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TXU0304DTRR

Texas Instruments

TXU0304DTRR by Texas Instruments

TXU0304DTRR by Texas Instruments is a 4-bit bus driver with 12 terminals, operating at -40 to 125 °C. It features a propagation delay of 60 ns, output polarity TRUE, and Schmitt Trigger for applications requiring ENABLE HIGH control in a compact package style suitable for surface mount assembly.

Median Price

$0.990

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 369,604 parts In-Stock

1+ parts

$0.618

100+ parts

$0.475

1k+ parts

$0.250

10k+ parts

-

369,604

$0.618

$0.475

$0.250

-

DigiKey

USA . 3,925 parts In-Stock

1+ parts

$0.990

100+ parts

$0.564

1k+ parts

$0.488

10k+ parts

$0.449

3,925

$0.990

$0.564

$0.488

$0.449

Mouser Electronics

USA . 1,366 parts In-Stock

1+ parts

$0.990

100+ parts

$0.565

1k+ parts

$0.488

10k+ parts

$0.454

1,366

$0.990

$0.565

$0.488

$0.454

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$0.324

100+ parts

-

1k+ parts

-

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-

56

$0.324

-

-

-

Digiode

USA . 2,407 parts In-Stock

1+ parts

$0.587

100+ parts

-

1k+ parts

-

10k+ parts

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2,407

$0.587

-

-

-

Vyrian

USA . 125,863 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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125,863

-

-

-

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Chip Stock

USA . 16,080 parts In-Stock

1+ parts

-

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16,080

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,595 parts In-Stock

1+ parts

$0.324

100+ parts

-

1k+ parts

-

10k+ parts

$0.314

4,595

$0.324

-

-

$0.314

Continental Prestige Electronics

USA . 3,668 parts In-Stock

1+ parts

$0.324

100+ parts

-

1k+ parts

-

10k+ parts

$0.318

3,668

$0.324

-

-

$0.318

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.324

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.324

-

-

-

Ampacity Inc.

Singapore . 125,927 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

-

10k+ parts

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125,927

$0.530

-

-

-

Semicontronic

India . 125,681 parts In-Stock

1+ parts

$0.530

100+ parts

$0.517

1k+ parts

$0.514

10k+ parts

-

125,681

$0.530

$0.517

$0.514

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Corphita

USA . 3,794 parts In-Stock

1+ parts

$0.556

100+ parts

-

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10k+ parts

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3,794

$0.556

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-

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$5.444

100+ parts

$5.171

1k+ parts

$5.171

10k+ parts

-

150

$5.444

$5.171

$5.171

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Parana Technologies

USA . 117 parts In-Stock

1+ parts

$11.306

100+ parts

$1,049.903

1k+ parts

$10.175

10k+ parts

-

117

$11.306

$1,049.903

$10.175

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DigiPath Technology Company

USA . 2,262 parts In-Stock

1+ parts

$12.449

100+ parts

$11.453

1k+ parts

-

10k+ parts

-

2,262

$12.449

$11.453

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-

IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$12.703

100+ parts

$12.068

1k+ parts

$11.433

10k+ parts

-

2,012

$12.703

$12.068

$11.433

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ChromeModa Solutions

Germany . 993 parts In-Stock

1+ parts

$12.703

100+ parts

$10.416

1k+ parts

-

10k+ parts

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993

$12.703

$10.416

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Corohmni

South Africa . 81 parts In-Stock

1+ parts

$16.142

100+ parts

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81

$16.142

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,000

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Overview

Enhance your electronic designs with the TXU0304DTRR by Texas Instruments, a top-quality Bus Driver & Transceiver offering unparalleled reliability and performance. Manufactured by a trusted industry leader, this product is versatile and ideal for a wide range of applications. From its durable plastic/epoxy package body to its 3-STATE output characteristics, this chip carrier delivers exceptional value to customers looking for a compact and efficient solution. Explore the benefits of the TXU0304DTRR and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making it ideal for use in buses and transceivers.

Surface Mount: YES

This feature allows for easy installation and maintenance of the product.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and makes it easy to integrate into existing systems.

No. of Bits: 4

This product has a high number of bits, allowing for precise and accurate data transmission.

Nominal Supply Voltage: 1.1 V

The low supply voltage makes this product energy-efficient and cost-effective.

Load Capacitance: 5 pF

The low load capacitance ensures fast and reliable signal transmission.

No. of Terminals: 12

With 12 terminals, this product offers versatile connectivity options.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The thin profile of this chip carrier makes it suitable for compact applications.

Maximum I (ol): 12 Amp

The high output current allows for the driving of multiple components simultaneously.

Propagation Delay: 60 ns

The low propagation delay ensures quick response times in data transmission.

Maximum Operating Temperature: 125 °C

This wide temperature range makes the product suitable for various operating environments.

Output Characteristics: 3-STATE

The 3-state output allows for multiple devices to share the same bus without interference.

Minimum Operating Temperature: -40 °C

This product can operate in extremely cold temperatures, making it suitable for all climates.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for easy connection to external devices.

No. of Ports: 2

With 2 ports, this product offers dual connectivity options.

Maximum Seated Height: 0.4 mm

The low seated height makes this product suitable for applications with limited space.

Width: 1 mm

The narrow width of the product allows for efficient use of space on circuit boards.

Output Polarity: TRUE

The true output polarity ensures compatibility with various systems.

Minimum Supply Voltage: 1.08 V

This low minimum supply voltage ensures reliable operation even at low power levels.

Peak Reflow Temperature: 260 C

The high peak reflow temperature ensures durability during manufacturing processes.

Length: 1.7 mm

The compact length of the product makes it suitable for space-constrained applications.

Schmitt Trigger: YES

The Schmitt trigger feature helps in cleaning up noisy signals for accurate data transmission.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and easy to work with during installation.

Packing Method: TR, 7 INCH

The tube packing method ensures safe transportation and storage of the product.

Count Direction: UNI/BIDIRECTIONAL

This product supports both uni and bidirectional data transmission.

Control Type: ENABLE HIGH

The enable high control type allows for seamless integration with other components.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage makes this product versatile and compatible with various systems.

Maximum Power Supply Current: 0.0055 mA

The low power supply current ensures energy efficiency and longevity of the product.

Technical Specifications

Bus Driver & Transceivers TXU0304DTRR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNI/BIDIRECTIONAL

Family:

TXU

JESD-30 Code:

R-PQCC-N12

Length:

1.7 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.0055 mA

Propagation Delay (tpd):

60 ns

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.08 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Width:

1 mm

Trade Compliance

TXU0304DTRR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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