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VSP01M01GWDR

Texas Instruments

VSP01M01GWDR by Texas Instruments

VSP01M01GWDR by Texas Instruments is a consumer circuit IC with 100 terminals in a square grid array package. Operating temperature ranges from -25 to 85°C, suitable for various applications. With a supply voltage range of 2.7-3.6V, it is ideal for compact electronic devices requiring high performance in limited space.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,843

-

-

-

-

Digiode

USA . 1,322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,322

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,116 parts In-Stock

1+ parts

$0.369

100+ parts

-

1k+ parts

$1.572

10k+ parts

-

2,116

$0.369

-

$1.572

-

DigiPath Technology Company

USA . 2,373 parts In-Stock

1+ parts

$0.407

100+ parts

-

1k+ parts

-

10k+ parts

-

2,373

$0.407

-

-

-

ChromeModa Solutions

Germany . 2,887 parts In-Stock

1+ parts

$0.415

100+ parts

$0.340

1k+ parts

-

10k+ parts

-

2,887

$0.415

$0.340

-

-

IDEA Electronic Components Group

UK . 1,431 parts In-Stock

1+ parts

$0.415

100+ parts

-

1k+ parts

$0.374

10k+ parts

-

1,431

$0.415

-

$0.374

-

One Stop Electronics

USA . 1,303 parts In-Stock

1+ parts

$4.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,303

$4.800

-

-

-

AZTECH Wire

Italy . 662 parts In-Stock

1+ parts

$12.415

100+ parts

-

1k+ parts

-

10k+ parts

-

662

$12.415

-

-

-

Corphita

USA . 2,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,527

-

-

-

-

Overview

Unlock a world of possibilities with the VSP01M01GWDR by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments brings you a cutting-edge consumer IC that promises reliability and performance. This versatile component is suitable for a wide range of applications, offering customers exceptional value and benefits. Whether you're looking to enhance your electronic devices or streamline your circuit designs, the VSP01M01GWDR delivers unrivaled advantages that will set you apart from the competition. Choose Texas Instruments for excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used in consumer ICs due to their cost-effectiveness and durability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto circuit boards, saving time and cost.

Package Shape: SQUARE

Square packages are space-efficient and allow for easier placement on circuit boards.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliable performance in everyday devices.

No. of Terminals: 100

Having multiple terminals allows for more connectivity options and functionality in the circuit design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch allows for high-density mounting and reduces overall footprint on the board.

Maximum Operating Temperature: 85 °C

Operates efficiently at higher temperatures, suitable for various electronic devices that may experience heat build-up.

Minimum Operating Temperature: -25 °C

Capable of functioning in low-temperature environments, making it versatile for different operating conditions.

Terminal Position: BOTTOM

Bottom terminal position ensures secure and stable connections with the circuit board for reliable performance.

Maximum Seated Height: 1.2 mm

Low seated height allows for a compact design, ideal for space-constrained applications.

Width: 7 mm

Narrow width provides flexibility in layout design and helps in optimizing space on the circuit board.

Minimum Supply Voltage (Vsup): 2.7 V

Operates at a low supply voltage, ideal for energy-efficient devices and extends battery life.

Length: 7 mm

Compact length contributes to a smaller overall package size, suitable for compact electronic devices.

Terminal Form: BALL

Ball terminal form offers reliable connections and facilitates easier attachment to the circuit board during assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and precise connections, improving overall performance.

Maximum Supply Voltage (Vsup): 3.6 V

Can handle higher supply voltages when required, providing flexibility in design for different applications.

Technical Specifications

Other Function Consumer ICs VSP01M01GWDR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

7 mm

Trade Compliance

VSP01M01GWDR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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