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UC2903QTRG3

Texas Instruments

UC2903QTRG3 by Texas Instruments

UC2903QTRG3 by Texas Instruments is a Power Management IC with 20 terminals, operating at -40 to 85 °C. It has a supply voltage range of 8-40 V and supports 4 channels. This BIPOLAR technology chip carrier is ideal for industrial applications requiring power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,145 parts In-Stock

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3,145

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Digiode

USA . 1,556 parts In-Stock

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1,556

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,567 parts In-Stock

1+ parts

$2.500

100+ parts

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1,567

$2.500

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Semicontronic

India . 183 parts In-Stock

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$2.500

100+ parts

$2.438

1k+ parts

$2.425

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183

$2.500

$2.438

$2.425

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Parana Technologies

USA . 1,039 parts In-Stock

1+ parts

$2.804

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-

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$3.288

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1,039

$2.804

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$3.288

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DigiPath Technology Company

USA . 1,908 parts In-Stock

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$3.087

100+ parts

$2.840

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1,908

$3.087

$2.840

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ChromeModa Solutions

Germany . 6,745 parts In-Stock

1+ parts

$3.150

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$2.583

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6,745

$3.150

$2.583

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IDEA Electronic Components Group

UK . 1,605 parts In-Stock

1+ parts

$3.150

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$2.835

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1,605

$3.150

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$2.835

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One Stop Electronics

USA . 972 parts In-Stock

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$4.500

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972

$4.500

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AZTECH Wire

Italy . 556 parts In-Stock

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$17.906

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556

$17.906

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$20.894

100+ parts

$20.685

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$19.849

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300

$20.894

$20.685

$19.849

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Microchip USA

USA . 4,532 parts In-Stock

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Corphita

USA . 1,524 parts In-Stock

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Corohmni

South Africa . 305 parts In-Stock

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305

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Overview

Upgrade your power management system with the UC2903QTRG3 from Texas Instruments. Crafted with precision and excellence, this power management IC offers unparalleled reliability and efficiency for a wide range of applications. With its cutting-edge technology and industrial-grade performance, this chip carrier package provides customers with high-quality power supply support circuitry. Experience seamless operation and peace of mind knowing that your power management needs are in good hands with the UC2903QTRG3. Elevate your systems to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the power management IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage (Vsup): 15 V

Well-suited for applications requiring a stable 15V power supply.

No. of Channels: 4

Offers multiple channels for efficient power management and distribution.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it versatile for various operating conditions.

Technology: BIPOLAR

Bipolar technology provides high performance and reliability for power management applications.

Technical Specifications

Power Management ICs UC2903QTRG3 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.965 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.965 mm

Trade Compliance

UC2903QTRG3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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