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UCD90910RGCT

Texas Instruments

UCD90910RGCT by Texas Instruments

UCD90910RGCT by Texas Instruments is a Power Management IC with 64 terminals, operating b/w -40 to 125°C. It has a supply voltage range of 3-3.6V and features an adjustable threshold. This chip carrier is suitable for automotive applications due to its compact size and high temperature tolerance.

Median Price

$11.635

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,522 parts In-Stock

1+ parts

$11.635

100+ parts

$10.163

1k+ parts

$7.009

10k+ parts

-

3,522

$11.635

$10.163

$7.009

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,058 parts In-Stock

1+ parts

$11.053

100+ parts

-

1k+ parts

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1,058

$11.053

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Vyrian

USA . 9,586 parts In-Stock

1+ parts

-

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-

10k+ parts

-

9,586

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 540 parts In-Stock

1+ parts

$2.491

100+ parts

-

1k+ parts

$2.982

10k+ parts

-

540

$2.491

-

$2.982

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DigiPath Technology Company

USA . 968 parts In-Stock

1+ parts

$2.743

100+ parts

$2.524

1k+ parts

-

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968

$2.743

$2.524

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ChromeModa Solutions

Germany . 2,711 parts In-Stock

1+ parts

$2.799

100+ parts

$2.295

1k+ parts

-

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2,711

$2.799

$2.295

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IDEA Electronic Components Group

UK . 1,160 parts In-Stock

1+ parts

$2.799

100+ parts

-

1k+ parts

$2.519

10k+ parts

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1,160

$2.799

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$2.519

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Semicontronic

India . 1,906 parts In-Stock

1+ parts

$9.890

100+ parts

$9.643

1k+ parts

$9.593

10k+ parts

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1,906

$9.890

$9.643

$9.593

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Corphita

USA . 2,223 parts In-Stock

1+ parts

$10.472

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2,223

$10.472

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Corohmni

South Africa . 67 parts In-Stock

1+ parts

$11.635

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67

$11.635

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Ampacity Inc.

Singapore . 1,841 parts In-Stock

1+ parts

$21.520

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1,841

$21.520

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Overview

Experience the superior quality and reliability of Texas Instruments with the UCD90910RGCT Power Management IC. Perfect for a wide range of applications, this chip carrier with heat sink offers customers the ultimate in power supply management circuitry. With a nominal supply voltage of 3.3V and a temperature grade of automotive, this innovative product ensures optimal performance even in extreme conditions. Trust in Texas Instruments for cutting-edge technology that delivers unmatched value and benefits to meet all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic applications, ensuring compatibility with various systems.

No. of Terminals: 64

Having 64 terminals allows for more connectivity options and flexibility in designing power management circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand harsh environmental conditions without impacting performance.

Minimum Operating Temperature: -40 °C

The ability to operate at as low as -40°C makes the product suitable for use in extreme temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation and a compact design, making it ideal for space-constrained applications.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim profile, useful in compact electronic devices.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, the product can operate efficiently across a wide range of voltage inputs.

Terminal Position: QUAD

Quad terminal position provides a balanced layout for better signal integrity and thermal dissipation, enhancing overall performance.

Adjustable Threshold: YES

Having an adjustable threshold allows for customization and fine-tuning of the power management circuit to specific requirements.

Technical Specifications

Power Management ICs UCD90910RGCT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

9 mm

Trade Compliance

UCD90910RGCT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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