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VSP01M01ZWDR

Texas Instruments

VSP01M01ZWDR by Texas Instruments

VSP01M01ZWDR by Texas Instruments is a consumer IC with 100 terminals in a square package. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.7V to 3.6V. Suitable for various applications requiring fine pitch and thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,215

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-

-

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Digiode

USA . 2,019 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,019

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 866 parts In-Stock

1+ parts

$1.179

100+ parts

-

1k+ parts

$1.984

10k+ parts

-

866

$1.179

-

$1.984

-

ChromeModa Solutions

Germany . 1,938 parts In-Stock

1+ parts

$1.325

100+ parts

$1.086

1k+ parts

-

10k+ parts

-

1,938

$1.325

$1.086

-

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IDEA Electronic Components Group

UK . 1,388 parts In-Stock

1+ parts

$1.325

100+ parts

-

1k+ parts

$1.192

10k+ parts

-

1,388

$1.325

-

$1.192

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One Stop Electronics

USA . 1,620 parts In-Stock

1+ parts

$17.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,620

$17.800

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-

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AZTECH Wire

Italy . 598 parts In-Stock

1+ parts

$17.839

100+ parts

-

1k+ parts

-

10k+ parts

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598

$17.839

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-

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DigiPath Technology Company

USA . 1,332 parts In-Stock

1+ parts

-

100+ parts

$1.195

1k+ parts

-

10k+ parts

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1,332

-

$1.195

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Corphita

USA . 619 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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619

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Microchip USA

USA . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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290

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Overview

Upgrade your consumer electronics with the VSP01M01ZWDR by Texas Instruments. Manufactured with high-quality materials and advanced technology, this square-shaped grid array IC offers endless possibilities for various applications. From smart home devices to automotive systems, this versatile product provides reliable performance and efficiency. Experience the value of Texas Instruments' expertise and innovation with this cutting-edge solution. Bring your projects to life with the VSP01M01ZWDR and discover a whole new world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the IC, making it suitable for a variety of consumer applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into modern circuit board designs.

Package Shape: SQUARE

Square package shape helps in efficient use of board space and allows for easier placement on the PCB.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring reliability and performance in everyday electronics.

No. of Terminals: 100

High number of terminals offers versatility in connectivity options and allows for more complex circuit designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array, thin profile, and fine pitch package style provides high-density mounting options and enhances overall performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures the IC can withstand demanding operating conditions without performance degradation.

Minimum Operating Temperature: -25 °C

Wide temperature range allows for reliable operation in varying environmental conditions.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish offers good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, making installation straightforward.

Maximum Seated Height: 1.2 mm

Low seated height enables compact device designs and efficient use of space.

Width: 7 mm

Narrow width allows for placement in tight spaces on the PCB, optimizing board layout.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, making it versatile for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for reliable soldering and ensures proper connection to the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and connection integrity during manufacturing processes.

Length: 7 mm

Compact length allows for efficient utilization of board space and ease of placement in compact electronic devices.

Terminal Form: BALL

Ball terminal form offers good solderability and reliable electrical connections, enhancing overall performance.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and precise connections, enhancing overall reliability and performance.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates the IC can withstand moderate moisture exposure during storage and handling.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage allows for versatile power options and ensures compatibility with a wide range of electronics.

Technical Specifications

Other Function Consumer ICs VSP01M01ZWDR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO IT REQUIRES 2.7V TO 3.6V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP01M01ZWDR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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