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UCC27201DR

Texas Instruments

UCC27201DR by Texas Instruments

UCC27201DR by Texas Instruments is a half bridge peripheral driver with 2 channels, capable of handling up to 3A output current. It operates in automotive temperature grade range (-40 to 140°C) and has built-in under voltage protection. This small outline package (4.9mm x 3.9mm) is ideal for applications requiring true output polarity control and source/sink current flow direction.

Median Price

$2.600

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,912 parts In-Stock

1+ parts

$1.400

100+ parts

$1.370

1k+ parts

$1.340

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6,912

$1.400

$1.370

$1.340

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Texas Instruments

USA . 37,850 parts In-Stock

1+ parts

$1.792

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$1.480

1k+ parts

$0.800

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37,850

$1.792

$1.480

$0.800

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Chip1Stop

Japan . 2,270 parts In-Stock

1+ parts

$2.600

100+ parts

$1.660

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2,270

$2.600

$1.660

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DigiKey

USA . 3,228 parts In-Stock

1+ parts

$2.610

100+ parts

$1.596

1k+ parts

$1.412

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$1.325

3,228

$2.610

$1.596

$1.412

$1.325

Mouser Electronics

USA . 419 parts In-Stock

1+ parts

$2.610

100+ parts

$1.600

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$1.460

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419

$2.610

$1.600

$1.460

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.230

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-

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100

$1.230

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Maritex

Poland . 362 parts In-Stock

1+ parts

$1.298

100+ parts

$0.685

1k+ parts

$0.525

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362

$1.298

$0.685

$0.525

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Digiode

USA . 4,511 parts In-Stock

1+ parts

$1.330

100+ parts

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4,511

$1.330

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Chip Stock

USA . 42,188 parts In-Stock

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Cyclops Electronics Ltd

UK . 35,500 parts In-Stock

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Vyrian

USA . 11,382 parts In-Stock

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Semtec, LLC

USA . 50 parts In-Stock

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50

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Bristol Electronics

USA . 38 parts In-Stock

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38

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,508 parts In-Stock

1+ parts

$1.190

100+ parts

-

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11,508

$1.190

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Argo Parts USA

USA . 3,836 parts In-Stock

1+ parts

$1.230

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3,836

$1.230

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Continental Prestige Electronics

USA . 1,973 parts In-Stock

1+ parts

$1.230

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$1.205

1,973

$1.230

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$1.205

Corphita

USA . 1,888 parts In-Stock

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$1.260

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1,888

$1.260

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Parana Technologies

USA . 2,130 parts In-Stock

1+ parts

$4.454

100+ parts

$413.663

1k+ parts

$4.009

10k+ parts

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2,130

$4.454

$413.663

$4.009

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DigiPath Technology Company

USA . 1,805 parts In-Stock

1+ parts

$4.905

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1,805

$4.905

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ChromeModa Solutions

Germany . 2,772 parts In-Stock

1+ parts

$5.005

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$4.104

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2,772

$5.005

$4.104

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IDEA Electronic Components Group

UK . 618 parts In-Stock

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$5.005

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$4.504

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618

$5.005

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$4.504

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Perfect Parts

USA . 19,603 parts In-Stock

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A-Z Elektronik GmbH

Germany . 17,121 parts In-Stock

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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Lixinc

USA . 13,005 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Authorized Procurement Solutions

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S.R.D Solutions

India . 3,000 parts In-Stock

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Component Stockers USA

USA . 1,911 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.205

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$1.168

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$1.144

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$1.168

$1.144

Kepictronics

USA . 48 parts In-Stock

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48

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Overview

Enhance your electronic designs with the UCC27201DR by Texas Instruments, a high-quality peripheral driver that offers exceptional value and benefits to customers. Manufactured by industry leader Texas Instruments, this product provides reliable performance and built-in protections, making it ideal for a wide range of applications. With a compact package style and versatile technology, the UCC27201DR is perfect for automotive and other demanding environments. Trust Texas Instruments for cutting-edge solutions that deliver superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 17 V

Can handle high voltage requirements, ensuring compatibility with a wide range of systems.

Built-in Protections: UNDER VOLTAGE

Ensures the stability and reliability of the peripheral driver by protecting against under voltage situations.

Maximum Output Current: 3 A

Capable of driving high current loads, making it suitable for demanding applications.

Maximum Operating Temperature: 140 °C

Can operate in high temperature environments without performance degradation.

Technology: BICMOS

Utilizes BiCMOS technology for efficient operation and low power consumption.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Utilizes a half-bridge interface IC design for improved performance and control.

Technical Specifications

Peripheral Drivers UCC27201DR attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

140 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Maximum Output Current:

3 A

Nominal Output Peak Current Limit:

3 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

17 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

UCC27201DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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