

10k+ parts

-

572

$0.141

$13.059

$0.127

-

DigiPath Technology Company

USA . 1,544 parts In-Stock

1+ parts

$0.155

100+ parts

-

1k+ parts

-

10k+ parts

-

1,544

$0.155

-

-

-

ChromeModa Solutions

Germany . 2,756 parts In-Stock

1+ parts

$0.158

100+ parts

$0.130

1k+ parts

-

10k+ parts

-

2,756

$0.158

$0.130

-

-

IDEA Electronic Components Group

UK . 637 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

$0.142

10k+ parts

-

637

$0.158

-

$0.142

-

One Stop Electronics

USA . 1,236 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$6.800

-

-

-

AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$10.366

100+ parts

-

1k+ parts

-

10k+ parts

-

390

$10.366

-

-

-

Corphita

USA . 303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

303

-

-

-

-

Microchip USA

USA . 265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

265

-

-

-

-

Overview

Elevate your consumer electronics with the VSP01M01ZWD by Texas Instruments. Crafted with precision and expertise, this consumer circuit offers top-notch quality and reliability for a wide range of applications. From cutting-edge technology to everyday devices, this versatile IC delivers exceptional value and performance. Experience seamless integration and enhanced functionality with the VSP01M01ZWD - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

Surface mount technology allows for efficient mounting and soldering of the IC onto a circuit board.

Package Shape: SQUARE

The square shape helps in easy placement and alignment on the circuit board.

Maximum Operating Temperature: 85 °C

Operating at a high temperature range of 85°C ensures stability and performance in various environments.

Minimum Operating Temperature: -25 °C

With a low minimum operating temperature of -25°C, the IC can function in cold conditions as well.

Terminal Position: BOTTOM

Bottom terminal position facilitates soldering and connection to the circuit board.

Width: 7 mm

The compact width of 7mm allows for space-efficient PCB layout design.

Minimum Supply Voltage (Vsup): 2.7 V

Operating at a low minimum supply voltage of 2.7V helps in energy efficiency.

Length: 7 mm

The small length of 7mm contributes to the overall compactness of the product.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm enables high-density mounting of the IC.

Maximum Supply Voltage (Vsup): 3.6 V

Operating at a maximum supply voltage of 3.6V ensures compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs VSP01M01ZWD attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO IT REQUIRES 2.7V TO 3.6V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

VSP01M01ZWD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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