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TXU0101QDCKRQ1

Texas Instruments

TXU0101QDCKRQ1 by Texas Instruments

TXU0101QDCKRQ1 by Texas Instruments is a bus driver & transceiver with 1 function. It has a nominal voltage of 1.1V and a max operating temperature of 125°C. This component is commonly used in automotive applications due to its AEC-Q100 screening level and small package size.

Median Price

$0.600

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 362,276 parts In-Stock

1+ parts

$0.542

100+ parts

$0.369

1k+ parts

$0.189

10k+ parts

-

362,276

$0.542

$0.369

$0.189

-

DigiKey

USA . 2,590 parts In-Stock

1+ parts

$0.600

100+ parts

$0.333

1k+ parts

$0.284

10k+ parts

$0.260

2,590

$0.600

$0.333

$0.284

$0.260

Mouser Electronics

USA . 4,380 parts In-Stock

1+ parts

$0.800

100+ parts

$0.450

1k+ parts

$0.398

10k+ parts

$0.358

4,380

$0.800

$0.450

$0.398

$0.358

Distributors (In-Stock)

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Digiode

USA . 1,537 parts In-Stock

1+ parts

$0.515

100+ parts

-

1k+ parts

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10k+ parts

-

1,537

$0.515

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-

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Vyrian

USA . 122,752 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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122,752

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Nova Conductors

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54

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 122,938 parts In-Stock

1+ parts

$0.461

100+ parts

-

1k+ parts

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10k+ parts

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122,938

$0.461

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Corphita

USA . 2,931 parts In-Stock

1+ parts

$0.488

100+ parts

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10k+ parts

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2,931

$0.488

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Corohmni

South Africa . 402 parts In-Stock

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$14.928

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1k+ parts

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402

$14.928

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Argo Parts USA

USA . 4,817 parts In-Stock

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4,817

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Continental Prestige Electronics

USA . 1,008 parts In-Stock

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1,008

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Aranea Global

USA . 100 parts In-Stock

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100+ parts

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100

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Overview

Discover the TXU0101QDCKRQ1 by Texas Instruments, a high-quality bus driver and transceiver that takes your applications to the next level. Manufactured by Texas Instruments, a trusted name in the industry, this product offers unbeatable value and benefits. With its small outline and thin profile, it is perfect for space-constrained designs. The TXU0101QDCKRQ1 features true output polarity and Schmitt trigger, ensuring reliable performance. Its wide operating temperature range and robust design make it suitable for various environments. Experience seamless connectivity and enhanced efficiency with the TXU0101QDCKRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance to wear, making it a reliable choice for bus driver and transceivers.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, making it convenient for electronic applications requiring bus driver and transceivers.

No. of Functions: 1

With a single function, this product simplifies the design and reduces complexity, ensuring efficient performance in bus driver and transceiver applications.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets rigorous automotive industry standards, making it suitable for bus driver and transceiver solutions requiring high reliability.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility and ease of use, facilitating the integration of the bus driver and transceiver into various electronic systems.

No. of Bits: 1

Featuring a single bit, this product is designed to handle simple data transmission tasks, making it suitable for basic communication requirements in bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 1.1

The 1.1V nominal supply voltage enables efficient power utilization, allowing the bus driver and transceiver to operate effectively while conserving energy.

Load Capacitance (CL): 5 pF

The 5pF load capacitance ensures optimal signal transmission and reception, enhancing the overall performance and reliability of the bus driver and transceiver.

No. of Terminals: 6

With six terminals, this product offers flexibility in connectivity options and allows for a variety of configurations, making it versatile for different bus driver and transceiver applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style optimize space utilization and provide compactness, making it well-suited for space-constrained environments.

Maximum I (ol): 12 Amp

The maximum output current of 12 Amp allows for efficient power transfer, making this product a reliable choice for bus driver and transceiver applications with high current requirements.

Propagation Delay (tpd): 96 ns

With a propagation delay of 96 ns, this product ensures fast and reliable signal transmission, minimizing latency and maximizing data transfer efficiency in bus driver and transceiver systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh environments, making this product suitable for demanding bus driver and transceiver applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide additional flexibility in controlling and managing the signals, allowing this product to effectively handle various bus driver and transceiver functions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is capable of functioning in extreme cold conditions, making it suitable for bus driver and transceiver applications in challenging environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance, ensuring reliable signal transmission and longevity of the bus driver and transceiver.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connection, enhancing the stability and performance of the bus driver and transceiver in various applications.

No. of Ports: 2

With two ports, this product provides flexibility in connecting to multiple devices or systems, enabling efficient communication and data transfer in bus driver and transceiver applications.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1 mm allows for a compact and space-efficient design, making this product ideal for small form factor bus driver and transceiver solutions.

Width: 1.25 mm

The narrow width of 1.25 mm ensures compatibility with tight layout designs, providing versatility and ease of integration into various bus driver and transceiver applications.

Output Polarity: TRUE

The TRUE output polarity ensures accurate signal transmission and reception, enabling reliable data communication in bus driver and transceiver systems.

Minimum Supply Voltage (Vsup): 1.08 V

With a minimum supply voltage of 1.08V, this product offers compatibility with low-voltage systems, making it suitable for power-efficient bus driver and transceiver applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering during manufacturing processes, guaranteeing the reliability and durability of the bus driver and transceiver.

Length: 2 mm

The compact length of 2 mm allows for efficient space utilization, making this product suitable for miniaturized bus driver and transceiver solutions.

Schmitt Trigger: YES

The presence of a Schmitt trigger enables reliable and noise-immune signal processing, enhancing the performance and stability of the bus driver and transceiver in various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and strong connections, ensuring reliable signal transmission and reducing the risk of electrical failures in bus driver and transceiver systems.

Packing Method: TR, 7 INCH

The packing method of TR, 7 inch offers convenience and protection during transportation and storage, ensuring the integrity and quality of the bus driver and transceiver units.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables precise and compact circuit board layout, allowing for high-density integration of bus driver and transceiver components.

Count Direction: UNI/BIDIRECTIONAL

The dual count direction capability (uni/bidirectional) provides flexibility in managing data flow, making this product suitable for a wide range of bus driver and transceiver applications.

Control Type: ENABLE HIGH

The enable high control type allows for efficient management and activation of the bus driver and transceiver functions, providing flexibility and versatility in system integration.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product exhibits low moisture absorption and ensures reliability during storage and operation in bus driver and transceiver applications.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources, making this product suitable for various bus driver and transceiver systems.

Maximum Power Supply Current (ICC): 0.0055 mA

With a maximum power supply current of 0.0055 mA, this product offers energy-efficient operation, minimizing power consumption in bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers TXU0101QDCKRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNI/BIDIRECTIONAL

Family:

TXU

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.0055 mA

Propagation Delay (tpd):

96 ns

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.08 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

TXU0101QDCKRQ1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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