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UC2903DW

Texas Instruments

UC2903DW by Texas Instruments

UC2903DW by Texas Instruments is a Power Management IC with 18 terminals, Vsup range of 8-40V, and operating temp from -40 to 85°C. Ideal for power supply support circuits in industrial applications due to its adjustable threshold voltage and small outline package style.

Median Price

$7.210

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 61 parts In-Stock

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-

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$7.210

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$6.450

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$6.070

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$6.450

$6.070

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Digiode

USA . 132 parts In-Stock

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$7.628

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Nova Conductors

Japan . 1,000 parts In-Stock

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Component Sense

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LWI Electronics Inc

India . 77 parts In-Stock

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Vyrian

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Mil-Aero Solutions, Inc.

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NPI Materials, Inc.

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Zilex Electronics Inc.

Canada . 18 parts In-Stock

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ComSIT Distribution GmbH

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Corohmni

South Africa . 174 parts In-Stock

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$3.352

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Parana Technologies

USA . 511 parts In-Stock

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$3.516

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$4.040

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$3.516

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ChromeModa Solutions

Germany . 2,395 parts In-Stock

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$3.950

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$3.239

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IDEA Electronic Components Group

UK . 137 parts In-Stock

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$3.950

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$3.555

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Corphita

USA . 4,979 parts In-Stock

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$7.227

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Component Stockers USA

USA . 1,204 parts In-Stock

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$8.020

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$7.540

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AZTECH Wire

Italy . 842 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Argo Parts USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,097 parts In-Stock

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Perfect Parts

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Kepictronics

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DigiPath Technology Company

USA . 1,124 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

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Glotronic Ltd.

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Assy Fe

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Overview

Enhance your power management capabilities with the Texas Instruments UC2903DW, a top-quality Power Management IC that offers unparalleled reliability and performance. With Texas Instruments' reputation for excellence in manufacturing, this device is sure to exceed your expectations. Ideal for a wide range of applications, this small outline package delivers exceptional value, benefits, and advantages to customers seeking efficient power supply support circuits. Upgrade your systems today with the UC2903DW and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability and affordability.

Nominal Supply Voltage (Vsup): 15 V

Suitable voltage range for various power management applications, providing flexibility.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environmental conditions.

No. of Terminals: 18

Sufficient number of terminals for connecting multiple components, enhancing functionality.

Technology: BIPOLAR

Bipolar technology offers high performance and efficiency in power management applications.

Maximum Supply Voltage (Vsup): 40 V

High supply voltage capacity allows for handling of higher power requirements.

Technical Specifications

Power Management ICs UC2903DW attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e4

Length:

11.55 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

1.8

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

UC2903DW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-456-1085, 5962014561085, 5962-01-543-6864, 5962015436864

NIIN

014561085, 015436864

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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