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UCC27201ADPRT

Texas Instruments

UCC27201ADPRT by Texas Instruments

UCC27201ADPRT by Texas Instruments is a peripheral driver with a max supply voltage of 17V and built-in under voltage protection. It has a small outline package style, suitable for automotive applications. With a max output current of 3A, it is ideal for driving various loads in electronic systems.

Median Price

$1.690

Lifecycle Status

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Rochester

USA . 6,271 parts In-Stock

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$1.610

100+ parts

$1.580

1k+ parts

$1.550

10k+ parts

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$1.610

$1.580

$1.550

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DigiKey

USA . 369 parts In-Stock

1+ parts

$3.100

100+ parts

$1.913

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369

$3.100

$1.913

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Mouser Electronics

USA . 512 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.690

10k+ parts

$1.500

512

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$1.690

$1.500

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Digiode

USA . 4,010 parts In-Stock

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$1.530

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4,010

$1.530

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Vyrian

USA . 4,731 parts In-Stock

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Bristol Electronics

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200

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Nova Conductors

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10

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Ampacity Inc.

Singapore . 2,345 parts In-Stock

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$1.370

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Corphita

USA . 1,377 parts In-Stock

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$1.449

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1,377

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Parana Technologies

USA . 385 parts In-Stock

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$6.995

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$7.561

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385

$6.995

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$7.561

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DigiPath Technology Company

USA . 716 parts In-Stock

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$7.703

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ChromeModa Solutions

Germany . 5,284 parts In-Stock

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$7.860

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$6.445

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5,284

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$6.445

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IDEA Electronic Components Group

UK . 1,499 parts In-Stock

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$7.860

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$7.074

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1,499

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Corohmni

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Microchip USA

USA . 1,671 parts In-Stock

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$18.150

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$17.890

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$17.760

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$17.630

1,671

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$17.890

$17.760

$17.630

Continental Prestige Electronics

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Argo Parts USA

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Perfect Parts

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Aranea Global

USA . 500 parts In-Stock

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Overview

Discover the UCC27201ADPRT by Texas Instruments, a high-quality peripheral driver that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product is built to last. The UCC27201ADPRT is perfect for a wide range of applications, providing efficient control and protection. Experience the value it brings with its compact design, under voltage protection, and true output polarity. Take advantage of its maximum supply voltage of 17V and maximum output current of 3A. Get the best in class with the UCC27201ADPRT and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made of durable plastic/epoxy material, ensuring its longevity and resistance to wear and tear.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, making it suitable for various applications.

Maximum Supply Voltage: 17 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of power sources, making it versatile and compatible with different systems.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it ideal for applications with limited space.

Built-in Protections: UNDER VOLTAGE

This peripheral driver comes with built-in under voltage protection, ensuring the safety and reliability of connected devices by preventing damage from low voltage conditions.

Power Supplies (V): 12

The power supplies of 12V make it compatible with common voltage sources, offering seamless integration into various systems.

No. of Terminals: 10

With 10 terminals, this peripheral driver provides ample connectivity options, allowing for versatile and flexible usage in different setups.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style offer excellent heat dissipation properties, allowing for efficient operation even in high-temperature environments.

Minimum Supply Voltage: 8 V

The minimum supply voltage of 8V ensures reliable functionality even under low voltage conditions, making it suitable for demanding applications.

Maximum Operating Temperature: 140 °C

With a high maximum operating temperature of 140°C, this peripheral driver can withstand harsh environments, ensuring reliable performance in extreme conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C makes this peripheral driver suitable for use in cold environments, ensuring its functionality in various climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

With dual terminal positions, this peripheral driver offers versatile and flexible connection options, making it compatible with a wide range of setup configurations.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm allows for a compact design, ensuring compatibility with space-constrained applications.

Width: 4 mm

With a width of 4 mm, this peripheral driver has a small form factor, making it suitable for applications where space is limited.

Output Polarity: TRUE

The true output polarity ensures accurate and reliable signal transmission, making it a reliable choice for precise control applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at the peak reflow temperature of 30 seconds, this peripheral driver can withstand high-temperature soldering processes, ensuring ease of manufacturing and assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering and assembly, ensuring a strong and durable connection.

Length: 4 mm

The length of 4 mm provides a compact design, making this peripheral driver suitable for applications where space is at a premium.

Temperature Grade: AUTOMOTIVE

This peripheral driver is designed to meet automotive temperature requirements, making it suitable for use in automotive applications where temperature variations are expected.

Maximum Output Current: 3 A

With a high maximum output current of 3A, this peripheral driver can handle demanding loads, making it suitable for high-performance applications.

No. of Channels: 2

With two channels, this peripheral driver allows for independent control of multiple devices or components, providing versatility and flexibility in system design.

Technology: BICMOS

The BICMOS technology used in this peripheral driver combines the advantages of both bipolar and CMOS technologies, ensuring high-speed operation and low power consumption.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation and connection process, making it user-friendly and convenient.

Maximum Supply Current: 5.5 mA

With a maximum supply current of 5.5 mA, this peripheral driver operates with low power consumption, ensuring energy efficiency.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V provides stability and compatibility with standard power sources, making it a reliable choice for various applications.

Turn-on Time: 0.007 us

The quick turn-on time of 0.007 microseconds ensures fast and responsive operation, making it suitable for time-critical applications.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8 mm, this peripheral driver allows for compact PCB designs, making it ideal for space-constrained applications.

Driver No. of Bits: 2

With 2 driver bits, this peripheral driver provides binary control for connected devices or components, offering precise and accurate operation.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this peripheral driver can withstand standard moisture exposure, ensuring its reliability during handling and storage.

Nominal Output Peak Current Limit: 3 A

The nominal output peak current limit of 3A ensures safe operation by preventing excessive current flow, protecting connected devices or components.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The interface IC type of a half bridge-based peripheral driver offers efficient and reliable power delivery to connected devices or components, making it suitable for various applications.

Turn-off Time: 0.007 us

The quick turn-off time of 0.007 microseconds allows for precise control and modulation of output signals, offering enhanced performance and functionality.

Output Current Flow Direction: SOURCE AND SINK

This peripheral driver allows for both source and sink output current flow, providing versatility and compatibility with various load configurations.

Technical Specifications

Peripheral Drivers UCC27201ADPRT attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Additional Features:

HTTP://WWW.TI.COM/LIT/ML/MPSS046A/MPSS046A.PDF

Built-in Protections:

UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

140 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Maximum Output Current:

3 A

Nominal Output Peak Current Limit:

3 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.16,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

17 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.007 us

Turn-on Time:

.007 us

Width:

4 mm

Trade Compliance

UCC27201ADPRT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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