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UC2903J

Texas Instruments

UC2903J by Texas Instruments

UC2903J by Texas Instruments is a Power Management IC with 18 terminals, operating voltage range of 8-40V. It features adjustable threshold, suitable for industrial applications requiring up to 15mA supply current. The IC's bipolar technology and glass-sealed ceramic package make it ideal for power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,185 parts In-Stock

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Digiode

USA . 3,268 parts In-Stock

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PAR Electronics

UK . 14 parts In-Stock

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DF Sales Co.

USA . 5 parts In-Stock

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DF Sales Co.

USA . 5 parts In-Stock

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Ampacity Inc.

Singapore . 587 parts In-Stock

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$4.500

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One Stop Electronics

USA . 149 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 805 parts In-Stock

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$17.139

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805

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Parana Technologies

USA . 1,591 parts In-Stock

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$21.238

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$21.538

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ChromeModa Solutions

Germany . 5,102 parts In-Stock

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$23.863

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$19.568

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IDEA Electronic Components Group

UK . 1,873 parts In-Stock

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$23.863

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$22.670

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$21.477

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Corphita

USA . 4,649 parts In-Stock

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DigiPath Technology Company

USA . 1,126 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 427 parts In-Stock

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Overview

Enhance your power management capabilities with the Texas Instruments UC2903J, a high-quality Power Management IC designed to provide efficient and reliable performance. Manufactured by industry leader Texas Instruments, this IC offers exceptional value and benefits for a wide range of applications. Whether you're looking to optimize power supply support circuits or enhance overall system efficiency, the UC2903J delivers unparalleled advantages with its advanced technology and versatile design. Trust in Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components of the Power Management IC, ensuring long-term reliability in various environmental conditions.

Nominal Supply Voltage (Vsup): 15 V

Suitable for applications requiring a stable supply voltage within the 8-40V range, allowing for flexibility in power management setups.

No. of Terminals: 18

Offers multiple connection points for efficient power distribution and control, accommodating complex power supply requirements.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making it a suitable choice for industrial applications.

Technology: BIPOLAR

Utilizes bipolar technology for efficient power regulation and management, providing stable and consistent output voltage levels.

Maximum Supply Voltage (Vsup): 40 V

Supports a wide range of input voltage levels, allowing for versatility in power supply designs and compatibility with various power sources.

Technical Specifications

Power Management ICs UC2903J attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-GDIP-T18

Length:

22.606 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC2903J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-231-8313, 5962012318313, 5962-01-376-0012, 5962013760012

NIIN

012318313, 013760012

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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